Aspocomp is a PCB technology company that serves industries such as automotive, telecommunications, industrial, and defense. They offer advanced PCB manufacturing capabilities including HDI, RF, and heat management technologies. Aspocomp aims to optimize customer designs through close cooperation and provides extremely fast delivery times. Their state-of-the-art facility in Finland includes in-house manufacturing processes certified to IPC and automotive standards.

1. Aspocomp Presentation

2. Aspocomp – PCB Technology
Company
Today Aspocomp is serving various business segments:
– Automotive
– Industrial and Consumer industries
– Telecommunications
– Semiconductor R&D
– Defence and Security
At Aspocomp we recognize that
– Product development requires close cooperation with manufacturing —
Aspocomp helps its customers to optimize their designs by utilizing its
long experience and up-to-date knowledge of advanced PCB production
– Time-to-market is essential — Aspocomp has proven track record in
providing extremely fast deliveries for prototype, ramp-up and
exceptional PCB needs
PCB = Printed Circuit Board

3. Own manufacturing in Finland
ASPOCOMP FACTS:
• PCB’s from Oulu since 1979
• Total capacity ~3000m2 /
month depending of
product mix
• ISO 9001 & 14001 certified
• Personnel 105 with 20
engineering
• State of the art PCB facility serving volumes
from prototypes to small series
• Advanced PCB manufacturing technologies
and services:
• All manufacturing processes in house
• IPC Class III
• Automotive / TS certified
• DFM to optimize PCB designs
• Tailormade PCB trainings
Oulu

4. Net Sales by Application & Product Type (2015)
RF materials represent 16% of the total
production
Overplated vias also known as:
- IPC4761 Type VII
- Plug & Plate
- Capped Via
- Filled and Capped Via
- POFV – Printed Over Filled Via
- VIPPO – Via In Pad Plated Over
46%
26%
17%
11%
Telecom systems & applications
Automotive electronics
Industrial electronics
Other electronics

5. Aspocomp Going Forward
Strategy path 2014-17
Evaluate
opportunities
&
Set Targets
2014
Expand
customer
base
2015
Accelerate
Growth2016
Deliver2017
Expand Customer base
Broader End Market Segments
Expand Offering:
-Flex
-Assembly
New Area: North America
TS –certification
Operational effiency
Win Market share
Growth 10+%
Invest more Anylayer capacity
Independency of single customers
or Segments
Automotive, Industrial, Defence, Medical
Deliver the Year
New Strategy
Customer focus
Streamline Production
Annual Growth
Major growth from Global Supply Chain
More Volume, Any Technology, All Products
Operational Exellence

6. Volume Supply Services
• Since early 2000 for very large volumes. Since 2011
leveraging services to suit better also medium sized volumes
• Today Aspocomp has 8, VDA 6.3 audited and approved
suppliers
• Dedicated logistics and
quality assurance organization
in Finland and in China
• Aspocomp provides
and guarantees
– Design for manufacturability
– Smooth product transfer
– Quality assurance & control
– Logistic services

7. World class in High Tech – High
Speed deliveries
• Fastest lead-times, FCA Finland*
– 2L: 24 hours
– 4-28L: 2 working days
– 1+nb+1: 3 wd
– 3+2b+3: 5 wd
– 4+2b+4: 7 wd
– Anylayer 8L: 10wd
– Cavity coin: 8 wd
• Logistics to North America
– Standard + 3wd
– Express +2wd
– Super Express + 1wd
HDI 3+2b+3
8L Anylayer
Coin PCBs
•FCA = Free on Carrier
•Fastest lead times, please check
material availability in advance

8. Investments and Products

9. Recent and Planned Capability
Investments
2010
2011
2012 2013 2014 2016
Outer-layer and SM LDI
for high resolution imaging
with automation
Horizontal viafill plater
for Cu viafill capacity and
Cu consistency
UV-CO2 laser for
laser drilling and
cutting
CCD routing/drilling
machine, for heavy
metal + high precision
New plasma
etching machine
2015
X-ray drilling for
high precision (PTH
to Cu)
2017
High precision drilling for
PTH to Cu improvement
High accuracy DES for
high accuracy line width
and impedance control
Insertion loss
simulation and test
UV-CO2 laser
for laser drilling
and cutting

10. Advanced Product Snapshot
• Advanced HDI PCBs
– Standard HDI like 1+18b+1
– Stacked microvia like 3+6b+3
– Anylayer HDI
• PCBs for High Speed Digital
– Multilayer, high layer count
– Special materials
• PCBs for RF
– Mixed RF laminates with FR4
– Teflon, including multilayers
• PCBs for Heat Management
– Metalback, copper coin
– Thermal via farm

11. Advanced HDI for high density
routing
• One of our production lines is especially fine-tuned to
manufacture HDI PCBs
– Large and thick HDI PCBs
– Thin stacked microvia constructions
– Line/space down to 50/50µm
• HDI constructions such as
– 1+18b+1
– 2+4b+2
– 3+2b+3
– 4+2b+4
– Alµ
HDI = High Density Interconnection

12. PCBs for High Speed Digital
• Variety of low loss materials
• Spread glass, VLP foil
• High accuracy impedance control
• Mixed material combinations with FR4
• HDI buildup layers with special materials
• Low Dk, Low Df

13. PCBs for RF
• Mixed stack-up, RF laminate and FR4
• PTFE laminates, also for multilayer PCBs
• Dk range from 2.5 to 10.0, extremely low Df
• Combined with heat management (metal
back, coin, thermal viafarm)

14. PCBs for heat management
• Heatsink PCBs (metal back)
– Pre-bonded copper/aluminum-back
PCBs and post-bonded aluminum-back
products.
– Conductive and non-conductive
adhesives
• Via farms, over plated thermal vias
• Local cooling, coins
– Embedded cavity coins

15. Multilayer
• Multilayer PCBs of up to 38L
• Capability to go beyond this level up to the board thickness of 6 mm
• Special structures such as sequential build and overplated vias*
• Several applications for industrial, telecommunication automotive
electronics
Overplated vias also known as:
- IPC4761 Type VII
- Plug & Plate
- Capped Via
- Filled and Capped Via
- POFV – Printed Over Filled Via
- VIPPO – Via In Pad Plated Over

16. Surface Finish Options
ENIG
ENIG /OSP (SIT)
OSP
HASL SN100
(Leadfree, leaded
also available)
Immersion tin
Immersion silver
ENIG
Electrolytic Ni/Au

17. Summary & Contact
information
With Aspocomp You will have access to
– High level PCB technology manufacturing to support
challenging projects
– Design support for projects in early stage
– Fastest quick turn lead-times
– World class quality
For more details and enquiries:
Tero Päärni, Vice President Sales
tero.paarni@aspocomp.com
Mobile: +358 40 5606876