Status of Advanced Substrates report 2018

© 2018
From Technologies to Markets
Sample
Status of
Advanced
Substrates
2018
Embedded Dies &
Interconnects,Substrate
Like PCB Trends
Publication date:March 2018

2Status of Advanced Substrates 2018 | Sample | www.yole.fr | ©2018
OBJECTIVES OF THIS REPORT
• To provide an update on board and substrate
o Terminology definition
o Segmentation by types of substrates
o Segmentation by players and respective business models
• To provide analysis of technology trends
o Competition zones and overlaps
o Board vs. FC substrate
o FC substrate vs.Wafer Level Package
o Focus on Substrate Like PCB and Embedded Die in Laminate
o Technology roadmaps
• To assess the future development of the advanced substrate market
o Identification of main players
o Supply chain analysis and shifting business models
o Market forecasts for Substrates,SLP and Embedded die
o Outlook on new market drivers and emerging applications
This report is an overview report on advanced substrates that builds on 2 previous reports, “Advanced Substrates
Overview 2017: From IC package to board” and “Embedded Die Packaging: Technology and Market Trends 2017”. The
objectives of this report are as follows:

REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology

REPORT METHODOLOGY
Technology analysismethodology
Information collection

5
o Authors 2
o Packaging atYole 3
o Related Reports 4
o Introduction 6
 Table of contents
 Report objectives
 Report Synergies
 Advanced Substrate activity
 Companies named in the report
o Executive Summary 12
o Advanced Substrate segmentation 37
 PCB/Substrate/RDL segmentation
 Report Scope
o Embedded Die in laminate package 136
 Introduction
 Technology segmentation
 Cost consideration
 Drivers & applications
 Rationale for embedded die adoption
 Applications by market
 Market forecasts
 Embedded die forecasts in units breakdown by
market including MCeP
 Embedded die forecasts in revenues
breakdown by market including MCeP
 Embedded bridge/interconnectionsforecasts in
units
 Embedded die package players
 Embedded die business models analysis
 Supply Chain
 IP landscape
 IP dynamics
 IP players ranking
 Patents corpus segmentation
 Technology and roadmaps
 Main technology review by player
o Conclusions 224
o Report methodology 228
o YOLE presentation 230
o PCB/Substrate Market drivers and dynamics 47
 Advanced packaging drivers
 Board and advanced substrate drivers
 Competing platforms (board vs. IC substrate, IC
substrate vs.WLP)
 Disruptions and opportunities
 IC substrates market forecasts
o Substrate-Like PCB product 68
 Drivers and Market Dynamics
 SLP Market forecasts and Supply Chain
 PCBTechnology analysis
 Process flow comparison
 Physical teardown analysis
 Roadmap
o Financials analysis 105
 Top 100 PCB/Substrate manufacturers rankings
 Top 20 & selected manufacturers
 Business model
 PCB/Substrate revenue analysis
 PCB/Substrate revenue market forecast
 Company financial analysis – selected players
TABLE OF CONTENTS
Status of Advanced Substrates 2018 | Sample | www.yole.fr | ©2018

6
Biographies & contacts
ABOUTTHE AUTHORS
Andrej Ivankovic
Amdrej Ivankovic was a a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement the
"More than Moore" market research and strategy consulting company. He holds a master’s degree in Electrical Engineering, with specialization in
Industrial Electronics from the University of Zagreb, Croatia and a PhD in Mechanical Engineering from KU Leuven, Belgium. He started as an intern at
ON Semiconductor performing reliability tests, failure analysis and characterization of power electronics and packages. The following 4 years he
worked as a R&D engineer at IMEC Belgium on the development of 3D IC technology, focusing on electrical and thermo-mechanical issues of 3D
stacking and packaging. Part of this time he also worked at GLOBALFOUNDRIES as an external researcher. He has regularly presented at
international conferences authoring and co-authoring 18 papers and 1 patent.
Vivienne Hsu
Vivienne Hsu is a Technology & Market Analyst at Yole Développement (Yole). As part of the Advanced Packaging & Semiconductor Manufacturing
team, Vivienne contributes to the development of Yole’s activities. She is engaged in development of market research reports and providing customized
services for clients. Graduated from Phelma, Grenoble INP (Grenoble, France), she completed her Master’s degree in Materials Science by carrying out
a thesis about metal characterization with electron microscopy at EDF and joined Yole in 2017.
Emilie Jolivet
Emilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement the "More
than Moore" market research and strategy consulting company. She holds a master’s degree Applied Physics specialized in Microelectronics from INSA
Toulouse. After an internship in failure analysis in Freescale, she took the position of R&D engineer for 7 years in photovoltaic business and co-
authored several scientific articles. Strong for this experience, she graduated from a master in Business Administration at IAE Lyon and then joined EV
Group as a business development manager in 3D & Advanced Packaging before joining Yole Développement in 2016.

