Presentation file for FINETECH Japan 2017 (Tokyo, April, 2017)

1. 1.OLED Encapsulation
2. Polarized UV Exposure
3. Interference Fringe Detector
4.Room Temp. Bonding/De-bonding
April 5 to 7, 2017
1Finetech Japan 2017R16-011
Exhibited Products Information

2. 1-1.封止・貼り合わせ/Encapsulation
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ランテクニカルサービスは様々な種類の貼り合わせ装置・封止装置を製造、販売しています。
搬送や環境管理、周辺機器とのインテグレーションも含め、封止工程をトータルでご提供します。
Lantechnical is providing the various kinds of Encapsulation, Lamination and Vacuum Assembly
tools. We provide the encapsulation process totally including the environment control and the
integration with other tools.
Basic
Spec.
Substrate size G2.5 to G6.0H
Vacuum 1Pa
Alignment +/-1μm
Finetech Japan 2017

3. 1-2.実験用貼り合わせ/R&D Encapsulation
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Basic
Spec.
Substrate size ~ 200x200mm
Vacuum 1Pa
H2O, O2 Below 1 ppm
ランテクニカルサービスは様々な種類の実験用・開発用貼り合わせ装置を製造、販売しています。
窒素環境管理、ディスペンサー機器とのインテグレーションも含め、貼り合わせ程をトータルでご提供します。
Lantechnical is providing the various kinds of Encapsulation tools. We provide the encapsulation
process totally including the N2 Gas environment control, Dispenser and the integration with
other tools.
Finetech Japan 2017

4. 2.偏光露光装置/Polarized UV Exposure Tool
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 偏光角(Brewster’s angle)による紫外
線露光を使用し、大画面でも一括露光
が可能です。
 One-shot exposure is possible to
use Brewster’s angle UV exposure.
主波長 (Wave Length) 313 nm
平行度 (Parallelism) +/- 1.5 °[ 2.0 kW ]
+/- 0.5 °[ 5.0 kW ]
消光比 (Extinction Ratio) 100:1 [ Center ]
照度分布 (Intensity Uniformity) +/- 3 %
照度 (Intensity) 8 mW/cm2 [ 200x200 mm ]
6 mW/cm2 [ 400x400 mm ]
リニア型偏光露光装置開発中
Linear type polarized UV exposure tool is under development.
Finetech Japan 2017

5. R16-011 5
3.干渉縞検査光源/Interference Fringe Detector
セルギャップの目視検査に/Cell Gap Inspection
薄膜の目視検査に/Thin Film Inspection
干渉縞検査用の光源として/Light Source for
Interference Fringe detector
Basic Specification
モデル(Model.) LANAX-2
主波長(Main Wage length) 589nm
発光エリア(Light Emitting area) 500x600mm
ユーティリティー(Utility) 200~240V, 50 or 60Hz
LANAX-2
 各種サイズ対応いたします。ご相談ください。
Various sizes are ok, please contact us!
Finetech Japan 2017

6. R16-011 Finetech Japan 2017 6
4.Room Temperature Bonding
/De-bonding

7. What is Room Temp. Bonding?4-1.
Finetech Japan 2017
Surface activation
Contact Bonding
Under Vacuum Condition
Ar
Surface oxide
Contamination
Room Temp. Bonding
Fundamentals of
Room Temp. Bonding
 Surface Activation – physical treatment & dry process
Surface activation
Ar Ion (atom) beam irradiation
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8.  Rapid Bonding – complete to bond within few seconds
theoretically
 High alignment accuracy – no shift after bonding
 No heat effect – under room temperature process
 Metal, Glass, Film --- any kinds of material can be bonded
 Possible to control the peel strength --- Not only Bonding
process but also De-Bonding process can be available.
Finetech Japan 2017
4-2. Features of Room Temp. Bonding
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9. In 2012, Lantechnical Service has developed "Room temperature bonding with
using Si Interlayer" which is improved from the conventional Room Temperature
bonding technology, with Suga Laboratory from the University of Tokyo. This
technology makes possible to bond Glass and Glass, Glass and Polymer, Polymer
and Polymer.
Room Temp. Bonding with Si Interlayer
Finetech Japan 2017
4-3.
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10. What is the difference?
Conventional vs. Si Interlayer
Finetech Japan 2017
4-4.
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Material A
Material A Material B
Feature of Lantechʼs Room Temp. Bonding is to use Si Interlayer.
We use Si Interlayer for the bonded interface.
This is our original method, and this is very unique technology.
ConventionalConventional Si InterlayerSi Interlayer
Si
Interlayer
Material A
Bonded
Interface

