Embedded IC in package technology is a young and promising advanced packaging technique: understanding the status of the patent situation is key to understanding the business environment and anticipating the related strategic evolutions! A very young pa tent landscape dominated by a very small number of companies... For this patent analysis 721 relevant and related patents have been selected and classified to further analyze embedded IC IP situation. Among the 1547 patent documents constituting the 596 relevant patent families, 84% are active (pending or granted) and 16% are inactive (revoked, expired or lapsed). In addition, even if first patents for embedded IC are quite old, this technology is very young with regard to the number of patents pending! About 180 assignees are involved in embedded die technologies while the top 10 assignees represent 53% of patents filed in the Embedded die domain. Main business model involved in this area is substrate & PCB makers (which have been strongly involved in the PCB and back-end industries for a while) but we found a significant number of IDMs and OSATs which are looking closer and closer to this packaging technology. Patents in the embedded domain are mainly filed by firms or universities located in Korea (33%), Japan (21%) and USA (19%). Japanese and American players were the early adopters of the technology and they are still deeply involved in this business. Korea emerged as new key player in 2005. We selected 10 companies among the most active players identified in this complete statistical analysis to lead an accurate description of their patent portfolios. The report also provides a database of all the relevant patents we have analyzed in an Excel file, which allows multi-criteria searches. The criteria are basically those we used for the technological segmentation: •Patent information: Patent publication number, link to the PDF, document, oldest priority date, title, assignee, patent potential ranking, nb of citing patent families •Technological segmentation: chip placement / bonding, tape lamination, RDL, passivation & balling This complete description of the patent landscape is included in the first part of the report and provides all the background material for the analysis of the embedded IC in package landscape. The report provides a complete analysis of the patent landscape including geographical origins of the patents, company or R&D organizations that have been granted the patents, historical data on when the companies have applied for patents in the last 20 years, inventors of the patents, expiration status, R&D collaborations… More information on that report at http://www.i-micronews.com/reports/Embedded-Die-Package-Patent-Investigation/8/385/

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Embedded Die-in-Package
Patent Analysis
Texas
Instruments
Nokia

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Table of Contents
• Context and Objectives ............................................................................................. 3
• Introduction to Embedded IC Market and Technology ……………………………... 13
• Methodology for Patent Screening and Analysis ..................................................... 25
• IP Landscape Overview...................................................................................... 31
• Global Patent Ranking and Patent Potential Analysis ……………………………… 48
• Link with Existing Product and Commercialized Solutions ……………………….... 54
• Top Players Portfolio Analysis ……………………………………………………………
- Focus on SEMCO
- Focus on ASE
- Focus on Samsung
- Focus on Unimicron
- Focus on Intel
- Focus on Imbera
- Focus on Shinko
- Focus on Murata
- Focus on LG Innotek
- Focus on Daeduck
68
• Conclusions …………………………………………………………………………………. 213
70
93
108
120
134
146
161
178
193
203

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Why this Report?
• After several years of customer-specific analysis, last year YOLE Développement
began publishing reports on the analysis of patents’ technical contents
• This new IP report is focused on Embedded IC in substrate technology
• YOLE has developed a specific methodology for making such analyses, mixing
our technical and business knowledge with traditional patent database access

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What’s included/not included in this report?
• This report includes:
– An overview of « who owns what » in terms of patents for Embedded IC in package
technology, plus a dedicated focus on the ten most-active players in this area
– The report’s main objectives are:
 To present the current industrial and business status of Embedded IC
 To define and provide a database of all relevant patents, with technological segmentation
 To detail implementation architecture
 To identify the key patents and their owners
• The report does not include:
– A juridic analysis of patent portfolios
– Deep-link analysis (legal, juridic, etc.) between assignees
• To summarize, this report’s goal is to analyze key patents and identify
structural concepts from a technological or an industrial point of view,
leading to business and strategic conclusions.