7
COMPANIES CITED IN THE REPORT
3CEMS, 3M,3Win Group,AMD,Amkor, Amphenol, AMS,Aoshikang,Apple,AOI AT&S,ASE, Avago,Benchmark,Boardtek,Bosch,
Career,CCTC, Celestica,Chin Poon, ChipBond, ChipMOS, CMK, Compeq, Continental,Cosmotech, Cyntec,Daeduck,Daimler,
Deca Technologies,DyconexAG, Dynamic, Eastern,Ellington, Elmos Semiconductor, Ericsson,Epoche and Esp, Facebook,Fast
Print, Flex, Flexium, Founder,Ford, Foxconn, Fujikura, Fujitsu, GaN Systems,General Electric, Gold Circuit, Google, HannStar
Board, Hella,HiSilicon, Hitachi Chemical, HighTec EDV Systeme,Hofmann Leiterplatten,Huatian,Huawei,Ibiden, Ichia, Inari
Berhad,Infineon, Intel, Isu Petasys,Jabil, JCET, J-devices,Juniper Networks,KCE Electronics, Kingboard,Kinsus, Kinwong, KYEC,
Kyocera,Kyoden, Lenovo,LG Innotek,Maxim, Meiko, Mflex, MGC, Micron,Microsemi,Nanium, Nantong Fujitsu, NanYa PCB,
Nepes,Nippon Mektron,Nitto Denko, NTK, NXP, OKI, Olympic, ON Semiconductor, Oracle, Panasonic,Panasonic Avionics,
Plessey,Plexus,Powertech Technology,Porsche,Qualcomm, Renesas,Samsung, Sanmina, Sarda Technologies,Schweizer, Shennan
Circuit, Rohm Semiconductor, Shinko, Simmtech, SK Hynix,Somacis, Soundchip SA, SPIL, STATS ChipPAC, St Jude Medical,
Starkey,ST Microelectronics,Sumitomo Denko,TaiyoYuden,Taiwan PCB Techvest,TCL,TDK-EPCOS,Texas Instruments,Thalès,
TTM Technologies,Toppan,TransSiP,Tripod,Trigence,Qorvo, Qualcomm,TSMC, Unimicron, Unisem, Unitech, UTAC,Valeo,Wus
Group,Würth Elektronik,Wuzhou, Xilinx,Yamamoto Manufacturing, Young Poong Group, ZD Tech…and many more
> 120 companies citedin the report (non-exhaustive list)

PACKAGING@YOLE
ADVANCED PACKAGING
• Fan Out Packaging - PoP
• 3D / 2.5D Packaging- SiP
• Flip Chip BGA
• WLCSP
PACKAGING
• Leadframepackages
• Ceramic packages
SUBSTRATES
• Advanced Substrates
• Printed Circuit Board
• Embedded Dies
• Substrate like PCB (SLP)
APPLICATIVE PACKAGING
• CMOS Image Sensor
• MEMS & Sensors
• Power & LED
• Photonics
Flip Chip BGA PoP FOWLP 2,5D Interposer
WLCSP
SiP 3DIC3D WLP
Camera Level Packaging
Power Module Packaging
MEMS Packaging
LED Packaging
QFP
QFN
PGA
LCC W/BBGA
Lead-Frame
PCB
Organic Substrate
(BGA type)
Rigid flex PCB
LGA
Substrate like PCB
(SLP)

THE ADVANCED SUBSTRATES ACTIVITY
Standalone activity focused on the analysis of PCBs,IC substrates and embedded die in laminate
Yole Développement is managing a separate and standalone “Advanced Substrate” activity, dedicated to exploring the
market and technologiesof PCBs, IC substrates andembeddeddie in laminate
The “Advanced Substrate” activity aims to connect the landscapes of boards, IC substrates and provide analysis on
these topics“underone roof”
The objectives ofthe“AdvancedSubstrates” activity will be to:
o Propose a common terminology framework
o Identify and analyze competitive and overlapping“advanced substrate” technologies
o Analyze the supply chain and businessmodel shifts
o Provide substrate related market forecasts
o Provide substrate related technology roadmaps
o Provide an outlook on market dynamics and disruptions
o Identify market shares
o Provide analysis on substrate architectures,equipment and materials
Advanced
Substrates
& PCB
activity

BOARD L/S SOLUTIONS
Substrate
manufacturers
vs.PCB
manufacturers
PCB IC Substrate
mSAP
Panel Size
Challenge
Subtrative
Technology
Investment
25/2530/30
L/S (µm/µm)
Substrate ManufacturersPCB Manufacturers
OPPORTUNITY!
PCB & Substrate Manufacturers
SLP
Images courtesy: AT&S

Overall board,substrateand RDL
segmentation
Rigidity
Substrate type
Organic
manufacturing
Si/Ceramic/Glass
manufacturing
Metal basis
Integration Level
IC Packagelevel Rigid • FC/WB
core/coreless
laminate/build up
substrate
• Embedded Die in
Substrate
• Fan-Out PLP
• WB/FC ceramic
substrate
• Thin Film RDL
(Fan-Out,Fan-In
WLP)
• Si/Glass
interposers
• Leadframes
Board Level Rigid Rigid board Rigid ceramic board Rigid board with metal
core
Flexible Flexible board N/A N/A
Rigid-Flexible Rigid-Flexible board Rigid-Flexible board
(Rigid ceramic
connected with
organic flex)
Rigid-Flexible board
(Rigid with metal core
connected with
organic flex)
ADVANCED INTERCONNECT SEGMENTATION Focus of the report

