UW Madison's materials science facilities.

1. 1
UW – Madison College of Engineering Shared
Facilities
Jerry Hunter, Ph. D.
Director of Research User Facilities
(608) 263-1073, jerry.hunter@wisc.edu

2. 2
Materials
Science
Center
Pictures
Shared Instrument Facilities
Wisconsin Center
for
Applied
Microelectronics
Soft Materials
Laboratory
Open to all users (industrial, academic,
government, institutions, etc.)
UW system schools get internal UW-
Madison rate

3. 3
• Wisconsin Center for
Applied Microelectronics
– Micro and nano-fabrication
facility
– 10,000 sq. ft. cleanroom
with 60 instruments
College of Engineering Shared Facilities
• Soft Materials Lab
– Polymer characterization
laboratory
– 10 instruments
• Materials Science Center
– High end microscopy and
microanalysis facility
– 30 instruments
Director: Jerry Hunter

4. 4
Fabrication Toolset

5. 5
Fabrication Toolset
• Lithography
· Nikon NSR-2005i8A Stepper
· Canon PLA-501 Contact Aligner
· Suss MA6/BA6 double-sided aligner
· Suss MJB-3 Contact Aligner
· Suss MJB-3 Contact Aligner (with I.R. backside
alignment)
· Headway Photoresist Spinners
· Solitec HMDS chamber
· (3) Scanning Electron Microscopes with Nabity
electron beam lithography (see microscopy in
characterization section below)
• Packaging
– WestBond 747677 Wedge Wire Bonder
– K+S 4124 Ball Wire Bonder
– Karl Suss RA-120 Wafer Scribe
– (2) MicroAutomation 1006 Wafer Saw
– MEI-720 Die Attacher
– Indium Evaporator (die bonding)
– YES vacuum oven
– Package annealer
• Deposition
– Ebeam Evaporator (metals)
– CVC-601 DC Sputterer (metals)
– Denton Discovery 24 Sputterer (RF & DC)
– PlasmaTherm 74 PECVD (dielectrics)
– Telemark Ebeam Evaporator (dielectrics)
– Angstrom Ebeam Evaporator (metals)
• Plasma Etch
– PlasmaTherm 74 RIE/PECVD (deposition
and etch of oxide, nitride on Si)
– STS ICP Multiplex (Deep Silicon Etcher)
– Unaxis 790 RIE (general purpose)
– PlasmaTherm SLR 770 ECR (compound
semiconductors)
– PlasmaTherm 770 ICP (metals)
– PlasmaTherm 790-2 ICP (general purpose)
– YES Asher
– Samco UV Ozone cleaner
– SPTS Xetch E1 XeF2 vapor etch

6. 6
Fabrication Toolset
• Assembly
– EVG Wafer-Wafer Bonder
– EVG Wafer-Wafer Bond Aligner
– Tousimis Critical Point Dryer
– Obducat NIL-25 Nano-imprinter
– 400C Oven for polymers
– Cooke polyimide vacuum oven
• Wet Chemical
– (2) General Purpose Wet Benches
– HF Wet Bench
– Piranha Wet Bench
– Metal Etch Wet Bench
– Nitride Strip Wet Bench
– KOH / TMAH Wet Etch Bench
– (3) Solvent Wet Benches
– Spin Rinser-dryers
• Thermal Processing
– 4 stack MRL Phoenix Oxidation Tubes
• wet/dry oxides
– 4 stack MRL Phoenix Oxidation Tubes
• diffusion/anneals
– 4 Stack Tystar Furnace
• LPCVD Nitride
• LPCVD Polysilicon
• LTO oxide
• Thermal oxide
– AG 610 RTA (contact anneal – compound semi)
– Pre-furnace clean wet bench
• Metrology Equipment
– Tencor Flexus 2320 Film Stress Measurement
– Rudolph Ellipsometer
– Filmetrics Optical Film Thickness
– (2)Tencor Alpha Step 200 Profilometers
– Wild M420 Stereo Microscope
– Several Inspection Microscopes
– Wafer mapping four-point probe
Dan
Christensen
Hal Gilles
Srdjan MilicicQuinn LeonardHal Gilles
Dan Christensen,
WCAM manager
Felix LuKurt Kupcho

