In Plant training(Internship) at Schneider Electric,Bangalore
my report
1. Report of In-plant Training
In
Videocon industries Ltd
By
Master. Saurabh Nandakiumar
(University no.: 101090010)
Of
VJTI,
Mumbai.
Department Of Electronics and Telecommunication Engineering,
VJTI,
Mumbai.
2. Acknowledgment
I am deeply thankful to our respected Head of Department Prof.
Mangalvedekar for his permission to allow me to do my training in
Videocon industries Ltd. I thank all the staff of electronics and
telecommunication Department who helped me to establish myself at this
position.
I express my sincere gratitude to my guide Mrs. Anita Saraf from
HR department of VIDEOCON Industries Ltd, for her valuable
suggestions making this training a successfulone.
I also show my gratitude towards the HR department of Videocon
Industries Ltd, especially Mr.Satyaprakash and Mr.Amit Shinde for
helping me out generously during the training.
Last but not the least, I would sincerely like to thank all the
organizational guides, HODs’ and employs of Videocon Industries Ltd
which directly or indirectly helped me to bring up the training in the
present form.
Saurabh Nandakumar
5. Research & Development(R&D)
In this department all new ideas are invented as
per the market requirement and re-develop the old
product if needed.
R&D department is the HEART of the
ORGANISATION, because all products are designed
and develop by the R&D department.
The flow chart of new product is as follows, where
working role of all department is describein brief.
-R&D section designs the new models as proposed
by company.
-After designing, R&D creates 1 model and does it’s
checking in all ways regarding quality and
performance.
-After finalizing the design and quality checking,
further responsibility is send to ME dept.
6. ME (ManufacturingEngineering)
-One of the most important departments in ITV, which stands next to R&D,
playing a vital role in pre-production process.
-In this section various testing are performed of new
product before the mass production.
-The TTR is stands for Trail Test and Run.
-ME section finds out various testing like picture quality,
physical structure, and various other tests.
-Physical testing consists of checking of fittings, screws,
nuts etc.
-TTR-1 consists of production of less than 10 sets
manually by ME.
-TTR-2 consists of production of less than 50 sets.
-Pilot production consists of more than 50 sets but less
than 100.
-Each stage of TTR checks the quality in deep levels
considering working, quality, durability etc.
-Pilot production (PP) checks the production process
possibility, and problems after and during mass
production.
-All type of jigs and required modifications in machines in
production line are made and manufactured here.
-Even signal testing using various instruments like CRO
etc. are also done here.
.
7. Responsibilitiesof ME: -
• KPI
•
• √ New Model Status
•
• √ Bill Of material Release
•
• √ Engineering Change Note Implementation
•
• √ RMC Vs. PO
•
• √ Line Trials
•
• √ New Jigs & Fixtures
•
• √ Line/OQC Analysis
•
• √ Process/Product/Q-Improvement
•
• √ Cost innovation Summary
•
• √ Best Practice
PREPARATION OF BILL OF MATERIAL
BOM stands for bill of material
It is a starting phase of manufacturing
It contains total components, parts, material required in the final
assembly
BOM is the guideline for the production process
M.E. department makes changes according to the production
process and availability of parts.
8. BOM contains part code, required per Assembly, Name of
Material, Form, specification, Quantity Purchase, Unit Cost,
Vendor Code, and Total Cost.
A bill of materials (sometimes bill of material or BOM) is a list of
the raw materials, sub-assemblies, intermediate assemblies, sub-
components, components, parts and the quantities of each needed
to manufacture an end product.
A BOM can define products as they are designed (engineering bill
of materials), as they are ordered (sales bill of materials), as they
are built (manufacturing bill of materials), or as they are
maintained (service bill of materials).
A BOM can be displayed in the following formats:
A single-level BOM that displays the assembly or sub-assembly
with only one level of children. Thus it displays the components
directly needed to make the assembly or sub-assembly.[5]
An indented BOM that displays the highest-level item closestto
the left margin and the components used in that item indented more
to the right.
PROCESSPLANNING
M.E. department decides the actual method of assembly of the
product.
In which assembly point checkpoints are decided.
Preparation of work manual plays important role in process
planning at each stage there is a one work manual is present
On which detail information of assembly point and check point is
given, it is also a guide line for worker at that point.
Continuous improvement in cycle time is done with the help of
process planning unit.
As per the daily schedule of productionrequired work annual are
prepared, work manual consists of the model no, task at that stage,
instruction’s for the workers.