Board & Substrate
Drivers
Manufacturing
• Shorter
Design and
Manufacturi
ng time
Dimensional
• Higher
resolution
(L/S)
• Lower z-
height
Electrical
• Higher
bandwidth
• Higher
frequency
operation
Thermal
• Lower
thermal
resistances
• Better
cooling
Cost
• Ever lower
cost
BOARD,AND SUBSTRATE DRIVERS
Boards,package substratesand RDL essentially share the same governingdrivers,on different scales
Smaller form
factor and
higher
performance
at lower cost
Dimensional:
o Z-height decrease
• lower dielectric thickness
• lower line thickness
• Core removal (coreless
board/substrate)
o Higher resolution – decreasing line width
and line space (L/S)
Electrical:
o High speed transmission due to increasing
data rates
o Higher frequencyoperation,loss control
o LowerThermalresistance, where critical
Architecture:
o Removing core to further reduce thickness
o Embedding activeand passive components
o Hybrid substrate/thin film RDL solutions

ADVANCED SUBSTRATE TECHNOLOGY – COMPETITIVE AREAS 2020
1
2
3
Substrate vs.board
Substrate vs.WLP
OrganicWLP and dual
damasceneWLP vs.2.5D IC
Competitive technology areas:

SUBSTRATE-LIKE PCB MARKET
• By 2023,XX% of PCB revenue in
cellphones is estimated to come
from XX
• Feature phones will continue to
decline with mid to low end
smartphones takingover their market
(i.e.emerging countries)
• High end smartphones will transition
to SLP to displace HDI PCBs
• XXX units only XX% of total
cellphone PCBs in 2017
• By 2023,XX% of all cellphones are
estimated to have SLPs

DECISION OF APPLE CHANGES THE INDUSTRY
Technology transition and investments by players

TOP 100 PCB AND SUBSTRATE MANUFACTURERS
Top 20 and selected PCB/Substrate manufacturers
• From the TOP 100 manufacturers, the TOP 20 and some other
manufacturers (28 in total) are selected for more detailed financial
analysis.
• These companies are selected because they have important role in the
market and/or they have been identified to have the capability of
mSAP and to manufactureSLP.
• Large manufacturers from Taiwan (10), Japan (7), Korea (5), USA (1),
and Europe (1) hold both PCB and substrate capabilities while only 4
out of 37 companies from China were identified to be able to
manufactureboth PCB and substrate (including one from Hong Kong).
• Among the selected companies, some are PCB manufacturers who
joined the substrate market (i.e. ZD Tech), and some substrate makers
joined the PCB market (i.e.Kinsus).

FINANCIAL ANALYSIS

Apple Models iPhone 5S iPhone6 iPhone 6S iPhone 7 iPhone 8 iPhone X
FlagshipModel
PCBAnalysed
(System Plus
Consulting)
Main Board – Front
Side)
NotAnalysed
(considered pretty
close as iPhone6)
NotAnalysed
(considered pretty
closed as iPhone6)
Phone Surface
(mm²)
7254.68 9252.7 9279.93 9279.93 9314.32 10181.24
Phone thickness
(mm)
7.6 6.9 7.1 7.1 7.3 7.7
PCB Surface (mm²) XX XX XX XX XX XX
Ratio (PCB
area/.Phone area)
XX XX XX XX XX XX
Technology Substractive Substractive Substractive Substractive
Substractive
+ mSAP
Sandwich PCB
Substractive+ mSAP
APPLE FLAGSHIP SMARTPHONES – PCB ANALYSIS

EMBEDDED PACKAGINGTECHNOLOGIES
Embedded packaging technologies with connections
fanned out of the IC surface
Embedding in organic laminate
Embedding in epoxy mold compound
(Fan-OutWLP/PLP)
CHIP FIRST: CF
CHIP LAST:CL
FACE UP: FU
FACE DOWN:FD
Process type
Lamination around
the chip
Cavity dig in
substrate
Interconnections type RDL
Foundry
BEOL
Coreless
Substrate
Chip orientation
Encapsulator type
CF / CLCF / CL CL
FU / FD FU / FD
Chip placing
Scope of the Embedded die report

Embedding
die packaging
platforms
Embedded die in
laminate (substrate)
A die packaged between
layers of laminate which is
attached to a final PCB
Embedded die in
PCB
layers of laminate forming
the final PCB
Embedded die in
flexible substrate
layers of FLEXIBLE laminate
forming the final PCB
Embedded
interconnections in
substrate
A silicon bridge is embedded
acting as die-to-die
interconnect
EMBEDDED DIE TECHNOLOGIES SEGMENTATION
Definitions
EMIB technology from INTEL
WABE technology from Fujikura
Courtesy of AT&S
ACTIVE &
PASSIVE DICE
PASSIVE
INTERCONNECT

