2. Company Profile
• >10 years: Experience in the PCB manufacture and PCB assembly.
• >500 Employees: Skilled workforce for your production.
• >800 Clients: Serving a large customer group worldwide.
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3. Vision & Mission
Vision
• To be the pioneer of PCB & PCBA service
• To maximize the interests of all parties
Mission
• Quality: Best quality PCB & PCBA service
• Commercial: Provide the most cost effective solution
• Service: Technical support and valued added service
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4. Market Served
Our Customer come from a wide variety of industries and
business segments:
o Telecom
Medical
Automotive
Computing & IT
Industrial Control
LED Lighting
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5. PCB Fabrication
PCB type: Rigid PCB, flexible PCB, rigid-flex PCB.
Materials: CEM1, FR4, metal core and special materials.
Layer count: 1-2 layer PCB; Multilayer boards up to 28 layers
Technology: HDI, blind and buried via, controlled impedance etc
Surface finishes: HAL, ENIG, Gold plating, OSP, carbon ink etc
Service: prototype, quick turn, small to volume production
……. & much more
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7. PCB Capability
Layer Count 1-28 layers
Base Materials CEM1; FR4(High Tg); Metal Core
Board thickness 6-240mil
Max panel size 500mm*1200mm
Max Copper Thickness 8 OZ
Min Hole Size 0.2mm(Mechanical); 0.075mm(Laser Drilling)
Min line width/space 0.075mm / 0.075mm
Via hole type Blind / Buried / Plugged
Surface finish HASL(LF); ENIG; OSP; Gold Plating Gold Finger;
Carbon Print; Peelable S/M; Selective Gold Plating
Solder mask color Green, Blue, White, Black, Red
Impedance ±10%
Outline finish type CNC Routing; V-Scoring / Cut; Punch
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8. Typical Cases
0.4MM thickness 0.1 mm hole 8 Layer with edge plating IT180A HDI blind Vias
6 Layers Immersion Silver 20 Layer 2.54MM 400*500MM 28 layers ATE test board
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9. Typical Cases
10 Layer ENIG with Gold finger 2 Layer flexible PCB Metal Core PCB
16
6 layer rigid-flex PCB 2 layer 8 OZ copper thickness Roger 4350 + FR4 substrute
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10. Parts Sourcing
Supplier Management, verified and authorized sources only.
Component Engineering, Component Qualifications and
Alternative Sources Suggestion Capability.
SAP EPR System for Planning, Purchasing, and Inventory Manage
ment.
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11. PCB Assembly
SMT, THT and SMT & THT mixed Technology.
RoHS and Non RoHS manufacturing
Prototype, low to medium volume production(1-5000 PCS)
Turnkey/Consignment Supply Chain Solutions
Support 0201, BGA, uBGA, QFN,POP and Leadless chips.
Test solutions: X-ray, AOI, ICT, Vision inspection and Function test
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13. PCBA Capability
Minimum Component 0201
Maximum Height 20mm
Minimum Spacing BGA 0.4 Pitch; IC 0.3 Pitch
Maximum Board Size 450 * 730mm
Board Thickness 0.3~6.0mm
Type of Solder RoHS and Non-RoHS
Technology POP, Bonding, Auto Plug-in
Testing Capability AOI; X-ray; ICT Testing; Function testing
Service Types Prototype; Small to medium volume(5000 PCS)
Lead time Prototype/small volume: 3-4 days;
medium volume(1000-5000 PCS): 7-10 days
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14. Typical cases
Signal Control Main Board Diagnostic tool for automotive Hitachi Elevator Controller
USB analyzer LED Controller Main Board Telecommunication Board
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15. Quality
PCB Quality:
100% electrically inspected either by flying probe or Fixture.
Vacuum sealed packages to avoid dust or humidity
No X-outs in order to assist your assembly process.
Components Sourcing
All parts from original manufacturer or authorized distributor.
Professional IQC with dedicated component test laboratory.
PCB Assembly
Experience engineers and skilled production employees
Extensive testing capabilities including AOI, ICT, X-Ray etc
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