RCC is a multilayer PCB board material consisting of a thin copper foil with a resin coating. The resin, usually epoxy resin 60-80 um thick, is coated onto the copper foil and then cured. This allows the copper foil to act as both a conductor and insulating layer when manufacturing multilayer boards using new techniques like laser drilling of microholes. FR-4 is commonly used and its glass transition temperature (Tg) can be improved to 160-200 degrees through modifications to increase heat resistance. High performance CAF resistance boards are important as electronic components become smaller and more densely packed, increasing the risk of ion migration causing short circuits between conductors.

1. The Base Material of PCB Board
Today we mainly introduce Multilayer PCB board material: Resin copper-clad (RCC)
Resin copper-clad(RCC)
Definition: RCC is electrolytic copper foil in very thin thickness (generally no more
than 18 um) precision of coarsening surface coated with a layer or two layers of
special epoxy resin or other high performance resin (resin thickness generally 60-80 -
um), the solvent was taken off by the oven drying, resin off half solid piece reach B
order form. During the production process of HDI multilayer board, RCC replace the
traditional coherence slice and the role of the copper foil, conductive as insulating
medium layer, not mechanical drilling technology can be used (usually a laser into a
hole and other new technology) microporous formation, achieve electrical connection,
so as to realize the high density of PCB.
The constitute of RCC：
RCC: of RCC is coating a layer of high performance resin composite material which
can meet specific performance requirements on Ultra-thin coarsening surface of
copper foil, and then to be half cured in oven,
On the coarsening surface, it will form a layer of resin with uniformity thicknedd on
copper foil.
Base material common performance indicators: TG temperature
Glass transition temperature (Tg)
At present, the Tg value for FR-4 is usually 130-140 degrees, however in the PCB
production process, there are a few process which will over this range, this will bring
certain influence to the performance of final product. Therefore, Improving Tg degree
is one of a main method for improving heat resisting property of FR4
One of the important means is improving the link density of curing system or
increasing the content of aromatic base in resin formula. In general FR - 4 resin
formula, introduced in part three functional groups and multi-function of epoxy resin
and introduction of some phenolic type epoxy resin, increase the Tg value to around
160-200 degrees.
High-performance plank: CAF resistance plate
CAF resistance plate
With the rapid development of electronic industry, electronic products are light, thin,
short, small, and the PCB hole spacing and line spacing becomes smaller and smaller,
line is becoming more and more close, so that the ion migration resistance
performance of the PCB is becoming more and more attention. Ion migration
(Conductive Anodic Filament (CAF), was first discovered by researchers at bell
LABS in 1955, it refers to metal ions under the action of electric field in non-metallic
medium the electro-migration of chemical reaction, the circuit to form a Conductive

2. path between the anode and cathode and cause short circuit.
Wonderful PCB
T +86-755-86229518-866 | Emial: wonderful11@wonderfulpcb.com |
http://www.wonderfulpcb.com | Skype: wonderfulpcb11