7. 7
Imaging and Analysis Toolset
Hysitron TriboIndenter
Cameca Atom Probe
Zeiss Auriga SEM/FIB
Bruker D8 Discover XRD
Aramis Confocal Raman
Leo 1530 FESEM
FEI Titan aberration
corrected (S)TEM
Thermo k-alpha XPS
Advanced Rheometric
Expansion System

8. 8
Imaging and Analysis Toolset
• Microscopy
– Zeiss Auriga 1540 XB Cross
Beam (FIB + SEM) with Nabity
electron beam lithography
– (2) Leo 1530 SEMs with EDS (1)
with EBSD and Nabity electron
beam lithography
– Leo 1550 VP SEM with EDS and
Nabity electron beam lithography
– Philips CM200UT TEM
– FEI Tecnai 12 TEM
– FEI Tecnai TF30 cryo-TEM
– FEI Titan aberration corrected
(S)TEM
– Cameca 3000 X Si Atom Probe
Microscope
– Bruker MultiMode 8 AFM
– Bruker Bioscope Catalyst AFM
– Zeiss 510 Confocal microscope
• Soft Materials
Characterization
– Q1000 Modulated Differential
Scanning Calorimetry
– Q500 Thermo Gravimetric
Analysis
– ARES LS2 Rheometer
– RSA III Dynamic Mechanical
Analyzer
– Viscotek GPCmax Gel Permeation
Chromatograph
– Waters Gel Permeation
Chromatograph
– OCA 15/20 Contact Angle
measurement tool
– (2) Rudolph Auto EIII
Ellipsometers
– Thermo Scientific DXRxi Raman
Imaging Microscope
– Zetasizer Nano ZSP with Multi
Purpose Titrator MPT-2

9. 9
Imaging and Analysis Toolset
• Spectroscopy
– Thermo K-Alpha XPS
– Physical Electronics Phi 670 Scanning Auger
– Zygo 6300 White light profilometer
– Horiba Aramis Confocal MicroRaman
– Horiba fluorolog spectrofluorometer
– Nicolet NicPlan IR Microscope with Nicolet
Magna 550 Fourier Transform Infrared
spectrometer
– PE spectrum 19 – UV/VIS/NIR spectrometer
• Mechanical Test
– Hysitron TI 950 TriboIndenter Nanoindenter
– Hysitron PI 95 in-situ TEM Picoindenter
• X-ray Analysis
– Rigaku Small Angle X-ray scattering
– STOE X-ray powder diffractometer
– Bruker D8 Discover – XRD
– Panalytical X’Pert Pro MRD -- XRD
• Sample Preparation
– Leica EM UC7 Cryo Ultramicrotome
– FEI Vitrobot cryo vitrifier
– Fischione 1040 NanoMill
– Fischione 1050 TEM Mill
– Fischione 1010 Low Angle Ion Mill
Rick Noll, SEM
& FIB Manager
Julie Last, SPM &
light microscopy
Manager
John Jacobs,
Surface Science
Manager
Don Savage, X-Ray
systems manager
Alex Kvit, TEM
Manager Anna Kiyanova
SML manager
Mike Efremov
SML

10. 9
Imaging and Analysis Toolset
• Spectroscopy
– Thermo K-Alpha XPS
– Physical Electronics Phi 670 Scanning Auger
– Zygo 6300 White light profilometer
– Horiba Aramis Confocal MicroRaman
– Horiba fluorolog spectrofluorometer
– Nicolet NicPlan IR Microscope with Nicolet
Magna 550 Fourier Transform Infrared
spectrometer
– PE spectrum 19 – UV/VIS/NIR spectrometer
• Mechanical Test
– Hysitron TI 950 TriboIndenter Nanoindenter
– Hysitron PI 95 in-situ TEM Picoindenter
• X-ray Analysis
– Rigaku Small Angle X-ray scattering
– STOE X-ray powder diffractometer
– Bruker D8 Discover – XRD
– Panalytical X’Pert Pro MRD -- XRD
• Sample Preparation
– Leica EM UC7 Cryo Ultramicrotome
– FEI Vitrobot cryo vitrifier
– Fischione 1040 NanoMill
– Fischione 1050 TEM Mill
– Fischione 1010 Low Angle Ion Mill
Rick Noll, SEM
& FIB Manager
Julie Last, SPM &
light microscopy
Manager
John Jacobs,
Surface Science
Manager
Don Savage, X-Ray
systems manager
Alex Kvit, TEM
Manager Anna Kiyanova
SML manager
Mike Efremov
SML