EMBEDDED DIE PACKAGING COST CONSIDERATIONS
• The reverseengineeringcompany System
Plus Consulting simulated cost
manufacturingand selling prices for
several different commercial products.
• ECP package estimated at different costs
for both low-end product and middle
performance devices.Price is dependent
on product complexity and size.
• Learning experience and know-howhave
enabled decreasein cost and possibility
packagingof higher value components.
• The Snapdragon fromQualcomm
released this year was the component
having the highest number of I/Os using
embedded die technology (MCeP from
Shinko).Shinko is currently developingan
alternativepackage solution named
iTHOP for high-end applications.
Year
Packaging cost
(Assembly, Test & Yield loss)
2011 2016
Mid-end component
available in
premium mobile
market
Microprocessor for
smartphone
Middle
performance
component for
mobile and
power electronics
for automotive
Power switch
transistor
PMU
Low-end
component
for mobile
market
DC-DC converter
2017 2019
High-end
componentfor
ICT,networking,
and computing
applications
FPGA, CPU, GPU, HBM
EMIB Technology i-THOP Technology
LowI/O
MidI/O
HighI/O

22
Chip Laminate & board
maker OSAT
Components
& IDM
Fabless Final products End users
EMBEDDED DIE PACKAGING SUPPLY CHAIN
Examples of commercial and development partnerships

EMBEDDED DIE TECHNOLOGIES & PLAYERS

EMBEDDED DIE TECHNOLOGIES FEATURES

ADVANCED PACKAGING AND MANUFACTURING RELATED REPORTS
Status of Panel Level
Packaging 2018
Q2 2018
Status ofAdvanced
Packaging 2018
Q2 2018
Trends of Automotive
Packaging
Q2 2018
June 2017
December 2017
February 2018
October 2017
November 2016February 2017

EMBEDDED DIE PACKAGING RELATEDTEARDOWN REPORTS
May 2017
January 2015
February 2018
December 2016
January 2013June 2016
June 2013
March 2012
October 2015

The semiconductor industry’s trends are affecting
the semiconductor package and package-to-
board interconnect level. Performance-driven
applications like PCs and smartphones are giving
way to functional applications that are plotting the
semiconductor industry’s future course: IoT, the
automotive market, 5G connectivity, AR & VR,
and AI. Handling large amounts of data generated
by new applications will also be crucial, meaning
that improved data processing performance
and semiconductor scaling will continue as
semiconductor industry drivers.
Advanced semiconductor packaging is seen as a way
to increase the value of a semiconductor product
by adding functionality, maintaining/increasing
performance, and lowering cost – and to this end,
PCB is not just an interconnection but also an
integration solution.
On the scaling roadmap, three competition zones
are active below the 30/30um line width/space:
• Board vs. package substrate (between L/S 30/30
um and L/S 20/20um)
- Leading to substrate-Like PCBs (SLP)
• Package substrate vs. no substrate (fan-out)
(around L/S 10/10um and sub-L/S 10/10 um)
- Flip-chip substrates, embedded die in PLP
substrate, competing with fan-out WLP/PLP
• TSV packaging vs. TSV-less packaging alternatives
(between L/S 5/5 um and L/S 1/1 um, possibly
lower)
- 2.5D (i.e. Si interposer) configurations vs. high-
density fan-out
The functional roadmap for advanced substrates
is linked to devices that do not primarily require
interconnect scaling but must satisfy particular
demands such as high frequency, high reliability,
higher power, etc. Such advanced packaging types
include RF SiPs for 5G mmWave and embedded
die-in-substrate for higher reliability/power
applications. This report focuses particularly on
SLP and embedded die-in-substrate, with insights
on the overall PCB and IC substrate (FCCSP /
FCBGA) business.
STATUS OF ADVANCED SUBSTRATES 2018: EMBEDDED
DIES INTERCONNECTS, SUBSTRATE LIKE PCB TRENDS
Market Technology report - March 2018
ADVANCED SUBSTRATES MUST ANSWER DEMANDS ON BOTH
THE SCALING AND FUNCTIONAL ROADMAPS
Apple’s usage of substrate-like PCBs in the latest iPhone 8 and X will revolutionize the substrate
and PCB markets.
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• Advanced substrates segmentation
• Terminology definition
• Segmentation by types of
substrates
• Segmentation by players and
respective business models
• Analysis of the impact of iPhone
• Financial analysis of revenues
made by top 100 PCB/substrate
manufacturers
• Focus on top 20 and selected
players
• Analysis by geographical zone
• Substrate-based package analysis
including embedded die
• Updated market forecasts 2016-
2023
• Embedded die IP dynamics and
players ranking
• Embedded die technology review
by player
• Supply chain analysis and shifting
business models
• Outlook on new market drivers
and emerging applications for
embedded die
WHAT’S NEW
• Overview report on advanced
substrates that builds on 2 previous
reports, “Advanced
Substrates Overview 2017:
From IC Package to Board” and
“Embedded Die Packaging:
Technology and Market Trends
2017”
• Financial analysis of PCB/substrate
manufacturers
• Substrate-like PCB business
• Market forecasts for IC substrates,
SLP and embedded die/
interconnects including MCeP and
EMIB
• Embedded die IP landscape 100/10010/101/10.1/0.1
L/S [um/um]
5/5
Subtractive
30/30
Layerthickness(Cu+dielectric),[um]
0.1
1
10
100
Board
Embedded Die
in Substrate
Substrate-Like PCBs (SLP)
Transition of boards from
subtractive to mSAP
process process, turning
boards into large substrates
ICsubstrates
Scaling roadmap
(FC vs. FO vs. 2.5D)
Functional roadmap
(SiP, RF, Power)
SLP part
of scaling roadmap
Board vs. IC
substrate
(Yole Développement, March 2018)
SUBSTRATE-LIKE PCBS: A CLASH OF TWO WORLDS
The transition from the subtractive to the mSAP
process and from PCB to substrate-like PCB is
under way in high-end smartphones, driven by
Apple and its iPhone 8/iPhone X. Other high-
end smartphone suppliers such as Samsung and
Huawei are expected to join in the near future.
SLP is a term that attempts to describe the
transition of a board into a product with package-
substrate-like features. Standard HDI and non-
HDI boards use variations of the subtractive
manufacturing process, while package substrates
(i.e. FC/WB CSP/BGA) use mSAP or SAP. SLP is
Scaling/functional roadmap for advanced substrates in 2018
This report includes global trends
in patent application identified by
KnowMade but does not include an
in-depth analysis of any patents.

