Company profile of AET

1. Your High Tech / High Mix partner
in PCB manufacturing
Quality ． Commitment ． Flexibility ． Technology

2. Organization
●
●
AET mother company is based in HONG KONG
2 PCB production sites :
●
●
●
●
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Guangzhou for Double Side, Multilayer Rigid & Rigid Flex boards
Incheon, Korea for high layer HDI, Flex and Rigid Flex boards
Monthly capacity : > 45,000 sqm.
Plants floor area : > 75,000 sqm.
Nearly 900 employees

3. Guangzhou Factory
Built
Capability
Land Space
Monthly capacity
Employees
ISO14001:2004
TS16949:2002
ISO9001:2008
UL
Guangzhou factory
2004
2 ~ 12 layers
18 000 m²
20 000 m²
800 people
Yes
Yes
Yes
Yes

4. Korea Factory
Built
Capability
Land Space
Monthly capacity
Employees
ISO-14001
QS-9000
ISO/TS-16949
UL
Korea factory
1985
2 ~ 24 layers
65 000 m²
25 000 m²
100 people
Yes
Yes
Yes
Yes

5. Organization Chart
AET HK
Board of Directors
Korea
Factory
Finance
Marketing
Department
Guangzhou
Factory
G.M.
Office
Customer
Service
G.M.
Office
Engineering
Engineering
Manufacturing
Manufacturing
Q.A.
Q.A.
Shipping
Department
Sales
Purchasing
Admin
Purchasing
Admin

6. One Common Vision
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Quality Comes Always First
●
Quick and customer-oriented response
●
Competitive pricing
●
Outstanding service
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One stop PCB solution for any volume
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Worldwide market player in High Tech PCB
●
Top qualified people at your service

7. AET Market Positioning : High Tech / High Mix
Rigid Printed Circuit Boards
HDI boards
Flex boards
Rigid Flex boards
1 to 24 layers
Blind, buried and micro vias
1 to 14 layers
2 to 16 layers
Lead time :
2 ~ 2.5 weeks for normal mass production
4 weeks for HDI high layer count mass production
from 5 working days for quick turn and samples

8. Quick Turn Service
Layers
0 – 1m2
1 – 3m2
3 – 5m2
5 – 10m2
1
5 Days
6 Days
8 Days
10 Days
2
5 Days
6 Days
8 Days
10 Days
4
6 Days
8 Days
11 Days
13 Days
6
8 Days
11 Days
12 Days
14 Days
8
9 Days
12 Days
14 Days
16 Days
10
10 Days
15 Days
17 Days
20 Days
* for 10m2 or more, lead time will be confirmed by AET.
* Special requirement such as high TG, blind via, buried via etc is not
included in above lead time, it will will be confirmed case by case.

9. AET Products Distribution
3.00%
USAGE :
Rigid - Single side
Rigid - Double sided
Rigid - 4 to 24 layers
Flex boards
Rigid - flex boards
10.00%
31.00%
32.00%
●
Medical
●
Automotive
●
Mobile Devices
●
Computer & Peripherals
●
Networks & Communication
●
Consumer
25.00%

10. Capability Rigid Board
Feature
Condition
Current
British System
Metric System
24 (Mass Production), 48 (Sample)
8 mil to 280 mil
0.02mm – 7.0mm
1+N+1/2+N+2
Sequential Build-Up
3+N+3(IVH)
N+N, N+N (Microvia)
Sequential Lamination
Filled by Cu Paste / capped
Yes
Via in Pad and laser via filling
Yes
FR4, RCC, Rogers RO4000, Halogen Free
Material
Inner and outer Layers
1/3oz – 10 oz
Copper Foil
Minimum
1.5mil / 3mil
38μm / 75μm
Solder Mask Opening / Dam
Solder Mask
Dielectric Thickness Core and prepreg Thickness
Minimum
2.8mil
0.07mm
Minimum
4mil
0.1mm
Hole Formation
Drill Hole
Maximum
260mil
6.5mm
0.1mm / 0.0875mm
½ Oz / ½ Oz
4mil / 3.5mil
Electrical Capability
0.1mm / 0.0875mm
1 Oz / 1 Oz
4mil / 3.5mil
0.125mm/0.152mm
Minimum Line and space
2 Oz / 2 Oz
5mil / 6 mil
0.152mm/0.178mm
3 Oz / 3 Oz
6mil / 7mil
0.178mm/0.204mm
4 Oz / 4 Oz
7mil / 8mil
+/-10%
Impedance Control
Mechanical Through Hole
13:1
Aspect Ratio
Plating Capability
≤ 0.8mm
+/-10%
Dimension Tolerance
Board Thickness
> 0.8mm
+/-8%
D<1.0mm
+/-5mil
+/- 0.127mm
Hole to Hole
D>1.0mm
+/-3mil
+/-0.076mm
Hole to Hole
D<1.0mm
+/-8mil
+/- 0.204mm
Hole to Edge
D>1.0mm
+/-6mil
+/-0.152
Hole to Edge
+/-4mil
+/- 0.1mm
Edge to Edge
OSP, Electroless Nickel/Immersion Gold (ENIG), Selective OSP/ENIG, Immersion Silver, Hot Air Solder Levelling
Surface Finish
(HASL) and LF HASL, Immersion Tin, Carbon Ink.
Structure
Layer Count
Board Thickness
Maximum
Min / max

