삼성전기, 초소형 복합기능
        휴대폰부품 FEM 국내 첫 개발
        게재: 2001년 05월 24일 (전자엔지니어)

        삼성전기가 유럽향 듀얼 휴대폰에 사용되는 핵심부품 FEM(Front...
What is LTCC?

      ♦ High density glass/ceramic multilayer technology
      ♦ Technology used to create passive componen...
Thin film and LTCC

                            Thin film                LTCC
      Wiring density        Very high       ...
Thermal via




                                                           For heat release
                              ...
LTCC materials: electrode, R,and C

         Electrode
         1. Typical material : Ag or Cu
         1. Chemical compat...
Typical LTCC process

     1. Precondition : make optimum condition for processing
       - heat treatment at 120oC for 20...
Typical LTCC process

     ♦ mil: milli inch = 0.001 inch
                                        Via

                   ...
Typical LTCC process

                                   Minimum via-to-via spacing
                        Within the    ...
Layer Naming Scheme




                              http://www.vtt.fi/ele/research/ope/pdf_files/lcdes.pdf
Advanced Elec...
Typical LTCC process

     1. Surface resistor
     - as fired tolerance : ± 30% in resistance
     - laser trimmed tolera...
LTCC example: Bluetooth




    What is Bluetooth? New communication standard for wireless connectivity.
    Why the name ...
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Aem Lect19