3
0 1 1 1 3 7 5 5 8 11 8 9 13 6 16 24
60
81 77
125
159
225
280
263 258
186
212
196
172
233
185
148
107
17
0
100
200
300
400
500
600
700
800
1985 1986 1987 1988 1989 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018
Numberofpublications
1rst publication year
Patents
Patent families
(1) A patent family is a set of patents filed in multiple countries by a common inventor(s) to protect a single invention.
(2)There is typically a 12-18 months delay between the moment a inventor files for a patent and the moment it is published and becomes visible to the public.
Shift vs time evolution
of patent filing(2)
Innovation
triggers
Activity
takes off
Extension of
priority patents
Based on the
current trend,
we expect more
than 100 patent
families for 2018.
Note:The data
corresponding to
the year 2018 is not
complete since
patent search was
done in February
2018.
Significant
slowing down
Activity
decreases
Significant
Acceleration
Extension of
priority patents
7,190 patents (3,100 patent families1), including 3,488 granted patents and 1,124 pending patent applications
STATUS OF ADVANCED SUBSTRATES 2018: EMBEDDED DIES INTERCONNECTS, SUBSTRATE LIKE PCB TRENDS
FINANCIAL ANALYSIS: THEWAR BETWEEN PLAYERS
With SLP’s appearance in Apple’s latest iPhones, PCB
and substrate manufacturers have started producing
SLP and investing in mSAP. The 28 selected PCB/
substrate manufacturers are all believed to have mSAP
technology, and some of them can manufacture SLP.
Driven by high-end smartphone demand, certain players
appears to have high capital expenditures. Meanwhile,
some large players show steady revenue in their PCB/
substrate business. This report furnishes detailed
information concerning these players’ financial activities
in PCB/substrate manufacturing and other areas.
In order to differentiate their activities during the fierce
competition happening within the PCB/substrate world,
some players are trying to build PCB/substrates with
more value inside.
in fact a large substrate, manufactured in mSAP, in
the size and function of a board. The benefits of an
SLP compared to a standard or HDI board include
higher line resolution, better electrical performance,
and the potential for space and energy-saving, which
are very important in a cramped, energy-limited
smartphone environment.
SLP’s entry opens a new market and disrupts the
supply chain. The SLP market is estimated at $1.9B
in 2016 and $2.24B by 2023, with a 64% CAGR 2017
- 2023. SLP manufacturing will not just recover the
substrate market, but also give it a significant boost.
However, from a technology-readiness point of view,
although the mSAP process is mature for processing
package substrate, considerable challenges still exist
for manufacturing substrates in PCB-size.
This report presents comprehensive details regarding
the SLP market, covering the supply chain and
offering a technology comparison of the subtractive/
mSAP/SAP processes. Also included are comparative
teardowns of the iPhone 8, iPhone X, and Samsung
S8.
Embedded die packaging - Time evolution of patent publications
PCB revenues in cellphones
(Yole Développement, March 2018)
2016 2017 2018 2019 2020 2021 2022 2023
Substrate-like PCB Smartphone PCB revenue Feature/Voice PCB revenue
0
2
4
6
8
10
12
14
Revenue($B)
Total SLP CAGR2017-2023
: 64%
(KnowMade, March 2018)
One prevalent trend amongst substrate makers is not to
sellthesubstrateasaninterconnectionbutasanintegration
solution, which may consist of embedding a die and an
interconnection-like EMIB technology, or simply building a
package around the substrate, like MCeP technology.
The adoption of these packaging platforms has been
confirmed within the last few years, and products are
already commercialized. The embedded die package
has sweet spots in different applications, and the
rationale to adopt it vary from miniaturization and/
or thermal management for power applications, to
anti-tampering for defense applications. This package
is adopted when no other lower-cost packages offer
viable solutions.
ThelargenumberofRDprojectsinpowerapplications,
especially those related to automotive and defense,
illustrates the growing interest in using PCB/substrates
as more than an interconnect.
EMBEDDED DIE AND INTERCONNECTS: A NEW OPPORTUNITY FOR SUBSTRATE
MAKERS AND OSATS?