Without process planning we can’t achieve the decided target, it is
the responsibility of the process planner.
11. AID: AUTO INSERTION DEPT.
Significance:
All possible ways of insertion of electronic components by
machines is undertaken in this department.
These are following machines installed in AID:
1) Sequencer 6 machines
2) Jumper Wire 3 machines
3) Eyelet & GT Pin insertion 2 machines
4) Axial Inserter 3 machines
5) Radial inserter Panasonic & TDA
6) ICT: - (In Circuit Tester)- 2 machines
7) ACM: - (Auto chip Mounting) 1 machine
8) SMT: - (Surface mounting Technology) 1 machine
12. Sequencer machine
-This machine creates the sequence of the axial
components to be given to other machines.
-The machine is programmed with the slot
number where different components are present.
- In sequential there are 120 slots. Each slot is
connected to a stepper motor, where every slot has a
constant component sequence, which contains same
component throughout the strip.-
Significance
- This machine helps creating a new strip of different
components according to our requirement.
- After dropping the components into the chain, entire chain
passes through a detector for finding missing components.
This sequence of components is very important for
proceeding major processes regarding quality and
production time.
- PROGRAMMING
- The operating system of this machine is MS DOS.The
program for control is written in C.
- Initial length of component = 52mm.
- After sequencing it is = 42mm.
13. Jumper Wire Insertion or Mounting
-In this section, jumpers are mounted on the PCB by using the
conducting wire. Location of the jumper is to be given with the
location on PCB with respect to X and Y- axis and length. A small
camera and sensor detect the location and size and empty hole
and place the jumper. Whole assembly works on principle of
image processing and PID (proportional integrative derivative)
algorithm.
*Axial inserter can also insert jumpers by creating a sequence of jumpers of constant
lengths. This is usually done if jumper inserters are faulty or require maintenance
Use of jumpers in circuits
-Usually during design, we encounter jump paths.
This can be solved by using jumper wires between
the 2 terminals, which have to be shorted according
to the design given by R&D. This method is preferred
if the chip is single sided and not having many layers
of internal connection
- Copper/Aluminum wire is used for connectionon
PCB.
- We cant cross the path. Hence to cross the path we
are using
Jumper wire
-Jumper is made up of high conductive & low cost
material. Aluminum-Used as jumper wire.
Axial inserter: -
14. - Axial m/c mounts horizontalcomponents on PCB e.g.
Resistances,inductors,Diodes,jumpers.
-Sequence ofcomponents,which is used for axialm/c
mounting.
-Axial m/c is programed as per requirement.
- PROGRAMMING
- The operating system of this machine is MS DOS. The
program for control is written in C.
About 250 axial components are inserter in each PCB.
Radial m/c: -
-Radial m/c mountverticalcomponenton PCB E.g.-
Capacitor,Transistor.
a] Panasonicm/c: -
As per requirementsequenceris not used.
More than 50 slots (62) are available.
b] TDK Radial: -
- Components are arranged in sequence(notstuck in
strip like axial) and then mounted on PCB.
About 90 slots are available.
Separate radial component sequencer isn’t used due to
variable sizes of radial components especially capacitors.
Eye let & GT connectors insertion:’
It is used for fixing eyelets.
It is also used to connect the jet pin.
These pins are used as terminals for high voltage nodes
where copper track is usually burned due to high
current causing high terminal temperature.
ICT: - (In Circuit Testing): -
15. It is the final stage of AID.
Reference jigs are used for
respective PCBs & PCB is directly
placed on it.
-If any error like missing components,glitch etc. Are defected
with location & code.
- TestpassedPCBs’are send to MI.
- PCBS’with problem is sentfor
debugging.
ACM (Auto chips mounting): -
- It is used for mountingthe chips.
- First glue is applied at a place, where IC is to be mounted.
- Sensor is used while chip is being.
-Micron chips i.e. on surfacechip mountingis donehere for
CTV PCBs’.
Machine is manufactured by SAMSUNG (SouthKorea)
Surface Mount Technology (SMT)
A way of attaching electronic components to a printed
circuit board
The solder joint forms the mechanical and electrical
Connection.
Bonding of the solder joint is to the surface of a
conductive land pattern
Connection does not use through holes or terminals.
16. SMD stands for Surface Mount Device. These are
electronic components with no leads like through-hole
components.
These devices have tiny metallic legs very close to the
surface of the components.
