This document provides information on solid state drives (SSDs). It discusses the history and operation of flash memory, how SSDs work compared to hard disk drives, and performance optimizations like parallelism and garbage collection. SSDs have advantages over HDDs like higher data transfer rates, lower power consumption and size, but also challenges like limited write cycles and latency issues. The document evaluates different page placement policies and block repositioning methods to improve SSD response times.
Chickpea is the second largest grown food legume worldwide, cultivated across over 50 countries. ICRISAT conducts research on chickpea breeding to develop varieties with improved abiotic stress tolerance, such as drought, salinity, and heat stress resistance, as well as resistance to major diseases like Fusarium wilt and Ascochyta blight. Successful examples include the adoption of new varieties in countries like Ethiopia and Myanmar that have provided farmers with higher yields and helped increase chickpea production globally.
Phenotypic and genotypic diversity of Rhizobia nodulating lentil and chickpea...ICARDA
This document summarizes a study on the phenotypic and genotypic diversity of rhizobia that nodulate lentils and chickpeas in Morocco. Rhizobia samples were collected from various production areas and tested for traits like tolerance to temperature, salinity, heavy metals, and water stress. Selected high-performing strains were tested in pot and field trials, where they increased nodulation, plant growth, grain yield, and nitrogen content compared to uninoculated controls. The study found substantial diversity among the rhizobia populations and that inoculation with efficient strains is an effective way to increase legume productivity and reduce chemical fertilizer use.
Chickpea Seed Production Manual ~ icrisat.orgSeeds
This document provides an overview of chickpea seed production. It discusses the types of chickpea, general plant characteristics, climatic requirements, plant growth and development, seed systems in India, seed classes, seed production technology, management of diseases and insect pests, roguing, harvesting, threshing, seed processing, and storage. The goal is to provide comprehensive information on improved seed production technologies to grow a healthy chickpea seed crop and store chickpea seeds, which will be useful for all those involved in formal and informal seed systems.
Chickpea breeding aims to develop higher yielding varieties with improved resistance to biotic and abiotic stresses. Breeding methods include hybridization of selected parents followed by selection of progeny. Hybridization techniques can increase success rates. Segregating populations are handled using pedigree, bulk, or single seed descent selection. Mutation breeding induces genetic variation which is selected in subsequent generations. This helps develop stress resistant and high yielding varieties adapted to Pakistan.
A Guide to SlideShare Analytics - Excerpts from Hubspot's Step by Step Guide ...SlideShare
This document provides a summary of the analytics available through SlideShare for monitoring the performance of presentations. It outlines the key metrics that can be viewed such as total views, actions, and traffic sources over different time periods. The analytics help users identify topics and presentation styles that resonate best with audiences based on view and engagement numbers. They also allow users to calculate important metrics like view-to-contact conversion rates. Regular review of the analytics insights helps users improve future presentations and marketing strategies.
Each month, join us as we highlight and discuss hot topics ranging from the future of higher education to wearable technology, best productivity hacks and secrets to hiring top talent. Upload your SlideShares, and share your expertise with the world!
Not sure what to share on SlideShare?
SlideShares that inform, inspire and educate attract the most views. Beyond that, ideas for what you can upload are limitless. We’ve selected a few popular examples to get your creative juices flowing.
Chickpea is the second largest grown food legume worldwide, cultivated across over 50 countries. ICRISAT conducts research on chickpea breeding to develop varieties with improved abiotic stress tolerance, such as drought, salinity, and heat stress resistance, as well as resistance to major diseases like Fusarium wilt and Ascochyta blight. Successful examples include the adoption of new varieties in countries like Ethiopia and Myanmar that have provided farmers with higher yields and helped increase chickpea production globally.
Phenotypic and genotypic diversity of Rhizobia nodulating lentil and chickpea...ICARDA
This document summarizes a study on the phenotypic and genotypic diversity of rhizobia that nodulate lentils and chickpeas in Morocco. Rhizobia samples were collected from various production areas and tested for traits like tolerance to temperature, salinity, heavy metals, and water stress. Selected high-performing strains were tested in pot and field trials, where they increased nodulation, plant growth, grain yield, and nitrogen content compared to uninoculated controls. The study found substantial diversity among the rhizobia populations and that inoculation with efficient strains is an effective way to increase legume productivity and reduce chemical fertilizer use.