Find more
details about
this report here:
MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
AMD, Amkor, Amphenol, AMS, Aoshikang, Apple, AOI, ATS, ASE, Avago, Benchmark, Boardtek,
Bosch, Career, Celestica, Chin Poon, ChipBond, ChipMOS, CMK, Compeq, Continental, Cosmotech,
Cyntec, Daeduck, Daimler, Deca Technologies, Dyconex AG, Dynamic, Eastern, Elmos Semiconductor,
Ericsson, Epoche and Esp, Flex, Flexium, Foxconn, Fujikura, Fujitsu, GaN Systems, General Electric,
Gold Circuit, HannStar Board, Hella, HiSilicon, Hitachi Chemical, HighTec EDV Systeme, Hofmann
Leiterplatten, Huatian, Huawei, Ibiden, Ichia, Inari Berhad, Infineon, Intel, Isu Petasys, Jabil, JCET,
J-devices, Juniper Networks, KCE Electronics, Kingboard, Kinsus, Kinwong, KYEC, Kyocera, Kyoden,
Lenovo, LG Innotek, Maxim, Meiko, Mflex, MGC, Microsemi, Nanium, Nantong Fujitsu, Nan Ya PCB,
Nepes, Nippon Mektron, Nitto Denko, NTK, NXP, OKI, Olympic, ON Semiconductor, Oracle,
Panasonic, Plessey, Plexus, Powertech Technology, Porsche, Qualcomm, Renesas, Samsung, Sanmina,
Sarda Technologies, Schweizer, Shennan Circuit, Rohm Semiconductor, Shinko, SK Hynix, Somacis,
Soundchip SA, SPIL, STATS ChipPAC, St Jude Medical, Starkey, ST Microelectronics, Sumitomo Denko,
Taiyo Yuden, TCL, TDK-EPCOS, Texas Instruments, Thalès, TTM Technologies, Toppan, Qorvo,
Qualcomm, TSMC, Unimicron, Unisem, Unitech, UTAC, Valeo, Wus Group, Würth Elektronik,
Wuzhou, Xilinx, Yamamoto Manufacturing, Young Poong Group, ZD Tech… and many more
AUTHORS
Emilie Jolivet is a Technology
Market Analyst in the
Advanced Packaging Semicon.
Manufacturing team at Yole
Développement (Yole). After an
internship at Freescale, she took
the position of RD engineer in
photovoltaic business and co-
authored several scientific articles.
Prior Yole, Emilie joined EV
Group as a business development
manager. Emilie holds a Master’s
degree in Applied Physics
specializing in Microelectronics
from INSA Toulouse (France) and
an MBA from IAE Lyon (France).

