This document discusses several innovative and environmentally-friendly packaging solutions developed by Antistat in collaboration with Farnell, including a peel pack solution, biodegradable bio bags, and new Jedec trays made from recycled materials. The solutions aim to reduce costs, packaging waste, and carbon footprints while still providing protection for electronic components during shipment and storage. Bio bags in particular offer the same level of protection as standard ESD packaging while being fully biodegradable.

1. Packaging Innovations
Working in collaboration with Antistat

2. Peel Pack Solution
Innovative, patented IC packaging solution, providing complete protection for small quantity shipments such as
sample management, small production runs, customer trials

3. • Clear product identification • All round protection in transit and storage
• Reduced moisture ingress • Use only what you need
• Anti static protection • Made from recycled material and is recyclable

4. • Eradicates pin damage
• Improved bin accuracy and reduced product damage
• Reduction in customer complaints
• Reduced packaging cost & dunnage due to smaller footprint
• Customer satisfaction rates increase
• Reduced packaging time

5. Bio Bag
Unique, fully biodegradable, static dissipative packaging solution for electronics and electronic components

6. This new, innovative packaging developed by Antistat exclusively for Farnell, provides an environmentally-
friendly alternative to standard polythene ESD packaging

7. Static charge decay: < 0.002s
Surface resistivity: < 1x1010 ohms/sq
• Offers the same level of protection as standard ESD packaging
• Fully biodegradable to the recognised European standard (EN13432)
• No harmful chemicals released into the environment
• Biobags can be disposed of in general waste but are most effective in industrial composting systems

8. “Estimated to replace 3.6 million
polythene bags despatched by
Farnell in Europe each year, with
plans in place to extend to APAC and
the Americas”.
Climate change and waste are growing global concerns. With the inherent static dissipative properties, it
represents an electronics industry-first and provides an opportunity for your business to make a real
difference to the impact we have on our environment as well as being a key differentiator
We are currently working with Antistat to extend the use of the material to other packaging types.

9. Jedec Trays
An exciting, new generation of industry standard, Jedec Trays in development

10. • Made from recycled and recyclable materials
• Currently in field trials with leading global component manufacturer

11. • Comparatively lighter in weight and offers significantly reduced cost over existing tray solutions
• Costs reduced by half!
• Weight reduced by over 60% offering reduced shipping costs and improved carbon footprint

12. Working in collaboration with Antistat
Antistat are a leading packaging and supply chain specialist that, through a long-standing partnership,
have worked with us to create a suite of innovative, environmentally-friendly packaging solutions
designed to protect electronic components in transit and storage.
Collectively, they present an opportunity to reduce costs and reduce the impact our businesses and our
industry has on the environment.
Farnell
Antistat
Justin Willoughby
John Hensley
Head of Service – Europe
Managing Director
jwilloughby@farnell.com
johnhensley@antistat.co.uk
Tel: +44 (0)113 233 8127
Tel: +44 (0)1473 836200
Mobile: +44 (0)7730 015843
Mobile: +44 (0)771 422 0379