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Yole’s standard
reports
• Market analysis
• Technology analysis
A New Report Type Providing a Clear Link Between the
IP Situation and Market Evolutions
• More than an analysis describing the state-of-the-art IP situation, this report is the
missing link between patented technology solutions and market, technological
and business trends
– YOLE has developed a unique methodology in order to create a technical segmentation of the patent
landscape and define which patents are the most innovative, either for future preparation or already
in-production
– By combining its technical knowledge, business understanding and patent search abilities, Yole was
able to assemble a report rife with unique analysis and added-value
– The in-depth technological analysis of patents contained in this report will provide a deep
understanding of key players’ strategic decisions and positioning within the value chain
Embedded IC Technological &
Market Evolution
Embedded IC IP
landscape
Yole’s new IP report
• Relevant patent analysis
• Technological segmentation
• Detailed implementation architecture
• Key patent identification
• Links between patents and available products

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Patent Analysis Definitions
• Patent family
– A patent family is a set of either patent applications or publications taken in multiple countries to protect a single invention by a common
inventor(s) which is then patented in multiple countries. A first application is made in one country – the priority – and is then extended to other
offices.
• Assignee (or applicant)
– The assignee is the person or organization (i.e. company, university) who/which filed a patent application. There may be more than one assignee
per application. The assignee may also be the inventor.
• Priority date
– The priority date is the date on which the patent application was filed. On this date the patent document is protected from public viewing.
• Priority Number
– The priority number is the application number by which priority is claimed, i.e. it’s the same as the application number of the claimed priority
document. The priority number consists of a country code (two letters), the filing year (four digits) and a serial number (variable, maximum seven
digits).
• Publication date
– The publication date is the date on which the patent application was first published. It’s the date on which the patent document is made available
to the public, thereby becoming “state-of-the-art”.
• Publication number
– The publication number is the number assigned to a patent application upon publication. Publication numbers are generally made up of a country
code (two letters) and a serial number (variable, one to twelve digits – i.e. DE202004009768).
• International Patent Classification (IPC)
– Patent documents’ technical content is classified in accordance with International Patent Classification (IPC). The publishing office assigns an IPC
symbol valid upon publication of the patent application. The complete IPC can be found on the World Intellectual Property Organization’s (WIPO)
website: http://www.wipo.int/ipcpub).

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Assumptions and Methodology (4/4)
• These parameters enable us to evaluate patent potential in four
dimensions:
• The final patent potential is the average score of each parameter
• A score between 1 - 10 is thus calculated for each dimension, and for
global patent potential
Patent dimensions Involved parameters
Technology Tech. Infringement Capability/Innovation Type/Search Report (citations)
Market Competitor Type/Geo. Protect./Market Size
Duration Legal Status/Applicant Type/Life Expectancy
Legal Legal Status/Geo. Protect./Search Report (citations)

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Introduction to the
Embedded IC
Market and Technology
Texas
Instruments
Nokia
STATS ChipPAC
AT&SInfineon

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• Overall relevance of analyzed patents:
Relevant
596
Related
125
Non-relevant
3,246
Overall Relevance of Analyzed Patents for
Embedded IC Technology in 2012
Landscape Overview for Embedded IC Technologies
Distribution of analyzed patents
Yole
Developpement ©
Dec. 2012
• ~ 80% of patents are marked « non-relevant »
• 596 patent families will be further analyzed

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Embedded Die Packaging SiP Module Capability
Enables further simplification of board-level mounting to OEMs
• Embedded die packaging is a great platform for moving to SiP module capabilities
– Once the infrastructure for test, yield and volume manufacturing is in place, it’s likely we’ll see a lot of
today’s SOC-designing fabless companies move to complex SiP module realizations, as they’ll benefit from
cost-savings at the FE level, integration of more in-package value (i.e. passive integration) and higher
electrical performance in RF, while simplifying board-level integration to the final customer
(n+2)
generation
 Smaller die size  Lower “front-end” cost thanks to more advanced
lithography, while integrating more functionalities
 Simplification of PCB mother-board mounting + integration of EMI
shielding at the package level  interesting from OEM perspective for
much simpler board mounting
 Enables realization of complex SiP modules, including active and
discrete passive functions  very interesting for wireless IC players
willing to integrate “more value” into their SiP modules
PCB 0.5mm pitch
RF Connectivity 40nm
“Fan-in” WLCSP
+ Discrete passives on board
+ EMI shielding
Embedded
RF-SiP module
PCB 0.5mm pitch
RF Connectivity 28nm
 OEM integrates many additional components “around” the main
connectivity IC, making final board assembly quite complex:
 Discrete passives
 Additional active IC like local DC/DC converter components
 Metal Cages to provide EMI shielding

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Embedded Die Package
Map of key players