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Aem Lect19

  1. 1. 삼성전기, 초소형 복합기능 휴대폰부품 FEM 국내 첫 개발 게재: 2001년 05월 24일 (전자엔지니어) 삼성전기가 유럽향 듀얼 휴대폰에 사용되는 핵심부품 FEM(Front End Module)을 개발했다. 가로(8.4mm) X 세로(5.0mm) X 높이(1.9mm)의 크기로 7개의 낱개 부품을 사용할 때보다 부피를 80퍼센트 줄여주는 FEM은 휴대폰에 사용되어 송신과 수신신호를 분리시켜 주며, 여러 주파수 중 필요한 주파수만을 선택해 통과시켜주는 역할을 담당하는 다기능 부품이다. 이 부품은 기존 부품보다 가격면에서 25퍼센트 저렴하다. 삼성전기 측은 이 제품의 개발을 위해 1mm 높이의 LTCC(저온 소성 세라믹)기판에 적층 설계 기법을 사용하여 13층의 회로를 구현했으며, SAW 필터를 내장시켜 고주파 회로에서 저항을 최소화하는데 성공했다고 전했다. 일본의 히타치 외에 다른 업체들이 모두 개발 중에 있는 FEM은 히타치 제품에 비해 크기가 작아 큰 호응을 얻을 수 있을 것으로 기대되고 있다. 올해 세계 휴대폰 시장의 예상 규모가 5억3천만 대이고 그 중 60퍼센트가 유럽향 휴대폰이며, 그 대부분이 듀얼폰임을 감안할 때 FEM의 시장규모는 4억 달러 이상이 될 것으로 예상된다. 삼성전기 FEM의 본격 양산은 올 4사분기에 시작되며, 국내에서 최초 생산되지만 중국 시장 공략을 위해 텐진 공장에서 대량 생산을 할 계획이다. 삼성전기는 연간 1천만 대 이상의 유럽향 휴대폰을 생산하는 국내 휴대폰 업체들에 FEM을 공급해 1천만불 이상의 수입대체 효과를 거둘 것이며, 앞으로 플립칩 SAW 필터를 적용한 6.5 X 5.2 X 1.8mm의 초소형 제품을 개발, US PCD 대역까지 커버하는 트리플모드 복합제품도 개발할 것이라고 밝혔다. Advanced Electronic Ceramics I (2004) Why LTCC in RF business? 1. Highly conductive materials are required for reducing loss in high frequency regime - the W in HTCC is not satisfactory - low-temperature firing( at ~ 850oC) enables the use of Ag electrode 2. Cost benefit Figure from http://www.dupont.com/mcm/ Advanced Electronic Ceramics I (2004)
  2. 2. What is LTCC? ♦ High density glass/ceramic multilayer technology ♦ Technology used to create passive components such as capacitors, resistors & inductors ♦ Use with photo patterned materials gives high performance ♦ Allows direct attach of silicon and GaAs integrated circuits ♦ Parallel processed technique - all layers produced separately and co-fired in single process ♦ Ag & Au based conductors ♦ Buried and surface resistors, capacitors and inductors ♦ Low loss tape allows integration of filters, couplers etc. From http://www.dupont.com/mcm/ Advanced Electronic Ceramics I (2004) Messages from LTCC ♦ Cost (simple lamination and sintering) ♦ Size (Integration) ♦ Performance ♦ Time To Market ♦ Design Flexibility (parallel process technique) ♦ Modularity of the passive components From http://www.dupont.com/mcm/ Advanced Electronic Ceramics I (2004)
  3. 3. Thin film and LTCC Thin film LTCC Wiring density Very high high Size Very small small Process serial parallel Cost high-cost cost-effective (Chemical etching…) (screen printing & Sintering) Time to market Long Short 1 week prototypes; 2 weeks production Production scale Mass production Not only large but also Small-scale production Design flexibility Moderate Very good From http://www.dupont.com/mcm/nextgen-handsets/handsets18.html Advanced Electronic Ceramics I (2004) LTCC: technology trends in RF Advanced Electronic Ceramics I (2004)
  4. 4. Thermal via For heat release thermal conductivity 2-6 W/moK for LTCC 15-240 W/moK for HTCC Thermal conductivity - Alumina 100 times FR4 - LTCC 20 times FR4 - Thermal vias can be included - LTCC allows heat pipe approach From http://www.dupont.com/mcm/nextgen-handsets/handsets18.html Advanced Electronic Ceramics I (2004) LTCC materials 1. Borosilicate glass + Al2O3 (or mullite, cordierite) : Al2O3 : 20-80%, B2O3, SiO2:10-70% : the borosilicate component was added to the basic HTCC(Al2O3) composition in order to decrease the sintering temperature 2. The role of Al2O3 (or mullite, cordierite) - increase dielectric constant - increase strength of LTCC 3. The decrease in dielectric constant can be attained by increasing glass content 4. Other additives : K2O, Na2O, CuO, Fe2O3, Bi2O3, TiO2 Materials Issues 1. Increase in mechanical strength for soldering and post heat-treatment 2. The development of the composition with a low dielectric constant for the high-frequency application Private communication with Dr. Jae-Hwan Park in KIST Advanced Electronic Ceramics I (2004)
  5. 5. LTCC materials: electrode, R,and C Electrode 1. Typical material : Ag or Cu 1. Chemical compatibility 2. No interdiffusion between the electrode and LTCC substrate 3. No delamination due to the shrinkage mismatch and dewetting Internal capacitor 1. BaTiO3 + SiO2, PbO, B2O3, Na2O, K2O, Al2O3 2. Match the sintering temperature for co-firing with LTCC 3. PMN, PFN-PFW can be used Internal resistor 1. RuO2, Pb-pyrochlore, Bi-pyrochlore Private communication with Dr. Jae-Hwan Park in KIST Advanced Electronic Ceramics I (2004) Typical LTCC process Slit and Blank Pre-condition Layer 1 Layer 2 Layer 3 Layer 4 Form Vias Form Vias Form Vias Form Vias Fill Vias Fill Vias Fill Vias Fill Vias Conductor 1 Conductor 2 Conductor 3 Collate/Laminate Burnout/Co-fire Surface Layer Personalization Singulation Advanced Electronic Ceramics I (2004)
