Automata theory.

1. Assignment -2
Title: Emerging electronic packaging materials
Prepared by: Kedir Kamu, Sirur
Instructor : Pro. Yuan Lin
Date: October 9, 2014

2.  Basic electronic packaging materials include
 Metals: metal provides the ultimate gas and moisture barrier that can convey lifetime
values predicted to be more than 100 years , although raw materials can be quite
inexpensive , the fabrication methods used for packing generally adds substantial cost
 Ceramics : ceramics to be a popular material for hermetic packages that needs the
following attributes ; good planarity , smoothness' ,extreme mechanical stability high
thermal conductivity and excellent temperature stability.
 Plastics: plastic packaging primarily based on thermosets materials , accounts for
perhaps 95% of the world packaging market because of low cost , versatility and
easier automation

3. Emerging electronic packaging
materials
 Nano particles
 Macromolecules
 Nano wires
 Nano tubes
 Organic semiconductors
 Green materials
 Pb free
 Halogen free, High K dielectric

4. Major gaps identified on the current
technology and materials
 Active device technology
The predicted end of traditional CMOS
semiconductor scaling is generating significant
reverberations in approaches and structures of
computing systems.
 Thermal management
Another consequence of the expected demise of
the traditional scaling of semiconductors is the
increased need for improved cooling and
operating junction temperature reduction due to
large leakage currents and increase in chip power.

5.  Increased serial communications bandwidth
The third consequence of the end of the
traditional semiconductor and the gradual but
certain reduction of emphasis on the frequency
of microprocessor metric, and the corresponding
increase in importance of the system’s
throughput metric, is an increased demand for
higher bandwidth to and from the
microprocessor in any system.

6.  A key focus will be package and substrate
technology, which provides the bridge from the
device to the system.
 Nanotechnology may provide the solutions to six
of the strategic gaps identified by the iNEMI gap
analysis process.

7.  Next generation packaging technology
Every score of years the electronics industry has
introduced a new generation of packaging technology,
which has taken a decade to develop. It is very
apparent that a new generation of low-cost packaging
technology will be required during the next decade.
 Design and simulation tools
The lack of tools for mechanical, electrical, thermal,
environmental, optical co-design from the device to
the system level is delaying the introduction of new
technology. Significant research and development is
needed both in tools and techniques for effectively
partitioning the design and simulation.

8.  Sustainability metrics
The concept of sustainability is being widely adopted
and promoted by companies throughout the
electronics supply chain as a core tenet and measure of
performance of their business operations, largely in
response to heightened interest by stakeholders in
corporate social and environ-mental responsibility.

9. Carbon Nanotubes
The Amazing and Versatile Carbon – Chemical basis for life
With an atomic number of 6, Carbon is the 4th most abundant
element in the Universe by mass after
(Hydrogen Helium and Oxygen). It forms more compounds that
any other element, with almost 10
million pure organic compounds. Abundance, together with the
unique diversity of organic compounds
and their unusual polymer forming ability at the temperatures
commonly encountered on Earth makes
the element the chemical basis of all known life.