Chickpea Seed Production Manual ~ icrisat.orgSeeds
This document provides an overview of chickpea seed production. It discusses the types of chickpea, general plant characteristics, climatic requirements, plant growth and development, seed systems in India, seed classes, seed production technology, management of diseases and insect pests, roguing, harvesting, threshing, seed processing, and storage. The goal is to provide comprehensive information on improved seed production technologies to grow a healthy chickpea seed crop and store chickpea seeds, which will be useful for all those involved in formal and informal seed systems.
Chickpea breeding aims to develop higher yielding varieties with improved resistance to biotic and abiotic stresses. Breeding methods include hybridization of selected parents followed by selection of progeny. Hybridization techniques can increase success rates. Segregating populations are handled using pedigree, bulk, or single seed descent selection. Mutation breeding induces genetic variation which is selected in subsequent generations. This helps develop stress resistant and high yielding varieties adapted to Pakistan.
A Guide to SlideShare Analytics - Excerpts from Hubspot's Step by Step Guide ...SlideShare
This document provides a summary of the analytics available through SlideShare for monitoring the performance of presentations. It outlines the key metrics that can be viewed such as total views, actions, and traffic sources over different time periods. The analytics help users identify topics and presentation styles that resonate best with audiences based on view and engagement numbers. They also allow users to calculate important metrics like view-to-contact conversion rates. Regular review of the analytics insights helps users improve future presentations and marketing strategies.
Each month, join us as we highlight and discuss hot topics ranging from the future of higher education to wearable technology, best productivity hacks and secrets to hiring top talent. Upload your SlideShares, and share your expertise with the world!
Not sure what to share on SlideShare?
SlideShares that inform, inspire and educate attract the most views. Beyond that, ideas for what you can upload are limitless. We’ve selected a few popular examples to get your creative juices flowing.
Flip chip is an advanced packaging technique where bare semiconductor chips are flipped upside down and bonded directly to a printed circuit board using solder bumps. It was introduced by IBM in 1962 as Solid Logic Technology and later converted to Controlled Collapse Chip Connection. Flip chip packaging provides shorter interconnect lengths, lower inductance and higher density interconnects compared to wire bonding. It allows for area array interconnect layouts and has become the standard for high performance integrated circuits. Reliability can be improved through underfilling, which compensates for thermal expansion differences and protects the solder joints.
The future memory device which is currently under development by IBM. Race track memory overcomes both the limitations of hard disk and solid state memory by giving high storage density than solid state drive and high transfer speed than hard disk at low price .
This document discusses several architectures for big data systems using memristors. It summarizes FAWN, an architecture that uses low-power cores and flash storage to maximize query rates within a power budget. It also discusses RAMCloud, which stores data in DRAM across nodes and replicates data in flash for recovery from failures. HARP is presented as a system that partitions data ranges in hardware pipelines. Memristors are described as a resistive non-volatile memory that can achieve high density in a cross-point architecture and potentially be used to build dense memory systems.
The document discusses various components of computers including processors, memory, storage, networking, and backups. It covers options from Intel, AMD, and other processor manufacturers. Hard disks, RAM, cache memory, and other core components are explained. The importance of backups, UPS systems, and networking is emphasized. Various form factors like notebooks are also mentioned as useful tools. The document promotes investing in training, IT, and using technology for business advantages.
Accelerating Apache Spark Shuffle for Data Analytics on the Cloud with Remote...Databricks
The increasing challenge to serve ever-growing data driven by AI and analytics workloads makes disaggregated storage and compute more attractive as it enables companies to scale their storage and compute capacity independently to match data & compute growth rate. Cloud based big data services is gaining momentum as it provides simplified management, elasticity, and pay-as-you-go model.
