MicroVision's MEMS Laser Beam Scanning based 3D Depth Sensing Technology presentation by Jari Honkanen at MEMS & Sensors Industry Group Conference Asia 2016, Shanghai, China, September 13-14, 2016

1. Don’t just think outside the box.
See outside the box.
MEMS Laser Scanning, the platform for
next generation of 3D Depth Sensors
Jari Honkanen
Rev. 0.4; Sep 12, 2016

2. 2 MICROVISION, INC. COPYRIGHT 2016. ALL RIGHTS RESERVED.9/12/2016
Abstract
MicroVision's MEMS Laser Beam Scanning technology is a leading display technology
for pico projection, heads-up-display, and augmented reality eyewear applications.
But the same flexible technology can also be applied to exciting new sensing
applications, such as 3D Depth sensing. Demand for small and low cost 3D Depth
sensing solutions is growing rapidly driven by increasing demand for new Natural
User Interface, Machine Vision, Robotic Navigation, Metrology, and Advanced Driver
Assistance System solutions.
This session will compare the existing 3D depth sensor solutions based on stereo
cameras, structured light and 3D CMOS Cameras. It will then present a new MEMS Laser
Scanning based depth sensor platform solution that will enable
new generation of tiny 3D Depth Sensors with new capabilities such as dynamic
variable resolution and variable acquisition speed. These dynamic scanning MEMS
based depth sensors will become an enabling technology for a completely new
set of innovative products and applications for years to come.

3. 9/12/20163 MICROVISION, INC. COPYRIGHT 2016. ALL RIGHTS RESERVED.
Agenda
• What is a 3D Depth Sensor?
• 3D Depth Sensing Applications
• 3D Depth Sensing Market Opportunity
• 3D Depth Sensor Technologies
• 3D Depth Sensor Competitive Analysis
• Case Study:
• MicroVision MEMS Technology and Applications
• MicroVision MEMS used for Depth Sensing
• MEMS Laser Scanning for Depth Sensing unique
benefits
• Conclusions & Call to Action

4. 4 MICROVISION, INC. COPYRIGHT 2016. ALL RIGHTS RESERVED.9/12/2016
3D Depth Sensor – what is it?
 3D sensors allow devices to observe the
environment in 3 dimensions
 3D imagers measure distance for every pixel
within detection field.
Number of
measurements
within detection
field of view
Depth
Sensor/Imager
X
Y
Distance,
Z
Depth Map Point Cloud
 3D imagers produce a 2D addressable array, a
depth map, or further a 3-dimensional collection
of points, a point cloud

5. 5
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9/12/2016
3D Depth Sensing Applications (just a small sample)
Application Targets Markets
Natural User Interfaces /
Gesture Recognition
Internet of Things
Gaming
Interactive Displays
3D Scanning 3D Modeling
Gaming, Virtual Worlds
3D Printing
Metrology, Location and
Mapping
Indoor Measurements
3D Room Mapping
Robot Navigation
Range Finding
Advanced Driver Assistance Systems (ADAS)
Drone Collision Avoidance
Machine Vision /
Object Recognition
Security
Industrial Automation

6. 6
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9/12/2016
3D Imaging & Sensor Market Opportunity
 3D imaging & sensor market is still at an early stage and growth is driven by new
application areas and cost reduction of sensor technologies.
 Leading CE companies like Apple (PrimeSense acquisition), Microsoft (Canesta and
3DV Systems acquisitions), Sony (Softkinetic acquisition) and Google (Project Tango)
have been investing heavily in the space.
 Leading Chip companies like Intel (RealSense) and Infineon (Real3) are offering silicon
& systems.
 The global 3D sensor market is expected to grow to > $3B in 2020 at an estimated
CAGR of 23.4%.
[Markets and Markets]

7. 7 MICROVISION, INC. COPYRIGHT 2016. ALL RIGHTS RESERVED.9/12/2016
3D Depth Sensing Technologies
Technology
Stereo Camera
Principle
Two cameras, displaced horizontally to obtain
different views of the scene. Calculate depth from
relative positions of objects in the two perspectives
Technology
Triangulation
Principle
Project Laser dot or line to the scene from a laser
source with known displacement to camera. Detect
with camera and calculate depth based on the
location in camera’s field of view

