This document summarizes a study on the movement of metallic particles in gas insulated busduct systems. Computer simulations were used to model the movement of aluminum and copper particles in uncoated and coated 3-phase busduct enclosures. The simulations considered forces like electrostatic force, gravity, and drag. Results showed aluminum particles moved further than copper in uncoated systems. Coated enclosures significantly reduced particle movement compared to uncoated. Particle movement increased with higher voltages but coating prevented bridging between phases.