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Top 10 IPC Classes Used for Embedded IC Patents
Top 10 International Patent Classification (IPC) Classes used in in Embedded IP Domain
IPC
Code
Description
No. of Patent
Families
H05K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTION DETAILS FOR ELECTRIC APPARATUS; MANUFACTURE OF ELECTRICAL
COMPONENTS’ ASSEMBLAGES
514
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR 433
B32B LAYERED PRODUCTS, i.e. PRODUCTS MADE OF FLAT OR NON-FLAT STRATA (i.e. CELLULAR OR HONEYCOMB FORM) 30
G06K DATA RECOGNITION; DATA PRESENTATION; RECORD CARRIERS; RECORD CARRIER HANDLING 17
H01K ELECTRIC INCANDESCENT LAMPS 14
B29C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A GENERAL PLASTIC STATE; AFTER-TREATMENT OF
SHAPED PRODUCTS, i.e. REPAIRING
13
H01Q AERIALS 11
H01R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED
ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11
B42D
BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED
FOR; DEVICES FOR USE THEREWITH; MOVABLE-STRIP WRITING OR READING APPARATUS
10
H01G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-
SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
10

13. © 2013 • 13
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Top 10 Patent Assignees for Embedded IC Technologies
• Around180 players are involved in embedded die technologies, but the top 10 assignees
represent 53% of patents filed
Top 10 Patent Assignees for Embedded Patents (includes relevant and related)
Yole Developpement © December 2012
147
34
22
23
19
23
20
14
14
15
13
9
4
9
5
5
0
2
3
1
0
2
0 25 50 75 100 125 150 175
SEMCO (KR)
ASE (TW)
SAMSUNG (KR)
UNIMICRON (TW)
INTEL (US)
IMBERA (FI)
SHINKO (JP)
MURATA (JP)
LG INNOTEK (KR)
DAEDUCK (KR)
TDK (JP)
No. of Patent Families
Assignee
Relevant Related

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Evolution of Patent Assignees for Embedded IC Technologies
• Numbers represent the number of published patent families. Panasonic, Shinko and Infineon are the early
players, having been involved in Embedded die pre-2000. Panasonic has been inactive since 2007
• From the mid 2000’s, Semco is the main assignee. Over the last five years, Unimicron has emerged as
new key player
Evolution of Top 15 Assignees for Embedded Patents (incl. related and relevant)
LG INNOTEK 3 11 1
DAEDUCK 5 5 4 1
UNIMICRON 2 3 6 3 8 6
SEMCO 21 33 12 14 29 29 18
MURATA 2 3 3 1 6 2
TDK 1 4 4 3 1 2
DENSO 1 1 3 1 3 2
AT&S 1 3 1 3 3 3
ASE 1 7 11 6 5 3 4 1
IMBERA 2 5 5 1 2 4 1 3
SAMSUNG 1 1 1 5 4 9 4 1 5
INTEL 1 3 1 1 2 1 1 8 6
INFINEON 1 1 2 2 1 3 1
SHINKO 1 2 5 4 5 1 4
PANASONIC 1 1 1 2 1 5
1982 1998 1999 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
Yole Developpement © December 2012

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Publication Countries of Top 15 Assignees for Embedded IC
Patents
• Bubble size represents number of published patents (note that World (WO) and Europe (EP) country
codes may hide a significant # of other countries). Semco mostly protected its innovations in Korea, the
USA, Japan and China. Daeduck chose an IP strategy whereby its innovations are only protected in its
originating country (Korea) -- contrary to Imbera, which opted for large geographic protection.
Publication Countries of Top 15 assignees for Embedded Patents (incl. related and relevant)
Yole Developpement © December 2012

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Assignee Collaboration Network for Embedded IC Patent Filing
• Patents co-filing in the corpus of selected patents for the embedded die domain
• The black number is the number of co-filings
• The white number is the assignee’s number of patent families
Assignee Collaboration Network
Yole Developpement © December 2012

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Inventors/Assignees Collaboration Network for Embedded IC Technology
Inventors/Assignees Collaboration Network (incl. related and relevant)
• Assignees direct relationship (patents co-filing) and indirect relationship (via inventors) in the
corpus of selected patents for the embedded die domain
• The black number is the number of co-filings
• The white number is the number of patent families for this assignee or inventor
Yole Developpement © December 2012

