Introduction To Princo Pkg Plateform
- 14. Reliability
Moisture sensitivity level 1(MSL1) Pass
Ball pull after multi-reflow Pass
Thermal cycle test-IPC-TC3 Pass
High temperature/humidity test Pass
Biased HTMT Pass
- 15. At present:
Wire bond/ Organic PCB/
MOS
Metal layer Bump/ Substrate/ FPC/
device
Princo uBump Assembly Assembly
Front-end/Foundry Back-end/OSAT PCB/EMS/
Near future: Module
MOS Cu pillar/ Wire bond/ Organic PCB/
TSV Metal layer Si interposer/ Bump/ Substrate/ FPC/
device
Si-Si stack Princo uBump Assembly Assembly
Front-end/ Middle-end/Foundry or OSAT Back-end/ PCB/EMS/
Foundry OSAT Module
Chip owner’s solution
Princo’s solution