  6. 6. Typical LTCC process 1. Precondition : make optimum condition for processing - heat treatment at 120oC for 20-30 min - storage in nitrogen atmosphere for 24h 2. Blanking : punching for the sheet alignment using punch or lasor 3. Via fill : screen printing or extrusion 4. Printing conductor 5. Drying at 120oC for several minutes 6. Lamination at ~70oC Advanced Electronic Ceramics I (2004) LTCC: Example Low temperature sintering : ~ 850oC Employ the Ag electrode http://www.murata.com/murata/murata.nsf/pages/multilayer/ Advanced Electronic Ceramics I (2004)
  7. 7. Typical LTCC process ♦ mil: milli inch = 0.001 inch Via Catch Pad ♦ Vias on the same layer At least 3d for RF isolation d: via diameter Advanced Electronic Ceramics I (2004) Typical LTCC process Exposed Vias : maximum 22 layers Buried Vias: Maximum 12 layers Stagger Advanced Electronic Ceramics I (2004)
  8. 8. Typical LTCC process Minimum via-to-via spacing Within the Between tape Via to edge same tape layer layer http://www.vtt.fi/ele/research/ope/pdf_files/lcdes.pdf Advanced Electronic Ceramics I (2004) Typical LTCC process 1. Minimum conductor line width(A) : 200 µm 2. Maximum conductor line width : 1.5 mm 3. Minimum conductor spacing(B) : 200 µm 4. Minimum conductor line spacing(C) : 275 µm 4. The minimum conductor line clearance to the substrate edge(D): 125 µm 5. Minimum SMD pad spacing to a via pad (F) : 200 µm 6. Minimum SMD pad spacing to a conductor line (F) : 200 µm 7. Minimum SMD pad spacing to substrate edge (G) : 500 µm http://www.vtt.fi/ele/research/ope/pdf_files/lcdes.pdf Advanced Electronic Ceramics I (2004)
  9. 9. Layer Naming Scheme http://www.vtt.fi/ele/research/ope/pdf_files/lcdes.pdf Advanced Electronic Ceramics I (2004) Via filling machine Fill Small Vias In Green Ceramic Tape And Fired Substrates With Pressure Injection The VF-1000’s patented process is capable of filling vias as small as 2 mils (50 mm) in ceramic tape, fired substrates and various other microelectronics materials up to 8quot; (203mm) square in size. Unlike screen printing, the VF- 1000 does not use vacuum to assist in the filling process, minimizing the chance of a partial fill that can occur when attempting to fill very small vias. Also unlike screen printing, via ink in the VF-1000 is not continually exposed to air which prevents the evaporation of solvents in the ink and maintains a constant viscosity from the first part to the last. In the VF-1000 the via fill ink is contained in a bladder-like reservoir. When air pressure is applied to the bladder it VF-1000 INJECTION extrudes the ink through a stencil mask directly into the vias VIA FILL SYSTEM of the part you are filling. The mask is registered to the part using the same tooling pins that are positioning the part on - Fill Small Via Hole Completely the vacuum stage. The ink forced into the vias naturally - Air Pressure Fills All Holes Uniformly displaces any trapped air and fills all the vias in the part - The Via Fill Ink is Not Exposed to Air simultaneously. - Ability to Fill Fired Substrates http://www.ptchips.com/ Advanced Electronic Ceramics I (2004)
  10. 10. Typical LTCC process 1. Surface resistor - as fired tolerance : ± 30% in resistance - laser trimmed tolerance: ± 1% in resistance - trimmed resistor should be designed to fire to 75 % of its nominal value for the later trimming into larger R ex) considering the ± 30% fluctuation in resistance requires the 75 ohm in order to produce the 100 ± 1 ohm 75 X 0.70 = 52.5 ohm, 75 X 1.3 = 97.5 ohm if the resistor is within ± 30% of fluctuation in resistance, 75% will do. 2. Buried resistor - tolerance : ± 30% in resistance - trimming is not available Advanced Electronic Ceramics I (2004) LTCC process Stack Blank and and Tack Frame Module High Speed Firing Punch Screen Final Printing Product http://www.national.com/appinfo/ltcc/0,2583,367,00.html Advanced Electronic Ceramics I (2004)
  11. 11. LTCC example: Bluetooth What is Bluetooth? New communication standard for wireless connectivity. Why the name Bluetooth? Bluetooth was named after 10th Century Danish King Harold Bluetooth. King Harold was credited with uniting the provinces of Denmark under a single crown. Bluetooth technology is suppose to unite all different digital devices under a single standard of connection. Advanced Electronic Ceramics I (2004) Advantages of Thick Film and Green Tape in Automotive parts - Proven Reliability - High Circuit Density - Integral Components - Resistors & Functional Trimming - Direct Chip Attach - High Operating Temperature - TCE Match to Si & GaAs - Thermal Performance - Mixed Analog, Digital, RF - Integral Hermetic Packaging - High Frequency properties - Halogen free - Compatibility with Pb-free solders - Functional integration From http://www.dupont.com/mcm/nextgen-handsets/handsets18.html Advanced Electronic Ceramics I (2004)

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