The candidate has over 20 years of experience in the semiconductor industry, including 10+ years working in LED technology and applications. They have held several leadership roles such as General Manager, AVP of Sales, and VP of Operations and Sales. They have a track record of successfully growing business, developing new technologies, and achieving annual targets. The candidate is motivated by challenging roles and working with talented teams.

1. KEY ABILITIES/CAREER MILESTONES
 Market researching as basis to set up effective marketing strategy
 Marketing and sales plan deployment according top level market target
 Sales plan review and management based on KPI and PDCA cycle
 Brief of career milestones as following
1. More than 10 years’ experience in LED related application business
plus 20+ years of working experience in semiconductor business from
packaging, testing…etc.
2. Familiar with LED technology and its application market.
3. Good cross function experience from engineering, QC/QA, operation
to marketing and sales.
4. 8 years (2008 till now) as general manager for Aether Systems
5. 3 years in LiteOn as AVP of sales cover international sales and global
key accounts.
6. 7 years in Winstek and other local IC packaging house as VP sales and
VP of operation
7. 12 years working experience in Texas Instruments as package engineer,
QA manager and marketing manager.
MOTIVATION FOR EXPLORING
 Challenge even tough jobs.
 Opportunity to co-work with talent people.

2. PROFESSIONAL EXPERIENCE
Sep. 2008 to Now Aether Systems Inc. (2nd
optics for LED)
General Manager
 Short-term and long-term strategy including technology and sales & marketing.
 Setting Annual plan and ensure the plan to be achieved successfully.
 P&L
Achievements:
 New technics and new application break through (Narrow spot, omin-direction,
flash, invisible…)
 Key accounts phased in.
Dec. 2005 to Aug.2008 LITE-ON Technology. OPTO depart.
(Taiwan No#1 and WW NO#7 LED packaging house)
AVP, oversea sales.
 Responsible for oversea sales, including USA, Europe, Korea, Japan and South
East Asia. And key accounts like Samsung, Motorola, Philips...
 Short term and long range Sales strategy to ensure continuous sales growth
 Ensure the annual targets can be 100% achieved.
Achievements:
 Successfully break NT 500M monthly revenue from NT 300M in one and half
years.
Reason for leaving : to join new start up company – Aether Systems Inc.
Oct 2001 to Dec.2005 Winstek Semiconductor Corp.
(member of STATSChipPac, a mixed signal/logic
testing house with largest installed high end Agilent
93K tester in Taiwan)
VP Sales reporting to CEO
 Building up sales and customer service team
 Sales planning and operation capacity planning
 Focus on key customers’ growth including TSMC, UMC, VisEra, Faraday,
Sunplus, SiS…etc.
Achievements:
 Sales amount ramping up to $14M quarterly from $4.1M in quarter within 6
months.
 Developed CMOS images sensor wafer sort and 12” wafer sort business (Winstek
is #1 CIS wafers sort testing house in Taiwan).
 To be granted as “Best supplier awards” by both TSMC and UMC in 2003.
Reason for leaving : Stepping into own brand company from OEM.

3. Feb. 1998 to Sep. 2001 Pan Pacific Semiconductor
(Local based assembly house, dedicated for
ceramic IC package and CMOS image sensor
assembly )
VP Operation, reporting to CEO
 IC assembly, both ceramic type and plastic type package for CMOS image sensor.
 In charge of RD, operation and marketing..
Achievements:
 Develop low cost plastic package for CMOS image sensor to replace high cost
ceramic package and price yield improvement.
 Granted with US patent,
 6249963, issue on Jun 26, 2001：System and method for coupling conductive
pellets to a component of an “Integrated Circuit”.
 6262479, issued on July,17, 2001：Semiconductor packaging structure
Reason for leaving : Company financial issue
May. 1986 to Feb. 1998 Texas Instruments Taiwan Ltd.
Manager of marketing, ASP group.
Manger of QA engineering
Manager of Engineer including process and new
package development.
 Covering different jobs including process engineering, package development
engineering, QA and regional operation.
Achievements:
 Yield improvement by DOE technics,
 Develop new IC package for high density IO
 Transfer regional business planning function to Taiwan from Singapore. ,
 Granted with US Patent Number:
 5923958, issued on July 13, 1999：Method of semiconductor chip packaging.
 6060340, issued on May 9, 2000：Packing method of semiconductor device
Reason for leaving : To search for more challenge job.

4. REMUNERATION
Annual Package :
Basic Monthly Salary : NT 150K x 13-14 months
Bonus : 80,000 technical shares
Stock option is under review.
Sales Commission : system is under review
Transport Allowance : NA
Telecommunication : NA
Profit Sharing : system is under review
Stock Options : system is under review.
Next Salary Adjustment : NA
Expected Salary : To be discussed.
AVAILABILITY
Notice Required : 1 and half month
ACADEMIC ACHIEVEMENTS
1997 to 2000 Master of Business Administration
National Taiwan University of Science and Technology
1976 to 1980 Bachelor of Mechanical Engineering
Ta-Tung Technical Institute

5. REFERENCE
Referee 1 : Dr.Rex Wu
Current Company / Position : LiteOn Technologies Company
Vice president
Relationship : Supervisor in LiteOn
Years known : over 10 years
Contact Number : 0921-811-305
Referee 1 : Richard Pao
Current Company / Position : Wise Human Resource Co., Ltd
Chairman
Relationship : Supervisor in TI
Years known : over 20 years
Contact Number : 0919-909599