Brizon Inc is a USA-based company that produces microelectronic application products including CMP slurry additives, CMP cleaning solutions, and wafer storage buffer solutions. Their key products are Brite-ACP slurry additives that improve CMP efficiency and surface quality, and BriteClean-0 and BriteClean-1 cleaning solutions that improve post-CMP cleanliness and protect wafer surfaces. Test results show the Brizon products reduce particles, improve uniformity, and provide better surface roughness compared to competitors' products. Brizon's customized solutions and technical support help customers achieve better yield and process results.

1. Brizon Inc (USA):
www.brizon.net
Yuxinhu@brizon.net

2. Products:
• Microelectronic Application
•
•
•
CMP Slurry additive
CMP cleaning Solutions
Wafer Storage Buffer Solution
• Smart Curable Products
•
Flexible Screen Application
•
LED Application
•
High Temperature Resistance
•
And low IR emission Application

3. Products for the Semiconductor Industry:
Brite-ACP : Slurry Additives to improve performance.
•
•
•
Stabilize Slurry and Improve CMP efficiency
Reduce and/or Eliminate macro/micro scratches
Improve Uniformity of material removal
BriteClean-0 : CMP cleaning process
BriteClean-1 : CMP cleaning process
•
•
•
•
Improves post process surface cleanliness for particles and surface residuals.
Improves next layer of deposition
Protects both Metal and Oxide surfaces
Improves wafer Rinsability

4. Components
• Non-ionic surfactants
• Metal inhibitors
• Anti-oxidant agents
• Chelating agent
• Particle removing agent

5. Microelectronic application - CMP
Briteclean - 0/Plus
Briteclean - 1
Briteclean-ACP
Pre/Post
Cleaning Process
YES
YES
YES
Slurry Additives
YES
YES
YES
Storage/Buffer
NO
NO
YES
Need to mixing
Need to mixing
with BC-0/plus
Solely
2% - 5%
2% - 5%
1% - 4%
Application with BC-1 or BC-ACP
Usage

6. Examples of Application in Real Field FAB
 Briteclean-0 and Briteclean-1 Mixed: Ratio 1:1 in 1.0% ~2% Aqueous media
 Slurry applied: in MH837/MH834/MH814 (Cabot)
 Pad applied: IC1000 (white pad --- Rodel/(Rom Haas)
Sub IV (black pad --- Rodel (Rom Haas))
 Tool platforms Applied: 8" Mirra (Applied Materials); 8"
Ebara (Ebara); 8" 6DS-SP(Strausbaugh)
 Wafer: Cu, Ni/Fe, Low key and Al2O3

7. • Yield Improvement – Very dramatically
•
•
•
Improved within (WIW) wafer uniformity by ~1X
Enhanced Cleanliness
Improved Surface Roughness (NiFe<1nm)
• No need Additional Process
•
Flexible condition
• Environmental Friendly
•
No corrosive, no high or very pH

