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Silicon processing and Semiconductor Manufacturing
- 1. Silicon processing and Semiconductor manufacturing Challenges in Indian perspective Presented By Achal Singh Mtech 1st Sem.(Nanotechnology) Scholar No.-222105102 Seminar
- 2. Introduction Why this topic? What is a semiconductor? Why is silicon used? Silicon Processing steps The Semiconductor Economy India’s semiconductor program Current trends Ref.- https://in.mitsubishielectric.com/en/feature/partneringindia/insights/s emiconductors-in-integrated-circuits.html Ref.-https://www.newyorker.com/news/news-desk/the- secrets-of-blood-testing-startup-theranos
- 3. What is a semiconductor? Electrical properties Conductivity Temperature coefficient Why not conductors? Switches Gates
- 4. ENIAC: First Vacuum Tube Computer(1942) Reference: Computerhistory.org
- 5. Why Silicon? Abundance of materials on earth crust.(Ref.-worldatlas.com) Semiconductor band gaps(Ref.- http://ffden-2.phys.uaf.edu) Si-SiO2 interface(Ref.- researchgate.net)
- 6. Silicon Processing Steps Crystal growth Wafer slicing Lapping Etching Cleaning Inspection Packaging Shipping
- 7. Crystal Growth Obtaining the sand Preparing molten silicon Making the ingot Growth of Epitaxial Silicon Preparing Wafers Grinding Crystal Growth(Ref.-Researchgate) Ref.-Waferpro.com
- 8. Czochralski Technique Schematic of the principle of the Czochralski method (left) and illustration of the different steps (a–j) of the Cz process for growing a Si crystal. (a) The polycrystalline feedstock is melted (b) in a crucible. (c, d) Seeding procedure: The seed crystal is dipped into the melt, followed by Dash necking (e), shouldering (f), cylindrical growth (g), growth of end cone (h), lift off (i), cooling down and removing of the crystal (j).(Ref.-ScienceDirect.com)
- 9. Wafer Slicing Wire Saw Slicing (Ref.-https://www.nikon.com/products/semi/technology/story02.htm) (Ref.-https://www.waferworld.com/post/si-wafer-3-methods-for-slicing-or-dicing-silicon-wafers)
- 11. Masking and Etching Etching process (Ref.- https://www.hitachi-hightech.com/global/en/knowledge/semiconductor/room/manufacturing/etch.html) Dry Etching Wet Etching
- 12. Cleaning Impurities Wet Cleaning Solvent Clean RCA1 Clean HF dip DI clean Dry Cleaning Laser Cleaning
- 13. Inspection, Packaging and Shipping Principle for detecting defects on a patterned wafer (Ref.- https://www.hitachi-hightech.com/global/en/knowledge/semiconductor/room/manufacturing/inspection.html)
- 14. The Semiconductor Economy Component manufacturing companies ASML Contract Manufacturing and Design TSMC Fab companies Samsung Intel Fabless companies Apple
- 15. India’s Semiconductor Mission 76000 crore INR program. Semiconductor Fabs and Display Fabs Compound Semiconductors / Silicon Photonics / Sensors (including MEMS) Fabs/ Discrete Semiconductor Fabs and Semiconductor ATMP / OSAT Units Design Linked Incentive (DLI) Semi-conductor Laboratory (SCL)
- 17. A Smartphone ad(2022) Ref.- https://images.samsung.com/is/image/samsung/p6pim/in/feature/others/in-feature-galaxy-m33-5g-6gb-ram-532917771?$FB_TYPE_A_JPG$
- 18. Bibliography 1. Michael Alba, Vacuum Tubes: The World Before Transistors, Jan 19,2018 2. Stegmann et al, Ultrathin SiO2 layers on Si(111): Preparation, interface gap states and the influence of passivation,Nanotechnology19(42), Sept. 2008 3. Friedrich et al, Methods for Bulk Growth of Inorganic Crystals: Crystal Growth, 2016 4. Fisher et al, Silicon Crystal Growth and Wafer Technologies,Proceedings of IEEE, vol100 ,May 2012. 5. MKS Instruments Handbook: Semiconductor Devices & Process Technology 6. 6. UCIrivine Manual, Cleaning Procedures for Silicon Wafers
- 19. Thank You
Editor's Notes
- Semiconductors are used in every field, from automobiles to space stations to biomedical applications. Since, covid-19 pandemic there has been a semiconductor shortage, it becomes important for every country to achieve semiconductor manufacturing efficiency.{Slide 2: Theranos founder, Elizabeth Homes envisioned to do 3000 types of tests with just 1drop of blood, although she failed, but this could be possible in future only because of semiconductors.}
- You could control the flow of charge in a conductor if you can change its resistance. There are two simple ways to do this: Change its diameter or length. Reducing diameter or increasing length will increase resistance. Change its temperature. Metals have a positive temperature coefficient of resistance.