11. Metallic bond Covalent bond Ionic Bond Polymer Film
Soft Metals
Al, Cu Au, Su
Hard Metals
Ti, Ta, Fe
Semiconductors
Si, Ge, C, GaAs,
GaP, GaN, InP
NitrideSiN, TiN Carbide, Oxide
SiC Al2O3, SiO2,
LiNbO, LiTaO,
Superconductors
YBaCUo
PI, PET, PEN,
etc.
Conventional
VS
Si Interlayer
Conve
ntional
Si
Inter
layer
Conve
ntional
Si
Inter
layer
Conve
ntional
Si
Inter
layer
Conve
ntional
Si
Inter
layer
Conve
ntional
Si
Inter
layer
Conve
ntional
Si
Inter
layer
Soft
Metals
Al, Cu
Au, Su
○ ○ ○ ○ ○ ○ ○ ○ ○ ○ N/A ○
Hard
Metals
Ti, Ta,
Fe
△ ○ △ ○ △ ○ △ ○ N/A ○
Semico
nductor
s, etc
○ ○ ○ ○ △ ○ N/A ○
Nitride
SiN,
TiN
△ ○ △ ○ N/A ○
Carbide,
Oxide
SiC
Al2O3,
etc
× ○ N/A ○
PI, PET,
PEN,
etc. N/A ○
MetallicbondCovalentbondIonic
bond
Polymer
Film
Bendability (Conventional Room Temperature
Bonding vs. Si Interlayer bonding)
4-5.
Finetech Japan 2017 11R16-011

12. What Room Temp. Bond can do?
Finetech Japan 2017
4-6.
Adhesives are not allowed.
Applying Heat is not allowed
Bond dissimilar materials
Bond for De-Bond
We can bond the materials with Room Temperature Bonding technology with
Si Interlayer which is improved from the conventional Room Temp. bonding
technology.
Example,
常温接合が解決できます
[Bondable] --- Glass and Glass, Glass and Film, Film and Film, Film and
Metals --- Possible to bond Dissimilar materials.
[Features of bonding]
No Heat, No Adhesives. Intermolecular bonding.
[Control of Peel strength]
Not only strong bonding but also de-bonding if necessary. The peel
strength can be controlled with Room Temp. Bonding
Features;
Solved by Room
Temp. Bonding
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13. Conditions of Room Temp. Bonding
Finetech Japan 2017
4-7.
Surface Roughness
R-Max 10 nm below
Room Temp. Bonding is Direct Contact Bonding technology by
Intermolecular bonding. They can be bonded by low pressure
contact if the surface roughness is below R-Max 10nm.
The rough surface material such as Metal, we can provide the
solution of bonding based on the roughness of the materials.
Pressing
(few ton N/cm2)
< Roughness vs. Bonding Method >
Possible to
Bond*
Surface Roughness
R-Max 10 nm over
Surface Roughness
R-Max 10 nm over
Surface Polish
(CMP)
★We propose the best bonding solution according to the surface state of the customer's material.
Low Pressure
Contact
＊depends on the material properties
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14. De-BOND
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Applications of Room Temperature Bonding are very diverse.
There are two major fields, one is for Bonding and another is for
De-bonding. Each field has several applications.
OLED
Lighting
MEMS
Packaging
Battery
Packaging
LCD Panel
Alternative to HF etching
Flexible Device
Transfer
Si Wafer
Back Grind process
4-8. Applications of Room Temp. Bonding
OLED
Display
BOND
GOG process
(Glass on Glass)