Introduction 6
Executive summary 12
Advanced substrate segmentation 37
PCB/Substrate/RDL segmentation
Report scope
PCB/substrate market drivers and dynamics 47
Advanced packaging drivers
Board and advanced substrate drivers
Competing platforms (board vs. IC substrate,
IC substrate vs. WLP)
Disruptions and opportunities
IC substrates market forecasts
Substrate-Like PCB product 68
Drivers and market dynamics
SLP market forecasts and supply chain
PCB technology analysis
- Process flow comparison
- Physical teardown analysis
- Roadmap
Financials analysis 105
Top 100 PCB/substrate manufacturers rankings
Top 20 selected manufacturers
- Business model
- PCB/substrate revenue analysis
- PCB/substrate revenue market forecast
Company financial analysis – selected players
Embedded die in laminate package 136
Introduction
- Technology segmentation
- Cost consideration
Drivers applications
- Rationale for embedded die adoption
- Applications by market
Market forecasts
- Embedded die forecasts in units and revenues
breakdown by market including MCeP
- Embedded bridge/interconnections forecasts in units
Embedded die package players
- Embedded die business models analysis
- Supply chain
- IP landscape incl. dynamics and players
Technology and roadmaps
- Main technology review by player
Conclusions 224
Report methodology 228
Yole Développement presentation 230
TABLE OF CONTENTS (complete content on i-Micronews.com)
Vivienne Hsu is a Technology
Market Analyst at Yole
Développement (Yole). As part
of the Advanced Packaging
Semicon. Manufacturing team,
Vivienne contributes to the
development of these activities.
She is engaged in the production
of market research reports and
customized services. Graduated
from Phelma, Grenoble INP
(France), she completed her
Master’s degree in Materials
Science by carrying out a thesis
at EDF.
Dr. Nicolas Baron is CEO and co-
founder of KnowMade. He is leading the
Microelectonics and Nanotechnology
scientific and patent analysis
department. He holds a PhD in Physics
from the University of Nice Sophia-
Antipolis, plus a University Diploma
in Intellectual Property Strategy and
Innovation from the European Institute
for Enterprise and Intellectual Property
(IEEPI Strasbourg), France.
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Andrej Ivankovic was a member
of the Advanced Packaging
Semicon. Manufacturing team
at Yole Développement (Yole).
Previously, Andrej served at IMEC
with a position focused on 3D IC
technology. He also worked in
parallel at GLOBALFOUNDRIES.
His first position takes place at
ON Semiconductor to develop
reliability tests, failure analysis, and
characterization of power electronics
and packages. Andrej holds a master’s
degree in Electrical Engineering from
the University of Zagreb (Croatia),
and a PhD in Mechanical Engineering
from KU Leuven (Belgium).
KnowMade’s team realized the patent
analysis:
In this report, you will find a deep analysis of
the applications where embedded die package
is employed, the latest products featuring EMIB
technology (Intel), MCeP technology (Shinko), and
embedded die package, and market forecasts for
these respective platforms from 2017 - 2023. In
addition, a deep patents analysis of the IP landscape
including time evolution of patents publications and
leading patents applicants is including in the report.

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Status of Advanced Substrates 2018:
Embedded Dies Interconnects, Substrate Like PCB Trends
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate
finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon
and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors,
Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics Medical, Advanced Packaging, Manufacturing,
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2©2018 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE COVERED BY OUR 40+ ANALYSTS
MEMS Sensors
Solid State Lighting
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Energy Management
Power Electronics
Displays
RF
Devices
Techno.
Advanced
Substrates
Software
Memory

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marketing analysis
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MA with our partner)
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6 COMPANIES TO SERVEYOUR BUSINESS
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Cost simulation tools
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Market, technology and strategy
consulting
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IP analysis
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o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
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Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/3)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 - Update
− Silicon Photonics 2018 - Update
− Consumer Biometrics: Sensors Software 2018 - Update
− MEMS Pressure Sensors 2018
− Air Quality Sensors 2018
− Sensors for AR/VR 2018
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− Gas Particles Sensors
− MEMS Pressure Sensors
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
RF DEVICES ANDTECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – byYole Développement
− RF Front End Module and Connectivity for Cellphones 2018 – Update
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2018 - Update
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –
Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Radar Technologies for Emerging Applications 2018 *
− Radar Technologies for Automotive 2018
− RF Photonic Technologies for 5G Infrastructure 2018
− RF Front-End Modules in Smartphones
− RF GaN *
− RF Front End Module – Patent Landscape Analysis
− RF GaN – Patent Landscape Analysis
IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2018 – Update
− Status of the Compact Camera Module Industry 2018 - Update
− 3D Imaging and Sensing 2018 - Update
− Machine Vision for Industry and Automation 2018
− Sensors for Robotic Vehicles 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− LiDARs 2018
o QUARTERLY UPDATE – by Yole Développement
− CMOS Image Sensors 2018 *
− CMOS Image Sensors
− Compact Camera Modules
− LiDAR – Patent Landscape Analysis
− Time-of-Flight IR Sensor in the Apple iPhone 7 Plus - Patent-to-Product Mapping
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 - Update
− Processing Hardware and Software for AI: Integration Challenges 2018
Update : 2017 version still available / *To be confirmed

ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 - Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like
PCB Trends
− Fan-Out Packaging 2018 – Update
− 3D TSV and Monolithic Business Update 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 – Update
− MEMS Packaging and Testing 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Status of Panel Level Packaging 2018
− Trends in Automotive for Advanced Packaging 2018
− Processing Hardware and Software for AI: Integration Challenges 2018
− Integrated Passive Devices (IPD) 2018
− RF Front-End SiP
− Fan-Out Packaging *
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
MANUFACTURING
− Wafer Starts for More Than Moore Applications
− Equipment for More than Moore: Technology Market Trends for Lithography
Bonding/Debonding 2018
− Equipment for More than Moore: Technology Market Trends for Thin Film
Deposition Etching 2018
− Wafer Bonding Technology Overview 2018
MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Memory Market 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement
− Memory Pricing 2018 (NAND DRAM)
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
COMPOUND SEMICONDUCTORS
MARKET AND TECHNOLOGY REPORT – byYole Développement
− Status of Compound Semiconductor Industry 2018 *
− Power SiC 2018: Materials, Devices, and Applications - Update
− Power GaN 2018: Materials, Devices, and Applications – Update
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –
Update
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Power SiC Devices
− Power GaN Devices
− Power SiC – Patent Landscape Analysis
− Status of the GaN IP – Patent Landscape Analysis