8. Layer X CMP Comparison
Layer X CMP Performance Comparison
Wafer ID Existing
Slurry
1
2
3
4
5
6
7
8
Mean Metal
ALO
Thickness
Metal WIW Thickness
Oxide WIW Added
(FEI)-O
Sigma-O
(Nano)-O
Sigma-O
Paticles
261
7.3
267
10.2
217
257
8.1
261
8.2
198
265
2.4
273
3.6
229
263
8.3
268
9.4
363
251
6.1
261
7.5
107
278
5.9
283
6.9
267
255
6.9
267
8.1
271
263
7.2
267
7.8
400
Mean
Std. Dev.
3 Sigma
261.63
7.60
22.79
6.53
1.75
5.24
268.38
6.61
19.84
7.71
1.84
5.52
256.50
86.85
260.55
278
251
27
8.3
2.4
5.9
283
261
22
10.2
3.6
6.6
400
107
293
Max.
Min.
Range
Mean Metal Thickness (FEI)-O
Wafer ID
with Brite
Additives
1
2
3
4
5
6
7
8
Mean Metal
ALO
Thickness
Metal WIW Thickness
Oxide WIW Added
(FEI)-B
Sigma-B
(Nano)-B
Sigma-B
Paticles
263
3
249
2.7
30
251
4
267
2.1
0
265
4.2
253
3
139
256
2.9
263
1.9
271
258
3.1
262
2.4
0
261
3.3
262
2.9
225
260
4.1
261
2
57
266
2.8
265
2.5
68
Mean
Std. Dev.
3 Sigma
260.00
4.64
13.91
3.43
0.54
1.63
260.25
5.72
17.15
2.44
0.39
1.16
98.75
96.27
288.82
266
251
15
4.2
2.8
1.4
267
249
18
3
1.9
1.1
271
0
271
Max.
Min.
Range
Metal WIW Sigma-O
Mean Metal Thickness (FEI)-B
Metal WIW Sigma-B
9
285
280
8
275
7
270
6
265
5
260
4
255
3
250
245
2
240
1
235
0
1
2
3
4
5
6
ALO Thickness (Nano)-O
7
8
9
10
1
2
3
4
5
6
7
8
9
10
ALO Thickness (Nano)-B
Oxide WIW Sigma-O
290
Oxide WIW Sigma-B
12
280
10
270
8
260
6
250
4
240
2
230
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10

9. Comparing SEM images of Silicon wafer surface
Slurry only
Slurry +
Brizon products

10. Principle of Slurry Additive
for CMP Applications
 Slurry distribution on polishing pads is a critical factor
to achieve better WIW uniformity
 Adding Brizon products into CMP slurries, the slurry
surface extension with IC series CMP pads was
modified to a form a uniformed slurry layer across the
whole wafer
Slurry Feed
Wafer
IC CMP Pad

11. Surf-Clean Data
For Competitor’s Clean Solution
Pre-Treatment
NiFe
Alumina
Post-Treatment

12. Surf-Clean Data
For Mixed BriteClean Solution
Pre-Treatment
NiFe
Alumina
Post-Treatment

13. Different Slurry Cleanability of
BriteClean vs Competitor’s
BriteClean mixed Solution
Con-1
Con-2
Alumina
-70
-22
NiFe
-66
-340
Competitor's Cleaning Solution
Con-1
Con-2
Alumina
190
1571
Particle Counts
NiFe
280
370

14. Different Method Cleanability of
BriteClean vs Competitor’s
BriteClean mixed Solution
Roller
Pencil
Alumina
10
-10
NiFe
24
-6
Competitor's Cleaning Solution
Roller
Pencil
Alumina
318
190
Particle Counts
NiFe
2985
280

15. BriteClean Mixture Initial
Cleaning Solution (Pre-)
Post
(PostCleaning Pre)
Tool-1
259
268
9
Tool-2
692
640
-52
Tool-3
675
123
-552
Tool-4
207
78
-129
Competitor's
Cleaning Solution
Initial
(Pre-)
Tool-1
477
1445
968
Tool-2
891
3065
2174
Tool-3
133
528
395
Tool-4
500
845
345
Alumina
NiFe
Alumina
NiFe
Post
(PostCleaning Pre)

16. Principle of Cleaning Process
for CMP Applications
 Slurry
Dissolved/Dispersed into Advanced
Nonionic Surfactants, Slurry Chemistry
 Trace Metals
Dispersed into Advanced
Nonionic Surfactants
 Metal Ions
Complex to Chelate in
the Cleaning System
 Aggressive
Corrosive
High/Low pH
Buffered by the Cleaning Solution

17. Post CMP&Cleaning AFM images (Cu plated wafer)
BriteClean Mixture
Competitor’s Cleaning Solution

18. Post CMP&Cleaning AFM images (Cu plated wafer)
BriteClean Mixture
Average Roughness(N=3x3):
Rms=0.29nm
Competitor’s Cleaning Solution
Average Roughness(N=3x3):
Rms=0.34nm
Roughness is better, surface residuals reduced.