This document summarizes solid state memory technologies, including SRAM, DRAM, and flash memory. It discusses the basic principles of transistors and how different memory technologies store information in memory cells. It also covers topics like matrix array organization, error correction, refresh processes, and new technologies being explored like discrete trap memories and multilevel cells. The goal is to provide an overview of solid state memories and their fundamentals and perspectives.
Millipede is a non-volatile computer memory that uses thousands of nano-sharp probes to punch indentations representing bits into a thin polymer film. Data can be read and written in parallel by heating the probes to alter the indentations. A prototype demonstrated storing over 1 terabit per square inch, making it suitable for very high density storage applications like mobile devices. However, progress toward commercialization has been slower than expected due to advances in competing technologies like flash drives.
This document provides information about external memory systems including magnetic disks, solid state drives, and optical disks. It discusses the components and operation of magnetic disks including read/write mechanisms, data organization and formatting, physical characteristics, and performance parameters. It also summarizes different RAID levels from 0 to 6 and their characteristics. For solid state drives, it describes flash memory, compares SSDs to HDDs, and discusses SSD organization and practical issues related to performance and lifespan.
IBM and ASTRON 64-Bit Microserver Prototype Prepares for Big Bang's Big Data,...IBM Research
The document summarizes the IBM/ASTRON DOME 64-bit μServer Demonstrator project. It discusses the motivation to create a highly dense 64-bit microserver module for applications like radio astronomy and business analytics. The project aims to integrate an entire server node onto a single microchip, excluding memory and power components. It provides status updates on the development of the compute node boards using PowerPC and ARM processors, as well as the cooling and packaging design to integrate over 1,000 cores into a dense 2U chassis.
This document discusses the evolution of disk drive storage over the past 50+ years and design challenges going forward. It covers topics like areal density, magnetic recording technologies, disk controller architecture, reliability concerns, and energy efficiency techniques. New disk drive architectures are proposed using multiple spindles or dynamic RPM modulation to improve performance within power and heat constraints as areal density limits are approached. Flash memory is also discussed as a potential replacement for bridging performance gaps.
Ics21 workshop decoupling compute from memory, storage & io with omi - ...Vaibhav R
This document discusses decoupling compute from memory, storage, and I/O using the Open Memory Interface (OMI). It provides the following key points:
1) Decoupling compute allows for more efficient distribution of compute and a focus on low power and latency over raw performance. OMI provides a standardized interface to achieve this decoupling.
2) The Open Compute Project (OCP) Open Accelerator Module (OAM)-HPC allows for a fully composable compute node module using OMI, populated with processors, memory, storage, and I/O.
3) OMI offers bandwidth comparable to HBM at lower latency and cost than HBM or other memory interfaces like CXL and
The document provides an overview of various memory devices and their terminology. It defines common terms like MOS, flip-flop, SRAM, DRAM, ROM, EEPROM, and cache. SRAM uses an array of flip-flops to store data and is very fast but volatile. DRAM uses dynamic storage cells that must be regularly refreshed to prevent data loss, making it slower than SRAM but able to store more data. ROM is programmed during manufacturing and cannot be rewritten. EEPROM can be electrically erased and reprogrammed without removing it from a system.
Power reduction techniques are important for the modern VLSI designs. Power is the today's major concern when we come to optimal trade off between area, performance and power.
JSK Innovative Technology Pvt Ltd is an ISO certified electronics company that specializes in home automation products like LED drivers. It discusses the PCB design and manufacturing process, including types of PCB boards, materials used, design software, manufacturing steps, and surface mount vs through-hole assembly techniques. The document provides details on each stage of the PCB design and production process.
Semiconductor engineering is becoming more dynamic fiels since the technology scaling is taking place. Power reduction techniques are lucrative solutions to the performance, area and power trade off. Therefore Power reduction of VLSI designs are critical.
This document provides background on the historical development of networking protocol stacks. It discusses how the original Multics architecture from the 1970s, which placed networking protocols in the kernel to minimize memory usage, became the standard model and was implemented in Unix. However, this kernel-based approach has several disadvantages for modern multicore systems, including reduced parallelism, lock contention, and extra data copies. The talk will argue for moving more protocol processing out of the kernel and into userspace to better leverage multiple cores.
