The document is a call for papers for a special issue of The Scientific World Journal on the application of ceramic thin films to solid-state devices. Authors are invited to submit original research articles and review articles on topics related to ceramic thin films including fundamentals, fabrication technologies, characterization, modeling and applications to devices such as novel functional devices, nonvolatile memory, optoelectronics, advanced transistors, sensors, and solid oxide fuel cells. The lead guest editor provides contact information and manuscripts can be submitted online with a deadline of December 5, 2014.

1. The Scientific World Journal
Special Issue on
The Application of Ceramic Thin Films to Solid-State
Devices
CALL FOR PAPERSThe theme of the special issue is focused on the application of ceramic thin films
to solid-state devices. The interdisciplinary study of ceramic thin films is in the
confluence of materials science, surface science, chemistry, and applied physics and
becomes an identifiable unified discipline of scientific endeavor.
Authors are invited to submit original research articles as well as review articles to
this special issue.
Potential topics include, but are not limited to:
Fundamentals of ceramic thin films and their related devices:
Nanomaterials and nanostructured ceramic thin films
Reliability of nanolaminate thin films
Electronic structures and defects
Thermal and mechanical properties
Advanced fabrication technologies
Characterization of ceramic thin films
Modeling and simulation: device or process materials science and
device physics
Applications of ceramic thin films in the following:
Novel functional devices
Nonvolatile memory devices
Optoelectronic devices
Advanced transistors
Sensors and actuators, including biomedical applications
Organic materials based devices
Magnetics and magnetooptics
Superconductors
Solid oxide fuel cells
Authors can submit their manuscripts via the Manuscript Tracking System at
http://mts.hindawi.com/submit/journals/tswj/cmp/tcf/.
Lead Guest Editor
Fu-Chien Chiu, Ming Chuan University,
Taoyuan, Taiwan
fcchiu@mail.mcu.edu.tw
Guest Editors
Tung-Ming Pan, Chang Gung
University, Taoyuan, Taiwan
tmpan@mail.cgu.edu.tw
Keiichi Koyama, Kagoshima University,
Kagoshima, Japan
koyama@sci.kagoshima-u.ac.jp
Cheng-Fu Chen, University of Alaska
Fairbanks, Fairbanks, USA
cf.chen@alaska.edu
Shahinur Rahman, Nanoelectronic
Materials Lab (NaMLab gGmbH),
Dresden, Germany
shahinur.rahman@namlab.com
Manuscript Due
Friday, 5 December 2014
First Round of Reviews
Friday, 27 February 2015
Publication Date
Friday, 24 April 2015