Welcome to Contact Us! inquiry@piotec.cn About Us: Founded on March, 2011, Piotec subordinates to Shenyang BlueLight Group, which is named as high-tech and software Enterprise. Piotec is a well-known equipment manufacturer, which is specializing in the R&D, production, sales and service of automation products in fields such as smart card, IoT safety chips and semiconductor chips. Piotec locates in Shenyang, covering an area of 16,000sqm, which sets up Product Center, Development Center, Operation Center, Marketing Center and the production and assembly workshop with ISO9000. Product Description: SCM3000 M2M Chip Personalization Machine is applied to chip personalization and laser marking of smart devices such as semiconductor M2M Chip is with the packaging mode of QFN, DFN etc, plug-in of SIM and Micro SD etc. Equipped with personalization and production management system proven by market for more than 10 years ,SCM3000 can provide high-speed, safe and stable smart devices personalization production service for mobile operators , smart device sub-con-tractors as well as semiconductor chip manufacturers around the world.

1. Personalization Specialist
M2M Chip Personalization Machine
SCM3000

2. www.piotec.cn
SCM3000 M2M Chip Personalization Machine is applied to chip personalization and laser marking of smart devices such as
semiconductor M2M Chip with the packaging mode of QFN, DFN etc, plug-in of SIM and Micro SD etc.
Equipped with personalization and production management system proven by market for more than 10 years, SCM3000 provides
high-speed, safe and stable smart devices personalization production service for mobile operators, smart device sub-contractors
as well as semiconductor chip manufacturers around the world.
-Meeting production demand for various M2M chips or other smart devices;
-Equipped with personalization system widely recognized and proven by the market;
-Mature chip personalization, laser marking and surface information verification technology;
-Online re-perso & quality detection supported;
-Modules can be customized according to customers' demand.
SCM3000
High-speed, safe and stable
smart device personalization solution
Overview
ADVANTAGES
Micro SD
QFN Semiconductor Chip
Smart Card
Plug-in of SIM
M2M Chip Personalization Machine

3. www.piotec.cn
Configurations
Throughput（UPH）
25
2200
<21
2500
30
1820
35
1540
40
1340
45
1180
Perso Time (S)
Throughput Table (16 Stations )
Input Module
Compatible for tray (20 trays at most can be loaded) and reel (specifications of
1000pcs and 3000pcs supported) material container.
Equipped with 12W Fiber laser and 1 fume extractor.
Laser Marking Module
IC Checking Module
Compatible for tray (20 trays at most can be loaded) and reel (specifications of
1000pcs and 3000pcs supported) material container.
Output Module
Reject Module
1 set of reject module after IC perso module, laser marking module and IC
checking module (3 sets in total) to store reject chips of corresponding module.
OCR Checking Module (Optional)
Equipped with1 set of OCR checking module to realize the reading and verifying
of the surface information on the chips.
Equipped with 2 perso stations (Model: PIOTEC PT201NT ) to realize the reading
and verification of the internal data of the chips.
Chip perso can be realized; Equipped with 16 perso stations for standard, which
can be extended to 32 stations; Configured with Piotec industrial-class reader
PT204PT; Online re-perso supported.
IC Perso Module
Input/Output Module
IC Perso Module
Laser Marking Module
Reject Module
OCR Checking Module
IC Checking Module

4. www.piotec.cn
Shenyang Piotec Technology Co., LTD
Add: No37, Shiji Rd, Hunnan District, Shenyang, China
Tel: +86-024-23782485 Fax: +86-024-23783285 Website: www.piotec.cn
Technical Specification
Parameters
1850mm X 1600mm X 1750mm
600kg
220V（-5%~+10%），50Hz，6KW
＜65dB
23℃±3℃
50±10%
Pressure:0.5Mpa; Flow:300LPM
<1/5000
2500UPH
Name
Dimension
Weight
Power Supply
Noise
Operation Temperature
Operation Humidity
Air Supply
Jam Rate
MaximumThroughput
SOP
For example:
Changeover details of tooling kit for QFN8 (2 x 2) chip are as follows (customers can change the corresponding chip tooling kit
needed by themselves to realize quick production switching).
Configured Module
Input/Output Module
IC Perso/Checking Module
Tray/Feeder/Carrier tape/Cover tape
Socket
Changed Parts Time
Less than 20 min
QFN
DFN
SOIC
TTSOP
BGA
DIP
K I T
Production Diversity