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Rohm Device: Main Process Steps
and Related Patents Currently Used (2/3) Related patents
and drawings
• Described in
• US2009/0218678
• EP1936675
• Mentioned in
• EP1936676
• EP2019574
• JP2005-236039
• US2007/0141759
• US2012/0247819
• Described in
• US2009/0218678
• EP1936675
• Mentioned in
• EP1936676
• EP2019574
• JP2005-236039
• US2007/0141759
• US2012/0247819
• Described in
• US2009/0218678
• EP1936675
• Mentioned in
• EP1936676
• EP2019574
• JP2005-236039
• US2007/0141759
• US2012/0247819
• Described in
• US2009/0218678
• EP1936675
• Mentioned in
• EP1936676
• EP2019574
• JP2005-236039
• US2007/0141759
• US2012/0247819

19. © 2013
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Top Players Portfolio
Analysis
 SEMCO
 ASE
 Samsung
 Unimicron
 Intel
 Imbera
 Shinko
 Murata
 LG Innotek
 daeduck

20. © 2013 • 20
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SEMCO’s Patent Portfolio for
Embedded Die Technologies

21. © 2013 • 21
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SEMCO’s Patent Filing Evolution for Embedded Die Technologies
(incl. relevant and related)
SEMCO’s Patent Filing Evolution for Embedded IC
Technology
• SEMCO’s patent portfolio is composed of 156 patent families (147 relevant and 9 related)
comprising 317 patents. Its embedded die patenting activity began in the mid-2000’s,
growing to an average of about 25 patent filings per year between 2005 - 2010
Note: Data corresponding to the years 2011 and 2012 may be incomplete since a significant number of patent applications filed
during these years may not have been published yet
6
30
21
18
33
15
23
1
3
3
2
1
0
5
10
15
20
25
30
35
40
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
No.ofpatentfamilies
Priority year
Related
Relevant
Yole Developpement © December 2012

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Top SEMCO Inventors for Embedded Die Technologies
(incl. relevant and related)
Top SEMCO Inventors for Embedded IC
• At SEMCO, about 160 inventors are involved in embedded die. HWAN DOO LEE is the
leading inventor with 45 patent families. HYEON-SUK CHO has been inactive since 2007,
while KYO YUL CHUNG and SUNG TAE JEONG are new inventors as of 2008
Filing year
Inventor
No. of patent
families
2004 2005 2006 2007 2008 2009 2010 2011
LEE, DOO HWAN 45 3 8 11 5 4 6 8
KIM, MOON-IL 27 7 8 4 3 3 2
CHO, SUK-HYEON 26 5 13 8
CHUNG, YUL KYO 25 3 8 9 5
CHO, HAN-SEO 25 18 7
YOO, JE-GWANG 22 7 9 4 1 1
RYU, CHANG-SUP 21 5 14 1 1
LEE, JAE-KUL 16 4 5 2 2 2 1
BAEK, SANG JIN 14 6 3 4 1
JEONG, TAE SUNG 14 4 3 7
Yole Developpement © December 2012

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SEMCO’s Patent Mapping for Chip Placement/Bonding
By priority date
2004
KR20060078118
KR20060005840
2009
KR20100081073
US20110141711
US20100236821
KR20110021123
KR20100133768
US20100288535
TW201103385
US20110083892
US2011083891
US2011005823
2010
KR20120028010
US20110290540
KR20120028008
KR101085727
US20120160550
KR20120003658
KR20110101430
KR101085733
KR101067109
US2011216513
US2011214913
KR20120069452
2007
KR100820633
KR100867150
KR20070101183
KR20090062709
US2011179642
KR100832653
US2009071705
KR20090047318
KR100887685
US2010242272
KR100811034
CN101369574
2008
KR20100049769
KR20100000678
US20100012364
KR20100051310
US20100101847
US20090321118
US20090310323
KR20100001799
KR20090093449
KR20100021810
US20120134125
KR20090117237
US20100134991
US20100078204
US20100142170
KR20100059010
US2010013968
KR20100004248
KR20090132186
KR20090126537
US2012042513
US2010006203
US2012017435
US2011314667
2006
KR100789530
KR100789530
KR100769527
KR100771320
KR20070112985
KR100758229
KR100771319
KR100771306
KR100773985
KR100782405
KR100788213
FI20075593
2005
US20070074900
FI200600447
US20090268418
CN1886026
KR100653247
KR100651358
KR100643334
KR20070036341
KR100661296
KR20070000645
KR20070000644
KR100651568
KR100700922
US2010163291
KR100674293
KR100656751
KR20070023319
KR100728748
KR100651474
US2013042472
US2010154210
KR100673860