11. Capability Flex and Rigid-Flex Board
ITEM
Min. Line width/Spacing
Min. Laser micro Via-hole (Dia/Land)
FLEXIBLE PCB
Min. Mechanical Via Hole Size
Min. SMT/BGA Pitch
Max. Layer count
Min. Line width/Spacing
Min. Laser micro Via-hole (Dia/Land)
FLEX-RIGID PCB
Min. Mechanical Via Hole Size
Min. SMT/BGA Pitch
Max. Layer count
UNIT
PROTO
MASS
㎛
mil
㎛
mil
mm
mil
㎛
mil
layer
㎛
mil
㎛
mil
mm
mil
㎛
mil
layer
35 / 35
1.4 /1.4
50 / 150
2/6
0.08
3.2
300
12
14
70 / 70
2.8 / 2.8
75 / 250
3 /10
0.1
4
250
10
16
75 / 75
3/3
75 / 250
3 / 10
0.15
6
350
14
10
100 / 100
4/4
75 / 250
3 /10
0.1
4
300
12
10

12. Quality Always Comes First :
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ISO 9001:2008 certified by B.V.
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ISO 14001 certified
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UL approved : E315785
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IPC A 600 class 2 or 3
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RoHs and Halogen Free production
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REACH certified

13. AET is your long term Partner for your
Sustainable Development
We strongly believe in Business Ethics
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- Deliver the highest quality of service and products
- Respect our commitments
- Good business is done by and with good people
We want Everyone to be a Winner
●
- Our Customers
- Our Employees
- Our Owners
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We care our Common Environment
- To use the best clean products and techniques
- To maintain and embellish our environment

14. We work together :

15. Our Future
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Increase our capacity and capabilities
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Invest in equipment regularly
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Update our employees with latest techniques
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Improve our Management skills
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Use up to date environment friendly processes
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Rank in the TOP 100 PCB manufacturers

16. Major Equipment List (Guangzhou)
Process
Cutting
Press
CNC Drill
PLATING
Equipment
Cutting machine
Press Machine
CNC Drill Machine
Deburr line
Auto PTH line
Auto Panel Plating line
Scrubbing line/ IS pumice scrubber
Dry Film
D/F Laminator
Auto Cut Sheet D/F Laminator
Exposure m/c
Developer
Inner Stripping and etching line
Pattern Plating Auto Cu/Sn plating line
Ni/Au plating Auto Ni/Au plating line
manual-automatic Ni/Au plating line
Stripping and etching line
Etching
Sn Stripping line
A.O.I.
QC
Screen printing Screen machine
Post cure oven
Qty
1
1
20
1
1
1
2
1
2
7
2
1
1
1
1
1
1
3
8
7
Process
Wet Film
ENIG
HAL
Gold Finger
OSP
Routing
Punching
V-Cut
E-Testing
Equipment
IS pumice scrubber
Ni/Au pretreatment line
Screening m/c
Pre-cure oven
Exposure line
Developing line
Auto ENIG line
Post treatment line
HASL-Lead Free
Pre-cure /Post treatment line
Auto-plating gold finger line
OSP line
Routing Machine
Punching machine
Auto-wash line
CNC V-cut
E-Tester
Flying Probe test
Qty
1
1
9
3
4
1
1
1
1
1
1
1
10
8
3
4
26
2

17. Major Equipment List (Korea)
Process
Equipment
Qty
Cutting machine
2
Cutting
Chamfering machine
1
Stacking machine
2
Hot press
2
MLB
Brown Oxide Line
1
CNC Drill Drill machine
27
Cleaning machine
1
Auto laminator
2
Auto Exposure machine
1
D/F
S-Auto Exposure machine 1
1
Desmear Line
Inspection machine
1
Inspection
AOI
2
Routing machine
18
Router
V-Cut machine
3
Auto Test machine
1
E Test
Semi-auto test machine
3
Process
Equipment
Cleaning machine
PSR Printing machine
PSR
PSR Exposure machine
Silk Printing machine
LPP
Exposure machine
Photo tool
Film Auto Tester
2D Tester
Stacking machine
Drill machine
CNC
Routing /C
X-ray machine
MLB
Hotpress
Solder Tester
Peel Tester
LAB
Microscope (X1000)
PCB thickness Tester
Qty
1
4
3
4
1
1
1
2
1
2
1
1
2
1
1
1
1

18. Exhibitions and Fairs
HKTDC Hong Kong 04/2009
IPC San Diego 2012
HKTDC 10/2009
HKTDC 04/2013
HKTDC 10/2008
Electronica New Dehli 2011
Electronica Munchen 2012
Electronica Munchen 2010
HKTDC 04/2008
HKTDC 04/2011

19. Contact Us :
Head Office:
Advanced Electronic Technology H.K. Limited,
Office 01, 28th floor, Singga Commercial Centre,
148 Connaught Road West, Western, Hong Kong
Tel : +852 3528 0460
Fax :+852 3528 0470 / Fax USA : 2134 55 2604
Skype : attscs
email : info@aetpcb.com
Sales and Marketing Office:
Room 4, 13fl., Bldg 02, Haiyang, Haibin Garden,
Xinhua Road 05, Shekou, Nanshan District,
Shenzhen, P.R.C.
Tel : +86 4006 782 881
Fax: +86 755 3360 9545
Factories:
Guangzhou, China
Incheon, Korea
www.aetpcb.com