The future packaging trend points to further reduction in the package mounted height as shown in Figure 1. Packaging experts are proposing the concept of Paper Thin Package (PTP) which is defined by a package mounted height of 0.2 mm or below. Discuss what design considerations and interconnection method are needed the package height of 0.2 [mm]. Solution Design considerations and process for PTP ( Paper thin Packaging) Technologies : 1. Consideration: Thin film RDL layer , BGA solder ball, Epoxy molding compound etc. 2.Paper thin organic Package structure : A typical plastic laminated package with EMC ( Epoxy molding compound) has warpage challenge. Ultra- low CTE laminated material is designed to minimize CTE mismatch with die. 3. Simulation: FEM( Finite Element Model) based simulation is used to analyze CTE induced package warpage in order to optimize package material and design. 4. Cavity structure simulation 5. solder mast effectiveness simulation 6.Paper thin organic substrate fabrication Etc.MaterialYoungs Modulus (Gpa)Poission\'s RatioCTE(ppm/k)Laminated core210.32Prepreg190.313RXP-41.880.345UnderFill30.3455.