Flip chip is an advanced packaging technique where bare semiconductor chips are flipped upside down and bonded directly to a printed circuit board using solder bumps. It was introduced by IBM in 1962 as Solid Logic Technology and later converted to Controlled Collapse Chip Connection. Flip chip packaging provides shorter interconnect lengths, lower inductance and higher density interconnects compared to wire bonding. It allows for area array interconnect layouts and has become the standard for high performance integrated circuits. Reliability can be improved through underfilling, which compensates for thermal expansion differences and protects the solder joints.
The future memory device which is currently under development by IBM. Race track memory overcomes both the limitations of hard disk and solid state memory by giving high storage density than solid state drive and high transfer speed than hard disk at low price .
This document discusses several architectures for big data systems using memristors. It summarizes FAWN, an architecture that uses low-power cores and flash storage to maximize query rates within a power budget. It also discusses RAMCloud, which stores data in DRAM across nodes and replicates data in flash for recovery from failures. HARP is presented as a system that partitions data ranges in hardware pipelines. Memristors are described as a resistive non-volatile memory that can achieve high density in a cross-point architecture and potentially be used to build dense memory systems.
The document discusses various components of computers including processors, memory, storage, networking, and backups. It covers options from Intel, AMD, and other processor manufacturers. Hard disks, RAM, cache memory, and other core components are explained. The importance of backups, UPS systems, and networking is emphasized. Various form factors like notebooks are also mentioned as useful tools. The document promotes investing in training, IT, and using technology for business advantages.
Accelerating Apache Spark Shuffle for Data Analytics on the Cloud with Remote...Databricks
The increasing challenge to serve ever-growing data driven by AI and analytics workloads makes disaggregated storage and compute more attractive as it enables companies to scale their storage and compute capacity independently to match data & compute growth rate. Cloud based big data services is gaining momentum as it provides simplified management, elasticity, and pay-as-you-go model.
This document summarizes solid state memory technologies, including SRAM, DRAM, and flash memory. It discusses the basic principles of transistors and how different memory technologies store information in memory cells. It also covers topics like matrix array organization, error correction, refresh processes, and new technologies being explored like discrete trap memories and multilevel cells. The goal is to provide an overview of solid state memories and their fundamentals and perspectives.
Millipede is a non-volatile computer memory that uses thousands of nano-sharp probes to punch indentations representing bits into a thin polymer film. Data can be read and written in parallel by heating the probes to alter the indentations. A prototype demonstrated storing over 1 terabit per square inch, making it suitable for very high density storage applications like mobile devices. However, progress toward commercialization has been slower than expected due to advances in competing technologies like flash drives.
This document provides information about external memory systems including magnetic disks, solid state drives, and optical disks. It discusses the components and operation of magnetic disks including read/write mechanisms, data organization and formatting, physical characteristics, and performance parameters. It also summarizes different RAID levels from 0 to 6 and their characteristics. For solid state drives, it describes flash memory, compares SSDs to HDDs, and discusses SSD organization and practical issues related to performance and lifespan.
IBM and ASTRON 64-Bit Microserver Prototype Prepares for Big Bang's Big Data,...IBM Research
The document summarizes the IBM/ASTRON DOME 64-bit μServer Demonstrator project. It discusses the motivation to create a highly dense 64-bit microserver module for applications like radio astronomy and business analytics. The project aims to integrate an entire server node onto a single microchip, excluding memory and power components. It provides status updates on the development of the compute node boards using PowerPC and ARM processors, as well as the cooling and packaging design to integrate over 1,000 cores into a dense 2U chassis.
This document discusses the evolution of disk drive storage over the past 50+ years and design challenges going forward. It covers topics like areal density, magnetic recording technologies, disk controller architecture, reliability concerns, and energy efficiency techniques. New disk drive architectures are proposed using multiple spindles or dynamic RPM modulation to improve performance within power and heat constraints as areal density limits are approached. Flash memory is also discussed as a potential replacement for bridging performance gaps.
