about my surface grinding machine

1. 1
“Automatic Surface Grinding Machine"
Authored by:
Krunal panchal, Tushar Amipara, Rushabh Patel, Tahir Tasiya, Mr. Saumil Joshi
Presented by:
Krunal panchal, Tushar Amipara, Rushabh Patel, Tahir Tasiya.
Paper ID:
ME 009
Discipline:
Venue: SIGMA INSTITUTE OF ENGINEERING, VADODARA

2. Content
• Introduction
• Objectives
• Literature Review
• Conclusion & Future Scope
• References

3. Introduction
 Grinding is a true metal-cutting process. Each grain of
abrasive functions as a microscopic single-point cutting
edge, shears a tiny chip that is analogous to what would
conventionally be called a "cut" chip.
 The tolerances that are normally achieved with
grinding are 5.1 μm for grinding a flat material and
±3×10−4 inches 7.6 μm for a parallel surface.
 Grinding is used to finish work pieces that must show
high surface quality and high accuracy of shape and
dimension.

4.  As the accuracy in dimensions in grinding is of the
order of 0.000025 mm, in most applications it tends to
be a finishing operation and removes comparatively
little metal, about 0.25 to 0.50 mm depth.
 Grinding practice is a large and diverse area of
manufacturing and tool making. It can produce very
fine finishes and very accurate dimensions.
 The various types of grinding use in Industries
• Surface grinding
• Cylindrical grinding
Introduction

5. • Creep-feed grinding
• Centre less grinding
 The Various Types of Grinding Wheel use in grinding
machine
• Straight Grinding wheels
• Cylinder or wheel ring
• Tapered Grinding wheels
• Straight cup
• Dish cup
• Diamond Grinding Wheel
Introduction

6.  In this paper technologies by either use of grinding
wheel and materials has been summarized.
 From this paper we have anticipated that grinding and
work peace materials have a wide range of application
in day to day life and has tremendous scope in the
grinding sectors with few of the developed
technologies as described in paper.
Objectives

7. Literature Review
Sr.
No.
Name of the
inventor
ISSN Publish year Title of paper
1 Samuels, Leonard Ernest.
Metallographic polishing
by mechanical methods.
204-7586 April-2013 Metallographic
polishing by
mechanical methods.
2 Pappachan, Bobby K., et
al.
2394-0697 June-2017 Frequency Domain of
Sensor Data for Event
Classification in Real-
Time Robot
3 Ranga, Pardeep, and Er
Deepak Gupta.
2277-1581 April-2016 Investigation on MRR
and RA of Surface
Grinding on EN31
4 Jae-Seob Kwak, 327-334 March 2005 response surface
methodologies for
geometric error in
surface grinding
process.

8. Literature Review
Sr.
No.
Name of the
inventor
ISSN Publish year Title of paper
5 Masuzawa, T. 431-434 March-200 Wire Electro-
Discharge Grinding for
Micro-Machining
6 K. Nishio June-1998 Double-end surface
grinding machine
7 J. C. Aurich,D. Biermann
,H. Blum
C. Brecher,C. Carstensen
111–120 November-
2008
Modeling and
simulation of process:
machine interaction in
grinding

9.  The most commonly used material was aluminium
oxide due to its high abrasive material, compared to
other abrasive material.
 One more important point derived from this paper is
that the grinding range is high, which makes its highly
effective for use in micro scale grinding.
 In future grinding is important because of the
dimension accuracy is required.
Conclusion & Future Scope

10. 1. Samuels, Leonard Ernest. Metallographic polishing by mechanical
methods. Asm International, 2003.
2. Samuels, Leonard Ernest. Metallographic polishing by mechanical
methods. Asm International, 2003.
3. Pappachan, Bobby K., et al. "Frequency Domain Analysis of Sensor
Data for Event Classification in Real-Time Robot Assisted Deburring."
Sensors 17.6 (2017): 1247
4. WeiFeng, Department of Mechanical and Electrical Engineering,
School of Physics and Mechanical & Electrical Engineering,
XiamenUniversity,Xiamen361005,China
5. BinYao,StateKeyLaboratoryforManufacturingandSystemsEngineering,S
choolof Mechanical Engineering ,Xi’an Jiaotong University,
Xi’an710049,China
References

11. 6. Jae-Seob Kwak, Application of Taguchi and response surface
methodologies for geometric error in surface grinding process,
International Journal of Machine Tools and Manufacture,
Volume45,Issue3, March2005, Pages327- 334
7. Masuzawa, T., et al. "Wire electro-discharge grinding for micro-
machining." CIRP Annals-Manufacturing Technology34.1 (1985): 431-
434.
8. Li, Z. C., Zhijian J. Pei, and Graham R. Fisher. "Simultaneous double
side grinding of silicon wafers: a literature review." International
Journal of Machine Tools and Manufacture46.12-13 (2006): 1449-
1458.
9. K. Nishio, Double-end surface grinding machine, US Patent 4,782,631,
1988.
10. Aurich, Jan C., et al. "Modelling and simulation of process: machine
interaction in grinding." Production Engineering 3.1 (2009): 111-120.
References

12. THANK YOU