POWER ELECTRONICS
MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 - Update
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 - Update
− EV/HEV Market Expectations and Technology Trends - Update
− Wireless Charging Market Expectations and Technology Trends 2018
− Integrated Passive Devices (IPD) 2018
− Power ICs Market 2018 – Update
− Power ICs Market 2018 *
− Power Modules *
BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry Update with Focus on Manufacturing 2018 *
− Battery Pack Technology and Business Opportunities 2018 - Update
− Solid-State Batteries – Patent Landscape Analysis
SOLID STATE LIGHTING
− IR LEDs and Lasers 2018 - Update
− Automotive Lighting 2018 – Update
− UV LEDs 2018 - Update
− VCSELs 2018
− Lasers 2018
− Light Shaping Technologies 2018
− LiFi 2018
− VCSELs 2018
− UV LEDs 2018 *
DISPLAYS
− MicroLED Displays 2018 – Update
− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update
− Organic Thin Film Transistor 2018: Flexible Displays and Other Applications -
Update *
− Displays for AR / VR / MR 2018
− Non Display Applications of MicroLEDs 2018 *
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− Status of the BioMEMS Industry 2018 - Update
− Point-of-Need Testing: Application of Microfluidic Technologies - Update
− Neurotechnologies and Brain Computer Interface
− CRISPR Technology: From Lab to Industries 2018
− Portable Medical Imaging 2018
− Inkjet Functional and Additive Manufacturing for Electronics
− Liquid Biopsy 2018: From Isolation to Downstream Applications
− Chinese Microfluidics Industry 2018
− Microfluidic IC Cooling – Patent Landscape Analysis
− Circulating Tumor Cell Isolation – Patent Landscape Analysis
− Organ-on-a-Chip – Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS (1/3)
MEMS SENSORS
− Status of the MEMS Industry 2017
− High End Inertial Systems Market and Technology 2017
− Magnetic Sensors Market and Technologies 2017
− MEMS and Sensors for Automotive - Market and Technology Trends 2017
− Acoustic MEMS and Audio Solutions 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –
Reverse Costing Report
− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report
− MEMS Packaging 2017 - Reverse Costing Review
− Bosch BMP380 Pressure Sensor – Reverse Costing Report
IMAGING PHOTONICS
− Status of the CMOS Image Sensor Industry 2017
− 3D Imaging and Sensing 2017
− Uncooled Infrared Imaging Technology Market Trends 2017
− Camera Module Industry Market and Technology Trends 2017
− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse
Costing Report
− Camera Module Physical Analyses Overview 2017
RF DEVICES ANDTECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF System-in-Package for Cell Phones 2017
− 5G Impact on RF Front-End Industry 2017
ADVANCED PACKAGING
− Status of the Advanced Packaging Industry 2017
− Embedded Die Packaging: Technology and Market Trends 2017
− Fan-Out: Technologies and Market trends 2017
− Advanced Substrates Overview: From IC Package to Board 2017
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced RF System-in-Package for Cellphones 2017
− Memory Packaging Market and Technology Report 2017
− MEMS Packaging 2017
− Emerging Non-Volatile Memory 2017
− NVIDIA Tesla P100 - Reverse Costing Report
− MEMS Packaging - Reverse Technology Review
− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review
SOFTWARE
− Embedded Software in Vision Systems
MEDTECH
− Status of the Microfluidics Industry 2017
− Solid-State Medical Imaging 2017
− Organs-On-Chips 2017
− Connected Medical Devices Market and Business Models 2017
− Artificial Organ Technology and Market analysis 2017
− Medical Robotics Technology Market Analysis 2017

OUR 2017 PUBLISHED REPORTS (2/3)
MANUFACTURING
− Laser Technologies for Semiconductor Manufacturing 2017
− Equipment and Materials for 3D TSV Applications 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
BATTERIES ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry
− Market Opportunities for Thermal Management Components in Smartphones
DISPLAYS
− MicroLED Displays
− Quantum Dots and Wide Color Gamut Display Technologies
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
SOLID STATE LIGHTING
− LED Packaging 2017: Market, Technology and Industry Landscape
− CSP LED Lighting Modules
− IR LEDS and VCSELs - Technology, Applications and Industry Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− Automotive Lighting: Technology, Industry and Market Trends 2017
− Horticultural LED Lighting: Market, Industry, and Technology Trends
POWER ELECTRONICS
− Status of the Power Electronics Industry 2017
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Gate Driver Market and Technology Trends 2017
− Power MOSFET 2017: Market and Technology Trends
− Power Module Packaging: Material Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Management ICs Market 2017
− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report
− Silicon Capacitor - Technology and Cost Review
− Industrial 100V MOSFET - Technology and Cost Review
− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor
Combo – Reverse Costing Report
COMPOUND SEMICONDUCTORS
− Bulk GaN Substrate Market 2017
− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS
− Power SiC 2017: Materials, Devices, Modules, and Applications
− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− MicrofluidicTechnologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
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