Ics21 workshop decoupling compute from memory, storage & io with omi - ...Vaibhav R
This document discusses decoupling compute from memory, storage, and I/O using the Open Memory Interface (OMI). It provides the following key points:
1) Decoupling compute allows for more efficient distribution of compute and a focus on low power and latency over raw performance. OMI provides a standardized interface to achieve this decoupling.
2) The Open Compute Project (OCP) Open Accelerator Module (OAM)-HPC allows for a fully composable compute node module using OMI, populated with processors, memory, storage, and I/O.
3) OMI offers bandwidth comparable to HBM at lower latency and cost than HBM or other memory interfaces like CXL and
The document provides an overview of various memory devices and their terminology. It defines common terms like MOS, flip-flop, SRAM, DRAM, ROM, EEPROM, and cache. SRAM uses an array of flip-flops to store data and is very fast but volatile. DRAM uses dynamic storage cells that must be regularly refreshed to prevent data loss, making it slower than SRAM but able to store more data. ROM is programmed during manufacturing and cannot be rewritten. EEPROM can be electrically erased and reprogrammed without removing it from a system.
Power reduction techniques are important for the modern VLSI designs. Power is the today's major concern when we come to optimal trade off between area, performance and power.
JSK Innovative Technology Pvt Ltd is an ISO certified electronics company that specializes in home automation products like LED drivers. It discusses the PCB design and manufacturing process, including types of PCB boards, materials used, design software, manufacturing steps, and surface mount vs through-hole assembly techniques. The document provides details on each stage of the PCB design and production process.
Semiconductor engineering is becoming more dynamic fiels since the technology scaling is taking place. Power reduction techniques are lucrative solutions to the performance, area and power trade off. Therefore Power reduction of VLSI designs are critical.
This document provides background on the historical development of networking protocol stacks. It discusses how the original Multics architecture from the 1970s, which placed networking protocols in the kernel to minimize memory usage, became the standard model and was implemented in Unix. However, this kernel-based approach has several disadvantages for modern multicore systems, including reduced parallelism, lock contention, and extra data copies. The talk will argue for moving more protocol processing out of the kernel and into userspace to better leverage multiple cores.
2. INTRODUCTION
• The explosion of flash memory technology has
dramatically increased storage capacity and
decreased the cost of non-volatile
semiconductor memory.
• SSDs do not contain any moving parts and
depend on flash memory chips to store data.
• Flash memory chips store data in a large array
of floating gate (MOS) transistors.
3. HISTORY
• FLASH MEMORY WAS INVENTED BY DR. FUJIO
MASUOKA IN 1984.
• HE RECOMMENDED THE NAME ‘FLASH ‘ BY
SEEING THE FLASH FROM CAMs.
5. OPERATION
•Logic 1: erase mode.
Logic 0: programming
mode.
•Fowler-Nordheim
tunneling is emission
of electrons induced by an
electrostatic field. The
most common context is
FE from a solid surface into
vacuum solid or liquid
surfaces, into air, a fluid, or
any non-conducting or
weakly conducting
dielectric.
6. SERIAL ADVANCED TECHNOLOGY ATTACHMENT – SATA EX:HOST
IINTERFACE
NAND FLASH SUPPORT 8 OR 16 BIT I/O BUS, HAVING INTERNEL 1KB
BUS TRANSFER, SUPPORTS MULTIPLE NAND FLASH DEVICES,
SUPPORTS FLOW THROUGH DMA DATA TRANSFERS
RAM BUFFER IS MANAGED BY BML FOR FETCHING DATA
CHIPS-NAND MEMORY CHIPS
8. Software Layers SSD
• Buffer Management Layer- accept data and
stores in buffer
• Flash Translation Layer- data placed into flash
memory
• The GC overhead (i.e., the merge cost) is
critical to the performance of an SSD & blocks
user requests. Merge – victim pages replaced
by free block.
9. Live Page Copying
•PAGE BUFFERS ARE
USED BECAUSE PAGES
WILL NOT EJECT TILL
THE BUFFER IS FULL.
•DATA CACHE IS USED
MAINLY TO REDUCE
THE TIME.
10. PAGE PLACEMENT IN SDD
• PA (PAGE AFFINITY) USES INTRA COPING.
