The most active geographic regions in terms of innovation in the 5G technology are China with 372 668 patents, Japan with 258 106 patents, United States with 99 786 patents and South Korea with 44 895 patents. The number of patents published under the PTC (international) status are 84 094, and the patents published in Europe are 37 085.
Amongst the main applicants related to the 5G technology, there are Qualcomm, Huawei Technologies, Samsung electronics, Intel, Ericsson, and LG electronics.
The number of patents published during the period 2011-2020 increases annually with a CAGR of about 15%. The number of patents published in 2011 were 28 012 and in 2020 were 113 258.
This document summarizes innovations related to an inter-slice sharing in communication networks for 5G core networks from Huawei Technologies, an multi-slice support for MEC(Multi-Access Edge Computing)-enabled 5G deployments from Intel Corporation and a transmitter/receiver module for millimeter wave -5 G-mimo communication systems from Infineon Technologies.
2. Briefly summary
This documents includes a global general patent landscape about the 5G technology.
The most active geographic regions in terms of innovation in the 5G technology are China with 372
668 patents, Japan with 258 106 patents, United States with 99 786 patents and South Korea with 44
895 patents. The number of patents published under the PTC (international) status are 84 094, and
the patents published in Europe are 37 085.
Amongst the main applicants related to the 5G technology, there are Qualcomm, Huawei
Technologies, Samsung electronics, Intel, Ericsson, and LG electronics.
The number of patents published during the period 2011-2020 increases annually with a CAGR of
about 15%. The number of patents published in 2011 were 28 012 and in 2020 were 113 258.
This document summarizes innovations related to an inter-slice sharing in communication networks for 5G core
networks from Huawei Technologies, an multi-slice support for MEC(Multi-Access Edge Computing)-enabled 5G
deployments from Intel Corporation and a transmitter/receiver module for millimeter wave -5 G-mimo
communication systems from Infineon Technologies.
MAYRA ALEJANDRA FUENTES 2
3. Number of patents per country related
to the keyword 5G
372,668
258,106
99,786
44,895
17,424 14,915
7,83 7,511
84,094
37,085
0
50
100
150
200
250
300
350
400
China Japan United States of
America
Republic of Korea Canada Australia Germany France PCT European Patent
Office
International
publication
4. Number of patents per applicant related
to the keyword 5G
10271
10014 9988
8638
6940
3626
0
2000
4000
6000
8000
10000
12000
QUALCOMM HUAWEI TECHNOLOGIES SAMSUNG ELECTRONICS INTEL TELEFONAKTIEBOLAGET LM
ERICSSON
LG ELECTRONICS
Numberofpatents
Company
6. Number of patents related to keyword
5G per year
28012
31724
33959
40505
43753
52622
63027
86417
111492 113258
0
20000
40000
60000
80000
100000
120000
2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
Number of patents per year
Series2
7. Heterojunction bipolar transistor
with field plates
Description: Power amplifiers in radio frequency
circuits are typically implemented as
heterojunction bipolar transistors suitable for
applications such as 5G systems. The circuits are
expected to operate at very high speeds, e.g., up
to 100 GHz
Applicant: Qualcomm
Publication number: WO/2020/167363
International publication number:
PCT/US2019/064816
MAYRA ALEJANDRA FUENTES 7
8. Massive MIMO antenna
Description: Invention related to the mobile
communication technology, which discloses a
Massive MIMO antenna. The miniaturization and
light weight of a 5G base station antenna system
are realized, and mass production of 5G equipment
is facilitated.
Applicant: Wuhan Hongxin Telecommunication
Technologies
Country: China
Publication number: CN111180871
MAYRA ALEJANDRA FUENTES 8
9. Transmitter/receiver module for millimeter
wave -5 G-mimo communication systems
Description: Transmitter/receiver module that
contains an integrated control circuit which is
designed to operate in a transmitting and
receiving mode. The drawing at the right side
illustrates a detailed schematic view of a GaN-
based power amplifier and connections to an
integrated control circuit according to an
exemplary embodiment.
Country : Germany
Applicant: Infineon Technologies
Publication number: DE102017220853
MAYRA ALEJANDRA FUENTES 9
10. Mobile terminal having an antenna
including dielectrics on a circuit board
Description: Mobile terminal that includes a
terminal body and an antenna device configured
to generate a resonant frequency of a frequency
band for 5G communication system.
Country : United States
Applicant: LG electronics
Publication number: US20200194873
Publication kind: B1
MAYRA ALEJANDRA FUENTES 10
11. Inter-slice sharing in 5G core
technologies
Description: The invention relates to devices,
systems and methods for inter-slice sharing in
communication networks, in particular 5G
core networks.
Applicant: Huawei Technologies
Publication number: WO2020043275
MAYRA ALEJANDRA FUENTES 11
12. Multi-slice support for MEC-enabled
5G deployments
Description: System configured to track
network slicing operations within a 5G
communication network includes processing
circuitry configured to determine a network
slice instance (NSI) associated with a QoS flow
of a UE.
Applicant: Intel Corporation
Publication number: WO2020185794
MAYRA ALEJANDRA FUENTES 12
13. 5G mm-wave antenna architecture
with thermal management
Description: Embodiments include an electronic
package that includes a radio frequency (RF)
front end.
Country : United States
Applicant: Intel Corporation
Publication number: US20200076046
Publication kind: A1
MAYRA ALEJANDRA FUENTES 13