These metallic legs are soldered on the copper tracing
on the PCB using solder paste.
CHIPs: Chips have been given a four-digit number code,
which indicates their approximate size in hundredths
of an inch.
The main feature of chips is their tendency to get smaller
and smaller.
BGA or Ball Grid Array is also a kind of SMD with no
leads or legs at all.
These special electronic components have tiny metallic
spots underneath the components. They are soldered on the
PCB using solder balls.
QFP Quad flat pack: a plastic body containing an IC,
with gull-wing legs on all four sides
17. MI (Manual Insertion) Department
In Manual Insertion line the component having large size or which
may not placed by machines in AID is to be placed.
Sockets, fly back transformer, power transistors, heat sinks. Etc. are
placed on PCB.
Parts inserted in MI LINE:
FBT
USB port
High voltage capacitor
Horizontal capacitor
Fuse
Pin header
Memory IC
Thermistor
Power transistor
Heat sinks
VGA, RGB connectors etc.
18. The final circuit is passed through an oven where
firstly PCB’s base is passed through molten flux so
that all copper terminals are free from impurity and
rest plastic remains sticky.
-After that the base of the circuit is passed through
molten solder material,which keeps flowing.
Soldering
After inserting all component PCB is sent to the oven where the track
side is cleaned by using liquid hot flux and pass to the soldering point
where the liquid boiling solder is pest on freecopper point.
-Thus the copper point gets soldered and remaining
part of the board is solder free.
-A double circuit tester is used to check the PCBs’ 2 at
a time because there are 2 lines connected to it.
-The next step is to check the working of audio and
video output of the PCBs’ by connecting it to free
panels and DVD players. As there is no impedance
matching between PCB and the panel, image and
sound does not have good quality always, but it
allowedpassing along the line termed as a good piece.
-If the circuit isn’t working it is passed to expert
debuggers for re working on it.
19. -After all of this an anti-oxidant coating is sprayed on
the back of PCBs’ and it is then send to Final assembly
line.
*Same is the process for and LCD/LED PCB manufacturing.
Reflow soldering
With reflow soldering the possible sequences are:
1. A mixture of solder and flux (solder paste) is applied to
every joint before
assembly.
2. Heat is applied by radiation, convection or conduction.
Or
3. Solder is preplaced in solid form on one of the surfaces of
every joint.
4. Flux is applied to the preplaced solder.
5. Heat is applied by radiation, convection or conduction.
20. FINAL ASSEMBLY/LCDASSEMBLY LINE
Checking of
-Front cover for scratches, paintproblems etc.
-Speaker grill hole to open
- Printings (name of company)
- Rear edges for proper painting
Paste clear (pass) tape on all corners of
cover.
Fix switches (keys).
Block holes with proper polymer.
Fix speakers with screw.
*Both speakers have different colored wired
for differentiation.
Panel with cover assembly:-
Earthing wire (spring) connection.
Connection of ties to avoid jumbling.
Connection of degaussingcoil.
Mounting the whole set with screws.
Charge removal.
PCB loading
Power cap, yoke connector, audio,
video, CRT fixing.
Vif-Vco alignment.
Screen and focus adjustment.
21. Removing colour patches by applying
magnetic fields in vertical and
horizontal directions.
White balance.
Samsung patented technology.
Usedto set the whiteand colour
balance lock.
-Low light and high light colours of RGB
Chassis and back cover fitting.
HV testing by giving 3kV for 1 sec and 7A
current.
Sound testing, hammering is used to find
any loose contact.
Seal, serial no. Pasting
Final packaging and dispatch.
LCD line assembly:
Almost the same steps like CRT assembly.
Only an extra height temperature testing room
(SLT-Short life testing) is includedwhere
assembled TV is passed through 50 Deg C for 15
mins. The line is 90 m long.
22. IGQA (Inward Good Quality Assurance)
IGQA/IQA is the departmentin which quality of raw materialis
tested.
- As per the requirement of product.
- Vender provides raw material.
Purpose: -
- To check the quality of raw material using sampling plan
with various testing.
- Sampling plan used - IS2500/2000.
- General inspectionlevel - GIII.
Process: -
There are three sampling plans, we are using in IQA.
- S1/4.0: - Used for checking Electrical & Mechanical
parameters.
- S2/2.5: - Solderability & fitment.
- G III:- For visual inspection.
Sampling plan gives us idea about how many samples to
be checked from a given lot of size.