8. 8 MICROVISION, INC. COPYRIGHT 2016. ALL RIGHTS RESERVED.9/12/2016
3D Depth Sensing Technologies
Technology
Structured Light (Fixed or Variable pattern)
Principle
Project known pattern(s) of pixels on the scene.
Captured with Camera sensor. Based on deformation,
calculate depth and surface information of objects in
the scene
Technology
Time of Flight (ToF) Imager
Principle
Measure time from light emittance to reflection delay,
determine distance based on speed of light

9. 9 MICROVISION, INC. COPYRIGHT 2016. ALL RIGHTS RESERVED.9/12/2016
3D Depth Sensing Technologies
Technology
Time of Flight (ToF) - LIDAR
Principle
Emit pulse of light, detect reflection, measure the
delay between emitted and reflected light, determine
distance based on speed of light
Target Scene
Detector
Emitter
Reference Signal
Emitted Light
Reflected Light

10. 10
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9/12/2016
3D Sensing Technology Comparison
Technology Distance
Range
Depth
Accuracy
Acquisition
Speed
Hardware
Size
Software
Complexity
Low Light
Performance
Outdoor
Performance
Stereo Camera Mid range mm ~cm Medium Large High Weak Good
Structured Light
(Fixed Pattern)
Short range
(cm) to mid
range
(~5m)
mm ~ cm Fast Large Medium Good Weak
Structured Light
(Variable
Pattern)
Short range
(cm) to mid
range
(~5m)
μm ~ cm Medium Large High Good Weak
Triangulation Short range
(~1m) to
long range
(~40 m)
μm ~ cm Fast Large Low Good Good
Time of Flight Short range
(~1m) to
long range
(~100 m)
mm ~ cm Fast Medium Low Good Good

11. 11 MICROVISION, INC. COPYRIGHT 2016. ALL RIGHTS RESERVED.9/12/2016
Comparison of selected 3D Depth Sensing Solutions1
(Consumer Electronics & Near Field)
Advertised
Specification
Microsoft
Kinect V1
Microsoft
Kinect V2
Intel
RealSense
F200 & SR300
Intel
RealSense
R200
Softkinetic PMD Tech
Technology Structured
Light
ToF Camera Structured Light ToF Camera
(x2)
ToF Camera ToF Camera
Sensor
Manufacturer
PrimeSense Microsoft Intel Intel Texas
Instruments
Infineon
Depth “Camera”
Resolution
(pixel x pixel)
320x240 512x424 640x480 640x480 320x240 352x288
Depth “Camera”
frame rate (fps)
30 30 30 30 12 - 60 5 – 45
FOV [H x V]
(degrees)
57 x 43 70 x 60 72 x 60 70 x 59 74 x 59 62 x 45
Depth Range (m) 0.4-4.0 0.5 - 4.5 0.2 - 1.2 Up to 4 Up to 4 0.1 - 4
1Based on published advertised specifications

12. 12
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9/12/1016
MicroVision has developed MEMS Laser Beam Scanning Technology as a platform to address diverse
applications in large and growing markets
Mobile
Projection
Application Industry Drivers
Anytime, Anywhere Content Sharing
Industry
Growth
32.4%
AR / VR
Display
194%Personal Mobility
Heads-Up
Display
27%Driver Safety & Infotainment
Personal Projection: CAGR 2014 – 2019, Source: TechNavio; AR / VR Display: CAGR 2014 – 2019, Source: TechNavio; Heads-Up Display: CAGR 2014 – 2024, ABI Research
Case Study: MicroVision MEMS, One solution, multiple markets
Platform
Technology

13. 13 MICROVISION, INC. COPYRIGHT 2016. ALL RIGHTS RESERVED.9/12/2016
PicoP® Scanning Technology - Projection Display
Red laser
Green laserBlue laser
2D MEMS
Micro mirror
Case Study: How PicoP® Scanning Technology Works
A single MEMS
scanning mirror
in an extremely tiny,
low power package