15. Encapsulation of OLED display
Finetech Japan 2017
Application of the Encapsulation process of OLED Display
4-9.
• OLED display is attracting attention as the next generation display, especially
expected as a flexible display.
• The encapsulation technology is an important process technology for OLED display
because OLED should be protected from the penetration of the moisture and
oxygen.
• It is possible to respond to the flexible display, and also to have the sufficient
sealing performance with Room Temp. Bonding technology.
OLED panel
Encapsulated with Room Temp. Bonding
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＊PDL = Pixel Divided Layer
Barrier film or UTG
TFT
GR B
PI Film
SiN
Si
PI
[1~2μm]
[4~8nm]
[10~30nm]
Passivation
[Organic / Inorganic layers]
Barrier film or UTG
PI Film
WVTR:
2×10^-2[g/m^2・day]
PDL*

16. 剥離：常温接合
/De-Bonding:Room Temp. Bonding
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高温プロセスに対応した
after High Temperature Process
貼って剥がす
De-bonding
仮止め
Temporary Fix
薄物・フィルム搬送
Thin Film Transfer
お困りではありませんか？
高温プロセス後でも、剥がせます!
Possible to de-bond
常温接合剥離
De-bonding by Room Temp. Bonding
Finetech Japan 2017
4-10.

17. Finetech Japan 2017
Thin glass/UTG
Glass
Bonding
Customer’s
Process
De-Bonding
Bonding De-Bonding
Film
Glass
4-11.Bond/De-bond of Thin Glass/Film with Carrier glass
1) Possible to bond Glass/Film to Glass
2) Possible to De-bond even if heated during the process.
(Heating is not necessary for de-bond)
Features
of
RTB
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 TFT process
 Heat process
 Coating process
 Wet process etc…

18. Alternative technology instead of the process of
Chemical etching of LCD panels for slimming
Finetech Japan 2017
ODF
C
F
HF Chem.
Etching
RTB
BONDING
Bonding
Thin Glass +
Carrier Glass
De-bonding
Debond LCD
panel from
carrier glass.
Carrier Glass can
be reused
De-bond
Glass
Maker
Glass
Maker
LCD Panel
Maker
T
F
T
Polarizing
Plate
Module
ODF
C
F
T
F
T
Polarizing
Plate
Module
Current Process
Proposed
Process
LCD Panel
Maker
(e.g.)High temperature
process/450℃@90min
4-12.
We propose the new process technology, alternative
to the chemical HF polishing.
It is the solution of using the carrier glass to transfer
the thin glass which is bonded by RTB.
Cost of HF
Environmental issues
Limit in possible
thickness
Current Issues
Alternative
No need HF
Much thinner glass
Merit of Proposal
Use of existing tools
Low cost operation
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19. Ion Beam
Finetech Japan 2017
Evaluation Test4-13.
Evaluation Test of Room Temp. Bonding
We have an experimental tool in our factory and ready to test with
Customerʼs material.
Please contact the windows in the next page if you have any questions
and requests.
Experimental Tool in Gunma Factory
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20. お問い合わせ/Contact
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Area Window E-mail Language
East of Japan Hideaki Otomo otomo@lantechnical.co.jp Japanese/English
West of Japan Tsutomu Ueda t-ueda@lantechnical.co.jp Japanese
China/Taiwan Jack Wang jackwang@lantechnical.co.jp Chinese/Japanese
Korea Choi Chulho chulho-choi@lantechkr.com Korean/Japanese
Other area Hideaki Otomo otomo@lantechnical.co.jp English