The IEW will include invited seminars, technical sessions, special interest groups (SIGs), discussion groups, and invited speakers. The IEW especially invites submission of late-breaking exciting new research to stimulate discussion and interaction around new ideas, encouraging new research topics. To maintain the unique IEW experience and provide ample opportunity for informal discussions, the 2016 IEW workshop presentation format for Technical sessions will begin with each author presenting a brief summary to highlight key findings, followed by an interactive poster-based discussion session among authors and attendees. The IEW is closely aligned with the EOS/ESD Symposium for collaborative conference activities.

1. 10thAnnual International Electrostatic Discharge Workshop
May 16-19, 2016
Evangelische Akademie, Tutzing, Germany
https://www.esda.org/events/iew/
2016 International Electrostatic Discharge Workshop
Located on the shores of Lake Starnberg,
30 kilometers Southwest of Munich, lies
the Tutzing estate and its 18th century
mansion. It has been chosen as the venue
of our workshop with its modern conference
rooms and facilities. The spirit of this place
encourages thoughtful discussions and
intensive interaction.
2016 International Electrostatic Discharge Workshop
Call For
Presentations
The IEW will include invited seminars,
technical sessions, special interest groups
(SIGs), discussion groups, and invited
speakers. The IEW especially invites
submission of late-breaking exciting new
research to stimulate discussion and
interaction around new ideas, encouraging
new research topics. To maintain the
unique IEW experience and provide ample
opportunity for informal discussions, the
2016 IEW workshop presentation format
for Technical sessions will begin with each
author presenting a brief summary to highlight
key findings, followed by an interactive
poster-based discussion session among
authors and attendees. The IEW is closely
aligned with the EOS/ESD Symposium for
collaborative conference activities.
Two special attention focus issues
for IEW 2016 include:
Abstract Submission Deadline Nov. 20, 2015
Setting the Global Standards for Static Control!
EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA
PH +1-315-339-6937 • Email: info@esda.org • www.esda.org
Automotive Applications EOS/ESD/EMC
The electronic content of automobiles
is increasing, leading to more complex
electronic modules and increasing complexity
of meeting integration and reliability
requirements for Integrated Circuits. The
IEW invites contributions that address EOS,
ESD and EMC challenges in automotive IC
design, including complying with standards
such as Bulk Current Injection (BCI), Direct
Power Injection (DPI), IEC-61000-4-2 and
ISO-10605.
ESD Co-Design—Trade-offs between
Requirements for IC Operation,
Component-level ESD, System-level ESD,
EOS Sensitivity
Often, the complexity of an ESD design is
increased by the trade-offs required to avoid
interfering with other design requirements.
The IEW invites contributions that highlight
particularly challenging requirements, unique/
novel solutions to meeting those requirements
or unexpected interactions between an
ESD implementation and another design
requirement.
Anomalous/Unresolved ESD Issues
Random and unrepeatable ESD failures,
Case Histories, ESD tester correlation issues,
or unique window failures. Unresolved issues
that encourage discussion are welcomed!
EDA EOS/ESD Tools Best Practices and
Experiences
EDA EOS/ESD verification and simulation
tools; techniques, design-flows and best-
practices. Experiences with Foundry rule
decks, commercial tools and custom tooling
are all welcomed.
System-Level ESD/EOS Issues
On- and off- chip IEC protection clamps,
component/system ESD co-design case
studies, cable discharge clamps, transient
latch-up, design of system-level clamp
circuits, system level ESD test issues and
scan techniques, ESD-induced soft errors,
and EOS field-failure case studies/ histories/
solutions.
Failure Analysis Techniques
Locating failure sites, in particular CDM,
imaging techniques, correlating FA identified
damage site with ESD stress, distinguishing
EOS-like failures from ESD failures, and
unusual failure modes.
Technology Integration Issues
ESD sensitivity with technology transfers,
3D IC ESD design issues, qualification
challenges for different fabs, unusual
problems of process interaction with ESD,
process monitor methods, and technology
scaling issues.
Novel On-Chip Protection Clamps and
Circuit Configurations
New clamp devices and clamp configurations,
methods to increase the failure threshold of
protected devices, high voltage clamps for
automotive and power amplifiers, out-of-the-
ordinary chip protection concepts, and low-
capacitance clamps for RF and SERDES.
ESD Test Characterization, Methods, &
Issues
TLP&vfTLPdebuganddevicecharacterization
methods, correlation between TLP & vfTLP
tests with standard qualification tests, HBM
and CDM tester artifacts, issues relating test
qual levels to real-world exposure, test chip
methodology, cable discharge test methods,
and test standards issues.