14. 14 MICROVISION, INC. COPYRIGHT 2013. ALL RIGHTS RESERVED.9/12/2016
Case Study: MicroVision MEMS Evolution
 MicroVision MEMS development started in 1997 to enable the long term cost and size goals
Gen-1Vacuum Scanner (~4 cc) Gen-2Vacuum Scanner
(~2 cc)
Early Gen-3 Atmospheric
Scanner (~2 cc)
Gen-3Atmospheric
Scanner (< 1 cc)
Gen-3 G3T-P5 0.65 cc
 Gen 3 MEMS Scanner: Simplified Magnetic Drive for Atmospheric Operation
 Early Generation MEMS Scanners: Magnetic plus Capacitive drive

15. 15
MICROVISION, INC. PROPRIETARY AND CONFIDENTIAL
COPYRIGHT 2016. ALL RIGHTS RESERVED.
9/12/1016
The same MicroVision MEMS can also be applied for 3D Imaging & Sensing Applications.
Mobile
Projection
Application Industry Drivers
Anytime, Anywhere Content Sharing
Industry
Growth
32.4%
AR / VR
Display
194%Personal Mobility
Heads-Up
Display
27%Driver Safety & Infotainment
Personal Projection: CAGR 2014 – 2019, Source: TechNavio; AR / VR Display: CAGR 2014 – 2019, Source: TechNavio; Heads-Up Display: CAGR 2014 – 2024, ABI Research; 3D Imaging & Sensing: CAGR 2014 – 2020, Source:
Markets&Markets;
Case Study: MicroVision MEMS, One solution, multiple markets
Platform
Technology
3D Imaging
& Sensing
23.4%Information Capture & Interaction

16. 16
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Red laser
Green laser
Blue laser
2D MEMS
Micro mirror
IR laser
IR Photodiode
Measure time of flight from IR laser light emittance to photodiode
reception. Calculate distance based on speed of light.
Combined RGB Projection Display & Depth Sensing
👈
👈
Case Study: How MEMS Technology for Depth Sensing works
Applications:
• Natural User Interfaces
• 3D Scanning
• Industrial & Medical
• Metrology

17. 17
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2D MEMS
Micro mirror
IR laser
IR Photodiode
👈
👈
Case Study: How MEMS Technology for Depth Sensing works
IR laser
IR laser
Depth Sensing only
Applications:
• Robotics
• Navigation
• Mapping

18. 18
MICROVISION, INC. PROPRIETARY AND CONFIDENTIAL
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9/12/1016
Case Study: Unique capabilities of MicroVision
MEMS Laser Scanning for Depth Sensing
Feature
PicoP® Scanning Technology
Targets Benefit
Size Smallest size, thinnest (6mm) Enables new class of devices
Platform
Technology
Same platform for both Projection
Display and Depth Sensing
Enables interactive displays from single
integrated platform
Flexibility Programmable:
• Variable resolution
• Variable frame rate
• Supports both Time of Flight and
Structured Light
Wide variety of resolution and frame
rate combinations.
Enables both slower high resolution and
faster lower resolution captures from
the same platform.
Time of Flight Integrated IR laser(s) and Photo
Detector
Compact size, integrated device. No
camera sensor needed.
Structured
Light
Integrated IR laser(s) and separate IR
camera
Focus free structured light with
Programmable & Dynamic Patterns
Depth map
resolution
~128 – 2,308 x ~180 - 720 Variable resolution as needed by
application
Frame rate 15 ~ 120Hz Variable frame rate and latency as
needed by the application
Pixel
Persistence
~ 15ns Blur-free capture of moving objects

19. 19
MICROVISION, INC. PROPRIETARY AND CONFIDENTIAL
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9/12/2016
Conclusion & Call to Action
• 3D Sensing is a new fast growing application area for tomorrow’s Internet of Things presenting new
opportunities for Sensor industry and supply chain.
• 3D depth sensors can be implemented with variety of technologies, but MEMS based sensors can
provide unique capabilities to enable new product innovation and consequently drive further MEMS
and sensor industry growth.
• Designing platform solutions that can be applied to variety of applications can reduce development
costs and shorten time to market for new applications.
• In addition to producing great MEMS and Sensor hardware, collaboration with 3rd party software
developers (middleware, algorithms, OS platforms) is needed to enable full stack MEMS based off-
the-shelf advanced sensor solutions that reduce time from product idea to working prototype and
ultimately reduce time to market for innovative new products.

20. DON’T JUST THINK OUTSIDE THE BOX.
SEE OUTSIDE THE BOX.
© 2016 MICROVISION, INC. ALL RIGHTS RESERVED.
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