For e.g.:-In the lot size of 9-15 for S1/4.0,we can pick 5
samples for G III /0.15 can pick 5 samples.
Actual Testing for IGQA: -
1] Loud SpeakerTest: -
a) Visual Observation:
- Marking condition.
b) Electrical Parameter Test:
- Polarity.
- DC resistance (R=7.4K,10% tolerance)
- Power ratings.
c) Sweep Test:
- Input to speakeris 20-22KHz.
- Speaker output is checked.
2] Solder ability Test: -To check if soldering does not cause any
designproblems,like for e.g. heat sink usually causes shorts in
paths.
23. 3] L-C-R Test: -
- Resistor,Capacitor & Inductor is tested.
- Q Factor.
4] Curve Tracer: -
- Checking of Transistors & Diodes.
5] Remote Tester: -
12m at 90 degree.
8m at 30 degree.
6] Tuner Testing
7] Inspectionof FBT (Fly back Transformer)
24. CQA: - (Central Quality Assurance):-
Def.: -
It is the departmentwherethe initially quality of the productis
checked set wise.
Purpose: -
Purposeof the CQA is doing followingmain tests. These test are
undertaken to check reliability of the product& workingof the
productas per the specification.
1] Packing
2] Aesthetics
3] Receiving
4] Workmanship
5] Parametric
6] Reliability
Process: -
1] Design from R&D with specification & along with 5 sets & product
specification, audio report, parametric report, marketing
applications.
2] If there is any fault, raise NCR.
3] If no faults, then Design Release issue.
4] Checking of 5 sets for TTR1 from ME.
5] If any fault, raise NCR.
6] If no faults, TTR 1 release issue.
7] 20 set for TTR2 from ME.
8] If any fault, raise NCR.
9] If no faults, TTR2 release report.
25. A] Tests: -
1] Mechanical tests:
a] Drop Test:
-Accordingto wt. of set droppingheight is decided.
- Set is dropped on alledges, faces & corners, to check
the Strength of TV set.
b] VibrationTest:
-Vibration Machine is used to create vibrations.
-TV set is placed on vibration plane to check
sustainability.
-Time duration = 1->2 hrs.
c] Bump Test:
-Sudden shocks are artificially applied to TV, to check
whether TV can sustain while transportation or Not.
2] Electrical Tests:
a] Stability Test:
-Set is continuously ON-OFFat 88 V supply with5 min.
time period.
b] Fluctuation Test:
-TV is operated on variable voltage fluctuation so as to
meet
Homeuses, with other appliances.
c] Inverter Test:
-Set is ON for 1 hr. with inverter supply.
-Switching between mains & inverter supply checked
for 5min.
3] Environmental Tests:
a] Dry Heat Test:
-Keep the sets in 45->55 * C for X hours.
(X is depend on from wheresets are coming)
TTR1: X= 48 Hrs.
TTR2: X= 24 Hrs.
New Chassis: X= 12 Hrs.
b] Cold Test:
-Set is tested at 10*C for 24 hrs.
c] Humidity Test:
-Set is tested at 45*C & 95% humidity for 24 hrs.
26. 4] Live Test:
-Set is ON for 48 hrs.
5] Software Test:
-All parameterson variouspatternsare checked.
6] Hardware Test:
-All hardwarecomponentsare checked.
B] SRT (Signal Ranging Technique):-All problems are
detected about TV set & major/bulky problems are solved
initially.
-*OQA is a smaller version of CQA which has lesser no of
tests done, but done on randomly picked pieces from mass
production to check problems on outgoing pieces unlike the
pp pieces in CQA.
27. Difference between LCD and CTV
Sr
No.
PARAMETER CTV LCD LED
1. Power Consumption High Moderate Low
2. Mercury Used Used Not Used
3. Display Technology Cathode Ray Tube Liquid Crystal
Display
Light Emitting
Display
(Diodes)
4. Size Big Compact More Compact
5. Chassis Components Bulky Chip component Chip
component
6. Cost Less Moderate High
7. Chassis Capacity Only processes AC
Signal, Peripherals are
required for DC
processing
Both AC & DC are
processes
Both AC & DC
are processes
8. FBT Used Not Used Not Used
9. CPT Types -Conventional
-Slim
-Ultra slim
-Flat
-Pin Free
-HD
-Full HD
-HD
-Full HD
10. Panel Provider JCT
Samtel
AUO
LG
Samsung
AUO
LG
Samsung