Areas the IEW would also like you to consider as abstract submission
topics include:

2. Management Committee:
Management Committee Chair:
Souvick Mitra, GLOBALFOUNDRIES
Technical Program Chair:
Hans Kunz, Texas Instruments, Inc.
Seminar Chair:
Mirko Scholz, imec
Invited Speaker Co-Chairs:
Lorenzo Cerati, STMicroelectronics
Michael Mayerhofer, Infineon Technologies
Discussion Groups/Special Interest
Groups Co-Chairs:
Christian Russ, Intel Mobile Communications
Patrice Besse, Freescale
Keynote Speaker Chair:
Christoph Thienel, Robert Bosch GmbH
Audio/Visual Co-Chairs:
Nathan Jack, Intel
Chen Shih-Hung, imec
Arrangements Chair:
Harald Gossner, Intel Mobile Communications
Publicity Co-Chairs:
Bart Keppens, Sofics
Matthew Hogan, Mentor Graphics
Asian Publicity:
Kitae Lee, Samsung
US Publicity:
Charvaka Duvvury, ESD Consulting LLC
Industry Council Advisor:
Charvaka Duvvury, ESD Consulting LLC
ESDA IEW Business Unit Manager:
Alan Righter, Analog Devices
ESDA HQ Director of Operations:
Lisa Pimpinella
ESDA Education Business Unit Manager:
Ginger Hansel, Dangelmayer Associates
Technical Program Committee:
Efraim Aharoni, TowerJazz
Warren Anderson, Synopsys
Fabrice Blanc, ARM
Fabrice Caignet, LAAS
Jordan Davis, On Semiconductor
James Di Sarro, Texas Instruments
Eleonora Gevinti, STMicroelectronics
Hang-Gu Kim, Samsung
Dimitri Linten, imec
Alain Loiseau, IBM
Timothy Maloney, Intel
Markus Mergens, QPX GmbH
Rahul Mishra, GLOBALFOUNDRIES
Dionyz Pogany, Vienna University of Technology
Wolfgang Reinprecht, AMS
Javier Salcedo, Analog Devices
Augusto Tazzoli, Maxim Integrated Products
Jim Vinson, Intersil
Joost Willemen, Infineon Technologies
Submission Instructions
In keeping with the informal character
of this workshop, please prepare
your abstract in the form of a short
powerpoint presentation. After the
title slide, the second slide of the
presentation should describe the
objective and significance in a 200
word summary. The presentation
should not exceed 5 additional
slides; with representative data and
figures that will be the foundation
for the poster you plan to present
at the workshop. Please save your
presentation abstract in pdf format and
email including title, author affiliation,
and e-mail address to iew@esda.org
no later than November 20, 2015.
The submission format is a PDF®
file (Adobe Acrobat®). Notification of
acceptance will occur by December
16, 2015. Final, full presentations for
the workshop in MS PowerPoint®
format must be received by April 15,
2016.
There will be no published proceedings
of the workshop. For any questions
please contact the Technical Program
Chair, Hans Kunz (hkunz@ti.com).
The IEW encourages student
submissions by providing a 50%
discount in registration fees for a
limited number of student presenters.
Proof of student status must be
submitted along with the abstract for
the workshop presentation.
Lodging & Facilities
Located on the shores of Lake
Starnberg, 30 kilometers Southwest
of Munich, lies the Tutzing estate and
its 18th century mansion. It has been
chosen as the venue of our workshop
with its modern conference rooms and
facilities. The on-site single and double
bedrooms provide a comfortable stay
within the quietness of the private park
around the castle. From the balconies
and the patios there is a magnificent
view of Bavarian Alps. The spirit of
this place encourages thoughtful
discussions and intensive interaction.
Lodging for Monday, Tuesday, and
Wednesday nights, plus meals
starting with Monday Lunch-Thursday
Breakfast are included in the
registration costs for the workshop.
Attendees are allowed to bring guests
who will be charged separate fees.
Please check our web page at www.
esda.org/events/iew for regular
updates on the workshop. As it
becomes available, we will post
information on the full technical
program including the seminar topics,
the keynote speaker, the technical
sessions, as well as the discussion
group and special interest group
topics. In addition to peer-reviewed
presentations, attendees will also
have the option to present non-peer-
reviewed posters at the workshop.
Please also go to the web page for
information on workshop registration,
as well as the Tutzing area.
Setting the Global Standards for Static Control!
EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA
PH +1-315-339-6937 • Email: info@esda.org • www.esda.org