• CA (CHIP AFFINITY) USES CROSS PLANE .
• NA (NON AFFINITY) USES CROSS CHIP.
• TARGET PLANE SELECTION IN PA
11. CROSS-LAYER OPTIMIZATION
• TO ACHIVE PARRELLISM WITH LOW GC .
• USING FAP (First Available Plane)-LRU.
• BLOCK REPOSITIONING METHOD.
12. FAP (First Available Plane)-LRU.
• Recency and degree of parallelism
• SELECTION OF VICTIM PAGE
• P= BTPL( 1/ Nb)Nb represents the number of
pages per block and the table BTPL(i.e., Block-
To-plane)
14. BLOCK REPOSITIONING
• EFFECTIVENESS OF FRU-LRU DECREASES WITH
LARGE SIZED DATA.
• PLANE1 PLANE 2 .
• PLANE1 DEAD AFTER COPING TO PLANE2 SO
REDUCES TIME IN FUTURE MERGE.
17. DEMAND FOR SSDS AND HDDS IN
PORTABLE COMPUTERS
0
50
100
150
200
250
2005 2006 2007 2008 2009 2010 2011
SDD
HDD
18. CHALLENGES
• LATENCY IS LOW, TIME REQUIRED TO LOCATE A FILE
• SURVIVAL - IOPS IS GREAT BUT LIMITED WRITE
CYCLES THAN HDD
• FTL - LATENCY SPIKES(TIME DELAY) AND LIMITED
DURABILITY.
• FOR SDD GEOMETRY IS HIGHLY VIRTUALIZED
19. GEOMETRY OF HARD DISK
• DATA IS ACCESSED BY MOVING HEAD
IN AND OUT OF THE DISK
•DAT STORED IN CONCENTRIC CIRCLES
20. ADVANTAGES
• HIGH START UP RATE-NO MOVING PARTS
• DATA TRANSFER RATE IS HIGH 100-600 MB/S
• NO NOISE
• TO NEED OF TEMPERATURE COOLER
• SHOCK RESISTIENT
• WEIGHT & SIZE IS LESS Height is NOT standardized -
there are 7.5mm and 9mm SSDs
• POWER CONSUMPTION IS LESS.
21. DISADVANTAGES
• STORAGE CAPACITY IS LESS 2TB IN 2011
• SLOWER WRITE SPEEDS BECAUSE OF THE ERASE
BLOCKS ARE BECOMING LARGER AND LARGER.
• For low capacity flash SSDs, low power consumption
and heat production when in active use. High
capacity SSDs may have significant higher power
requirements.
• COST IS HIGH.
22. APPLICATIONS
• CLOUD COMPUTING-ACCESS OVER INTERNET NEEDS SPEED
• UNTIL 2009, SSDS WERE MAINLY USED IN THOSE ASPECTS
OF MISSION CRITICAL APPLICATIONS
• FLASH MEMORY.
• USB .
• STORAGE DEVICES.
• E-MAIL SERVICES IT NEEDS QUICK RESPONSE .
• VIRTULIZATONS OF I/O CAN BE DONE.
• DATA BASE & OLTP – ONLINE TRANSACTION PROCESS.
23. CONCLUSION
• SSDs utilize parallel architectures to improve
their I/O throughput.
• The results show that there is no best policy due to
the tradeoff between the degree of parallelism and
the GC overhead.
• FTL- GC OVER HEAD LOW, BML DEGREE OF
PARALLISM
• SIMULATION RESULTS IMPROVES RESPONSE TIME TO
79%
24. REFERENCES
• IEEETrans. Comput., vol. 60, no. 6, pp. 753–766, 2011 BY M. L.
Chiao and D.W. Chang.
• H. Shim, B. Seo, J. Kim, and S. Maeng, “An adaptive
partitioning scheme for DRAM-based cache in solid state
drives,” in Proc. IEEE IN NOV 2010
• R. McDougall and J. Mauro, FileBench [Online]. Available:
http:// www.solarisinternals.com/si/tools/filebench/
• http://www.intel.com/pressroom/.html
• http://www.physorg.com/news/.html
• http://www.storageview.com/.html