1. Leading Indicator Program
Overview
Sampled material
All other production
material

2. MANUFACTURING INTERACTIONS

3. Leading Indicator Description
 A continuous improvement program based
on statistical limits for both material and
equipment through the approach of zero
defects, process results, close loop controls,
maverick material analysis and improvement,
equipment utilization /uptime analysis and
real time controls/analysis. It includes three
type indicators – process, equipment, and
electrical leading indicators. The system
identifies any maverick processed material
prior to leaving the manufacturing site.

4.  A multiple faceted approach to manufacturing
 Zero defect approach
 Process results; closed loop controls
 Equipment utilization/uptime analysis
 Real time controls/analysis
 Continuous improvement based on statistical limits
for both material and equipment
Key Elements of Leading Indicators

5. Leading Indicator Program Features
Event based analysis
 Known as Leading indicators
 Based on location; machine, process, or electrical
leading indicators
 By package family ( SOIC, P-Dip, DFN, BGA )
 Limits are derived by statistical analysis
 Analysis is real time
 Each nonconforming event will define action to be
taken
 OCAP’s, ( out of control action plans )
 Failure analysis
 Material disposition
 Line requalification

6. Leading Indicator Program Features
 Data is generated real time
 OCAP’s ( Out of control action plan ) are required for
each operation
 Closed loop analysis, maverick data requires F.A.
( Failure Analysis ) and C.A. ( Corrective action) on each
event
 Pareto charts defines major issues which need to be
worked
 Data to be sent to WEB or FTP site for continuous
monitoring of controls and improvements

7. Assembly Continuous Improvement
• Definition of defects
– Goal of assembly is continuous drive to zero defects
– Definition of different types of defects
– Systemic
More than one incident with identical failure
Requires OCAP ( out of control action plan ) if 3 incidents in
a 2 week period line shutdown until problem/problems are
solved
– Maverick
 Random defects
 Outliers
 Difficult to predict
Maverick point

8. Leading Indicator Process Driven
Program
 List of current Process Leading Indicators used in
manufacturing
 Assembly yields by operation ( .2% yield loss
notification limit )
 Wetting angle (post D/A cure)
 W/B ( Wire Bond ) work holder cratering test by bond
site
 C-Sam monitoring ( post mold IR reflowed and
analysis )
 FVI ( final visual inspection)
 Final Test Parametric Analysis
 Tape and reel

9. Process Leading Indicator (actual data)

10. Process Leading Indicator Tape and Reel
yields (actual data)

11. Equipment Leading Indicator Tape
and Reel
Operator will inspect all rejects > .2% , separating rejects by
category for engineers to define R/C
Lead Scan
Good
Mark
Analysis
Lead
Analysis
R track
Reject
Rescreen
Next station
Good
Lead Scan
Basic Process Flow
Closed loop analysis
to determine R/C

12. Equipment Leading Indicators
 Each piece of equipment will be under ELI’s ( Equipment
Leading Indicators )
 Each piece of equipment will be divided into sub-systems
for analysis
 Data will be generated on assist and failures
 Statistical control on assist and machine failures
 OCAP ( Out of Control Action Plan ) limits to be set for
assist and hard failures
 Paytner and pareto charts will be generated to identify
weak sub-systems

13. Equipment Leading Indicator
SOIC 8LDS HDLF WIREBOND MACHINE LEADING
INDICATOR (Actual data)

14. Corrective Actions for Wire Bonders
Corrective actions are based on assist by
subsystem

15. Electrical Leading Indicators
Parametric Maverick lot trend analysis
 A statistical approach to maverick lot
analysis
 Parametric yields ( .3% per failure mode or
.4% overall parametric yield limit)
 Analysis based on parametric yields
 Limits based on a statistical mean and
Std Dev. ( Standard Deviation )
 Opens, shorts, Isb (standby current ) and
pin leakage
 F.A. training required to understand failure
mechanism
 All lots which fail, require F.A. to determine
R/C
 F.A. flow defined to prevent destroying
critical information in determining R/C

16. Maverick lot trend Parametric failures
(Actual Data)

17. Parametric Failure Analysis F.A. flow for
Electrical Failures
 Parametric leading indicators
 Close loop analysis – Assembly, test and F.A. work together to solve root
cause of maverick lots
 All lots which fail maverick lot limits are analyzed for root cause and C/A
( Corrective Actions ) are implemented in assembly to prevent reoccurrence
of problem.

18. Leading Indicators
 Conclusion
 Program identifies any maverick processed
material prior to leaving the manufacturing site
Zero defect program
Continuous improvement through statistically based analysis
Program is both equipment and process focused
Real time monitoring and analysis
Predicts potential equipment mis-processing before it happens