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Engineering Presentation
By
Mike Ryland
ABOUT ME
• Graduated from CSUN in 2004 (B.S.M.E.)
• Core member of CSUN FSAE 2003/04 Race
Team
• 10+ Years experience in New Product
Development
• ProEngineer CREO and Solidworks expert
power user
• Experienced with Aerospace Qualification /
Documentation
• Advanced Interconnect design experience
• Design of custom Military connectors for use
in Harsh Environments (Tactical
Communications)
• Design for Space Applications (1,000,000
cycle RF switches)
• Pursuing M.S.M.E at CSUN (15 of 30 units
completed)
Professional Experience
EATON, Camarillo, Ca. 09/2013 to 01/2015 (1 Year, 5 Months)
Senior Product Engineer
HAAS Automation, Oxnard, Ca. 04/2013 to 08/2013 (4 months)
Mechanical Engineer III (R&D)
ISI, Camarillo, Ca. 06/2012 to 04/2013 (10 month contract)
Project Engineer
PTI Technologies, Oxnard, Ca. 07/2008 to 06/2012 (4 years)
Mechanical Engineer
Dow Key Microwave, Ventura, Ca. 09/2006 to 07/2008 (2 Years)
Mechanical Design Engineer
PTI Technologies, Oxnard, Ca. 06/2004 to 08/2006 (2 years, 2 months)
Manufacturing Engineer
Certifications
• GD&T per ASME y14.5 1994 - Geometric Learning Solutions
• Solidworks Cosmos Professional - Go Engineer
• Solidworks PDM Jumpstart - Go Engineer
• Solidworks Routing
• Enovia PLM Administrator certifications - Enovia
• Solidworks Advanced Surface Design - Solidworks World
• Solidworks Mold Design / Plastics - Solidworks World
Professional and Personal Development
• Eaton University – Six Sigma
• Eaton University – Project management
• Eaton University – Project Management Certification
• Eaton University – ProLaunch for Project Management
• Eaton University – Feasibility studies
• Eaton University – Influencing and Peer Communication
• Eaton University – Managing Risk in Engineering Project
Recent Awards (Eaton)
My Engineering Degree
GD&T Certification
TECHNICAL PRESENTATION
“DENSE MEMORY MODULE”
Custom Connector
Connector - Card Interface
Contact to Pad Alignment Challenge
Edge Card Connector Concept Design
DMM Connector Configuration
DMM Connector Configuration
Top View
DMM Connector Configuration
Bottom View (Pin Array)
Pin Socket Interconnect Array
Pin-Socket-BGA/LGA Array Interconnects
DMM Board Thermal Management
1U Chasis and DMM Module Detail
Contact Design
Contact Design cont.
Contact Design cont.
Housing Design
Housing Design cont.
Housing Design cont.
Tolerance Analysis
Tolerance Analysis cont.
Connector Prototype
Contact Prototypes
Contact Prototypes
PERMANENT SET AFTER .015 DEFLECTION
MAX RESIDUAL STRESS, K000029902
NORMAL FORCE, BENDING STRESS AND PERMANENT SET
MAX STRESS (Uniform Distribution)
 TAPERED BEAM UNIFORMELY
DISTRIBUTES STRESS ALONG THE
LENGTH OF THE CONTACT/BEAM.
 MINIMIZE LOCAL STRESS
CONCENTRATIONS, UTILIZING FULL
LENGTH OF BEAM TO DISTRIBUTE
STRESS.
 NORMAL FORCE 5.3 GRAMS PER
CONTACT
• MAX STRESS/DEFLECTION OCCURS AT STEP 10 OF 26,
1.528 SECONDS INTO THE 4.2 SECOND SIMULATION
USING A PARABOLIC LOADING/UNLOADING CURVE.
• STEPS ARE .042 SECONE INCREMENTS.
STRESS DISTRIBUTION (cont).
ANIMATION DEMONSTRATING
ONE COMPLETE CYCLE OF
“LOADING-UNLOADING”
 TAPERED BEAM
UNIFORMELY DISTRIBUTES
STRESS ALONG THE LENGTH
OF THE CONTACT/BEAM.
 MINIMIZE LOCAL STRESS
CONCENTRATIONS,
UTILIZING FULL LENGTH OF
BEAM TO DISTRIBUTE
STRESS.
 NORMAL FORCE 5.3
GRAMS PER CONTACT
• MAX STRESS/DEFLECTION OCCURS AT STEP
10 OF 26, 1.528 SECONDS INTO THE 4.2
SECOND SIMULATION USING A PARABOLIC
LOADING/UNLOADING CURVE.
• STEPS ARE .042 SECONE INCREMENTS.
REACTION FORCE (X) MOMEMT = 5.3 GRAMS
MAX FIBRE/SURFACE STRESSES
TENSION (+) AND COMPRRESSIVE (-) STRESSES
SETUP AND ASSUMPTIONS
 INPUT CURVE –
LOADING/UNLOADING
CYCLE
 .015 PRESCRIBED
DISPLACEMENT
 NO “FIXED” CONSTRAINTS
WERE USED.
 “ROLLER/SLIDER” AND
REFERENCE GEOMETRY/
SYMMETRY WAS USED TO
MAKE SIMULATIONS AS
REALISTIC AS POSSIBLE.
Solder Tab K000029903
STRESS ANALYSIS
DEFLECTION
DEFLECTION (Cont)
STRAIN
Final DMM Module
Questions

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