19. Wafer Storage Buffer Solution-ACP
 One customer request an application
 Store the wafer in DI water, but surface materials was
etched, both metal and Oxide
 Designed Brite-ACP, and currently is customer’s
production
 No etching on surface materials up to 6hours in DI water
 No detailed data was provided by customer

20. Principle of Prevention Processing
 Mono-layer
on Surface
Prevents Redeposition of
Any Contamination and
Prevents Any Oxidation
 Hydrophobic/Hydrophilic Balanced of the Mono-layer
Improve Rinsability

21. Sensor Circuit Measurement
 Sensor dimension was designed per different usages.
 4-point scheme minimizes contact resistance during probing
21

22. Sensitivity Measurement Trend Chart
Brit
Briteclean products
Competitor’s products

23. Conclusion – Advantages of Brite Slurry Add
• Stabilize slurry and efficient CMP
• Distribute Slurry uniformity to polishing pad
• Improve WIW uniformity

24. Conclusion-Advantages of BriteClean
Briteclean mixture reduces particle counts
•
Efficient cleaning process
Much better surface roughness
•
Surface protection
 Much easier Process
• Mixture system
• No need change process

25. Conclusion – Advantages of Brite ACP
• Stabilize slurry and efficient CMP
• Protect oxidation on metal wafer
• Improve next layer of deposition

26. Thanks !
Questions on the Brizon Products?
Contact us @ Brizon.net

27. Backup

28. A Plethora of Materials
In Semiconductor Area
•
•
•
•
•
•
•
•
Oxide, such as Al2O3
Colloidal SiO2
NiFeCo
Cu, Al, W
Polymers
Ru
Si
Et al

29. Background of Briteclean
 Innovative Technology




Longer shelf life - over two years
Much easier control processes and environments
Much more efficient for the cleaning process
One process fit more applications
 One Process with Briteclean(s) Can Clean all
 Alumina
 NiFeCo, Cu abrasives
 CeO abrasives
 Colloidal SiO2
 Et al

30. Background of Briteclean Products
•
Hydrophobic-hydrophilic balance
•
Unique dispersion agents
•
Surface modified slurry
•
Monolayer of anti-oxidant
•
Anti-corrosive

31. Customer Testing Platform
BriteClean vs Competitor's
 Full NiFe, Cu and Alumina
 Particle Counts were measured by Tencor Surf scan
 Various Cleaning Tools were used
Including Mirra, SSEC, DNS

32. BriteClean-0
BriteClean-1
Clear Transparent Aqueous
Light Yellow Transparent Aqueous
pH=5.00±0.30
pH=8.40±0.30
Two Years Shelf life

33. pH Changes vs the Ratio of
BriteClean-0/BriteClean-1
8.5
8
7.85
7.5
7.2
7
pH
6.8
6.5
6.3
5.5
5
0
100%
BriteClean-1
10
20
30
40
50
60
70
Diluted 50 times in DI H2O
80
90
100
100%
BriteClean-0
Recommended Application: Briteclean-0/Briteclean-1 = 1:1
Diluted to 2%-5% times with DI H2O

34. Particle Count/Roughness vs Ration of BC-0/BC-1
Particle count
Roughness
2500
0.3
2258
1500
Particle
1000
500
Roughness(nm)
Particle count
2000
0.27
0.26
0.25
0.2
0.15
Roughness
0.13
0.1
0.05
114
107
0
0
0
10
20
30
40
50
60
70
BriteClean-1 100%
80
90
100
BriteClean-0 100%
Mixing ratio (Briteclean--0/1)%
On NiFe wafer
0
10
20
30
40
50
60
70
BriteClean-1 100%
80
90
100
BriteClean-0 100%
Mixing ratio (Briteclean--0/1)%