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- 2. Flexible printed circuits have become an indispensable part of our lives, being used in various devices including computers, tablets, heart monitoring devices and much more. In this write-up let us discuss about flexible circuit construction and their different types.
- 3. Even though the flexible circuit materials are extremely variable, still there is a specific topology to FPC fabrication that follows limited generic differences. A wide array of flexible circuits that are discovered in various interconnections and flexible packaging applications follow these basic designs:
- 4. When it comes to single sided FPC, they are actually the most basic forms of available flexible circuits. They compromise of a single conductor layer on a flexible dielectric film. This layer has entrée from just one side to circuit termination. The single sided flexible circuits can be developed with or without protective coatings and cover lays. Additionally, they consist of an extremely simple design, making them highly reasonably priced. The conductors that can be utilized can be low cost polymer thick film or metal foil can also be used.
- 5. These forms of PCB fab have been manufactured for meeting the demands for reasonably priced circuits that can handle an enhancement in component real estate demand. Using these kinds of circuits permits the designers placing components on both sides of the flexible dielectric film. For accessing both dies of the film, it needs vigilant designs to permit the areas of the conductors that are exposed to become available for attaching the underside component. This many a times infer that through holes need to be punched in the dielectric film before it is laminated with the conductor.
- 6. These forms of FPC fabrication are also extremely famous. Higher conductor numbers are required due to the ever increasing demand for placing extra components on a circuit and enhancing the power handling capabilities and circuit density. This can be ensured through the incorporation of more than a single conductive layer on the same base film. They can be built through different forms like printed conductors separated via printed insulating cover lays and spate conductors on both sides of the base firm.
- 7. A problem with double sided PCB fab is ascertaining credible connectivity mediums between components that are mounted on the bottom and the top of the board. But due to great advancement in technology, these issues can now be easily overcome through providing connectivity via multilayered laminates.
- 8. Shax Engineering, Inc. 2365-F Paragon Drive, San Jose, CA 95131 408.452.1500 Toll Free – 800.814.1380 info@shax-eng.com 408.441.063