Designed for easy IO-Link integration into Ethernet-based fieldbuses and scalable system evaluation, including RX-based header board, two IO-Link Master modules, sensor board and evaluation IO-Link Master software stack and device tools.

1. Easy IO-Link Ethernet Integration
10 Reasons to Use Connect-it! Remote IO Solution Kits
Renesas Electronics Europe
Industrial & Communications Business Group
Rev. 1.00
© 2014 Renesas Electronics Europe. All rights reserved.
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2. Complete Package for Remote IO Design
Scalable IO-Link
reference design
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Complete H/W
& S/W Platform
Expandable
host controller
Embedded pre-certified
fieldbus middleware
Schematic &
PCB layout files
Engineering tool
for IO system
Expert partner
support services

3. Flexible Mapping to Ethernet Fieldbuses
© 2014 Renesas Electronics Europe. All rights reserved.
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4. Comprehensive Development Environment
Host
Machine
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Diagnosis Data
Process Data
Parameter Data
Teach-in
IO-Link
Master
OCD
(On-Chip Debug)
Demonstration GUI
& IO-Link Device Tool
Software Development
Programming
IO-Link
Slaves
M12
cable
IO-Link
Slaves

5. Comprehensive Software Platform
Connect-it! includes:
ƒ Renesas IO-Link Device Tool
ƒ TMG IO-Link Master stack firmware
free of charge evaluation version
ƒ IO-Link specification V1.1 compliance
• COM1, COM2, COM3 supported
• Frame Types: 0, 1 and 2.X
ƒ Host library interface source code
ƒ Running demo project including BSP
© 2014 Renesas Electronics Europe. All rights reserved.
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for RX63N host microcontroller
ƒ IAR Embedded Workbench Kickstart
versions included for 78K & RX
• EW78K
• EWRX

6. Easy Prototyping With Pre-Certified Software
© 2014 Renesas Electronics Europe. All rights reserved.
Develop on the platform
ƒ Free evaluation software package from
TMG GmbH including
• IO-Link Master v1.1
• Ethernet/IP stack
• Profinet RT stack
ƒ Firmware stacks pre-flashed in the
platform for out of the box demo
purposes.
ƒ Customisable libraries provided for
host CPU and master IO-Link Master
modules for freedom in developing IO-Link
applications on the platform
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7. Fieldbus Independent Communication to Tools
© 2014 Renesas Electronics Europe. All rights reserved.
Protocol stack
ƒ All necessary functions to get
connected to IO-Link masters or
look for accessible ones
ƒ Configuration of Master devices
ƒ Reading from the master’s
configuration setup
ƒ Writing of output process data
ƒ Diagnosis, identification,
parameterization and display of the
process data from IO-Link devices
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8. Simplified High Performance Architecture
© 2014 Renesas Electronics Europe. All rights reserved.
Integration + optimisation
ƒ 10% higher performance than
traditional 32-bit MCU / multi-channel
IO-Link PHY configurations
ƒ <1ms Cycle time
ƒ 4% CPU loading from SPI
ƒ Synchronous with process cycles
ƒ Only needs 4 tracks on PCB
ƒ Highest throughput architecture with
no performance or timing bottlenecks
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Simplified PCB
design & no heat
or EMC concerns

9. Expandable 32-Bit Uplink Controller
On-board Interface to
connect to and use other
Renesas 32-bit MCU families
© 2014 Renesas Electronics Europe. All rights reserved.
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10. Scalable Modular Platform
© 2014 Renesas Electronics Europe. All rights reserved. 10
Built on Renesas PHY,
RX63N Ethernet MCU
& K0R IO/Link MCU
Scalable interfaces
to expand IO-Link
network…

11. Scalable Master Modules
© 2014 Renesas Electronics Europe. All rights reserved.
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Add-on Master module
available to increase
number of ports
Pre-Flashed with TMG
IO-Link Master
stack firmware
/// Order code: Y-78K0RIOLINKMADM

12. Find Out More!
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www.renesas.eu/io-link
RenesasPresents
@Renesas_europe
Renesas Europe
Renesas Europe

13. Renesas Electronics Europe
© 2014 Renesas Electronics Europe. All rights reserved.
© 2014 Renesas Electronics Europe. All rights reserved.