- Middle photo: vacuum tube change The basic working principle of a vacuum tube is a phenomenon called thermionic emission. It works like this: you heat up a metal, and the thermal energy knocks some electrons loose.
- Silicon is the 2nd most abundant material used in earth’s crust; it occupies 28% of earth’s crust. It can be relatively cheaply extracted as compared to germanium and other semiconductors. Its band gap 1.1eV is an ideal band gap and can be easily manipulated. Also, SiO2 as an insulating layer can be easily formed on silicon surface, which is utilized in process of etching.
- Crystal Growth: For preparing Silicon crystal, sand is obtained rich in SiO2 it is then poured in crucible, and a pure seed crystal of Silicon is introduced, crystallization occurs in form of cylindrical growth and then a cylindrical silicon ingot is obtained. This whole process is termed as Czochralski process, the commonly used process in silicon processing. The obtained silicon cylinder has some surface irregularities, which are resolved by grinding.
- Diamond saw/Wire saw:In order to increase throughput, wire saws with many parallel wires are used which cut many wafers at once (schema top).A long (up to 100 km) high-grade steel wire with a diameter of » 100 - 200 μm is wrapped around rotating rollers with hundreds of equidistant grooves at a speed of typically 10 m/s. The mounted silicon cylinder is drained into the wire grid and thus cut into single wafers.The wire is either coated with diamond splinters or wetted with a suspension of abrasive particles such as diamonds or silicon carbide grains, and a carrier (glycol or oil).The main advantage of this sawing method is that hundreds of wafers can be cut at a time with one wire. However, the attained wafer surface is less smooth and more bumpy as compared to wafers cut by an annular saw, so the subsequent lapping takes more time.
- The sliced wafers are mechanically lapped using a counter-rotating lapping machine and an aluminum oxide slurry. This flattens the wafer surfaces, makes them parallel and reduces mechanical defects like saw markings.
- Masking and etching are accompanied by photolithography. An oxide layer is formed on silicon substrate. A photoresist is applied on the substrate layer, and UV light is irradiated on photoresist through a photomask. When UV light strikes the photoresist layer it etches a pattern. This pattern is the minaturised form of long wire connections, later other components such as capacitors, resistors, etc. can be coated on these patterns to form the complete semiconductor chip. Wet Etching which is accompanied by solvent results in undercutting, while dry etching forms the anisotropic etch.
- Cleaning is done after every step to remove impurities. Impurites such as inorganic impurities, organic impurities, metal ions can seep in any step of silicon processing. Wet cleaning is done in three steps: Solvent cleaning: which is done with help of methanol or acetone to remove organic impurities. RCA1 clean: Thes is done with help of H2O2 and NH4OH solution. Next step involves cleaning with HF dipping. After each of these 3 steps the wafer is cleaned with the help of deionized water. Dry cleaning which involves laser cleaning, blow drying are more precision methods of cleaning.
- After complete process the silicon wafer is compared to a sample wafer, it is checked for any defects. After that is packed and shipped for further fabrication.
- The semiconductor market currently stands at 600 billion, which is expected to grow to 1100billion USD by 2030. There are 3major types of semiconductor companies: Fabless companies: These design chips but don’t own the foundary to manufacture them, such as Apple. Fab Companies: These design and own foundry to print them, such as Samsung and Intel. Contract Manufacturing Companies: Such as TSMC, which take orders for semiconductors, design them and print them in their foundaries, but do not put their label on them. Fourth type is the most important, the component manufacturing companies, such as ASML, these are special companies, that only design the equipments needed by foundaries and supply their machinery to these companies. ASML has the complete monopoly in the equipment business. One EUV photolithography machine costs 150 million USD, and a foundry need atleast 20 of these. We can only imagine the business.
- displays account for over 25 per cent of the BoM in the case of smartphones and over 50 per cent in the case of LCD/LED TVs. India plans to invest around 10billion USD to manufacture semiconductors. Its main focus is on: display fabs:accounts 25-30% of final product cost, ATMP:advanced testing,marking and packaging, which accounts for 50% of production cost. Photonics: In line with Indian Solar Mission. Compound Semiconductors: Because Silicon is difficult to obtain, and more difficult to process. Revive SCL, Mohali.
- As we can see in current smartphone ads, there is 5nm process in commercial use. The graph by TSMC shows the advancement in process year by year. We have transceded from micrometer scale from 1987 to 3nm in 2021(the 3nm process is not currently in commercial production). The nm process mean the size of a transistor’s gate length and metal half-pitch (half the distance between the beginning of one metal interconnect and the next on a chip), which were both the same size. Generally, the lower nm processor means it is more faster than the higher nm processor, but it may not always be the case and is now generally used as marketing term