LED Packaging 2016: Market, Technology and Industry Landscape - 2016 Report by Yole Developpement

From Technologies to Market
LED PACKAGING
-
Market,Technology
and Industry
Landscape
2017 Sample
Market and Technology Report
Source: Nasa

2
REPORT OBJECTIVES
This report serves to detail:
• LED industry and market status
• Process flows and technologies in LED packaging
• Recent LED packaging trends
• The importance of cost reduction in LED packaging
• Who is doing what
This report also provides market
• metrics at the LED material level
©2016 | www.yole.fr | LED Packaging 2017: Market, Technology and Industry Landscape | Sample

3
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology

4
REPORT METHODOLOGY
Technology analysis methodology Information collection

5
o About the Author of the Report P8
o Glossary P9
o Executive Summary P10
o Status of the LED Industry (1/2) P35
 LED Epitaxy Capacity Trends
• GaN MOCVD Capacity Evolution per Region (2010-2016)
• Top 10 Global LED Chip Manufacturers by Capacity
• Focus on China
• Top-20 LED Chipmakers In China
• Analysis
• GaN MOCVD Capacity Supply vs. Demand Trends
• Capacity and Wafer Start Geographic Breakdown
 Packaged LED Market and Industry Trends
• Segmentation of Packaged LEDs
• History of LED Industry
• Market landscape
• Industrial Landscape
• Key Highlights
• Packaged LED Revenue Forecast - Split by Application
• Packaged LED Volume Forecast
• Split by Application
• Split by Package Type
• Split by Chip Type
• 2015 in a nutshell
• 2016 in a nutshell
• LED Market Trends
• Displays
• General Lighting
• Video Projector for Outdoor Display
• LED Packaging Companies Overview
o Status of the LED Industry (2/2) P35
 Leading LED Packaging Companies / Regions
• Top-10 Players Revenue Analysis (2012 - 2015)
• 2015 Top-30 Players
• Market Shares Evolution per Region
• Trends
 Zoom on Chinese Packaged LED Market and Industry
• Chinese Packaged LED Market and Industry Overview
• Top-30 LED Packaging Companies
• Overview
• Geographical Distribution
• 2015 Revenue
• Capacity (as of Q3-2016)
• Global Trends
 Recent Trends in the Packaged LED Industry
• Overview
• Application Diversification - Automotive Lighting
• Vertical Integration - Module Level
• Vertical Integration - System Level
• Product Diversification - UV LEDs
• Product Diversification - IR LEDs
o LED Package Development (1/2) P78
 Introduction
 GaN-on-Si LEDs and GaN-on-GaN LEDs
• GaN-on-Si LEDs
• GaN-on-GaN LEDs
• Trends
 Chip on Board (COB) LEDs
• Introduction
• Positioning - Package or Module?
• Drivers for Integration
TABLE OF CONTENT (1/6)

6
o LED Package Development (2/2) P78
 Chip on Board (COB) LEDs
• Technology Trends
• High Density COB
• Spectrum Enhanced COB
• COB Evolution
• Industry
• Overview of Suppliers
• Main Areas of Development
• Manufacturing Process
• Market Segmentation and Uses
• COB LED Volume Forecast (2012 - 2021)
 LED Filaments
• Overview
• Substrate Materials
• Performance and Cost
• Industry Trends
 Flip Chip LEDs
• Introduction
• Benefits
• Key Players
• Applications
• TV
• Flash
• Automotive and General Lighting
• Flip Chip LED Volume Forecast (2012 - 2021)
 Chip Scale Package (CSP) LEDs (1/2)
• Introduction
• Benefits
• CSP vs. Conventional Package
• Differences in CSP Architectures / Packages
 Chip Scale Package (CSP) LEDs (2/2)
• CSP Cost Structure
• Low and Middle Power LEDs
• High Power LEDs
• Challenges
• Overview
• CSP Assembly onto Module / PCB
• Industry
• Key Players
• Highlights on US and European Manufacturers
• Highlights on Japanese Manufacturers
• Highlights on Korean Manufacturers
• Highlights on Taiwanese Manufacturers
• Highlights on Chinese Manufacturers
• Applications
• Flash
• Backlighting
• General Lighting
• Market Opportunities and Challenges
• CSP LED Volume Forecast (2012 - 2021)
o Overview of LED Packaging P144
 The Functions of LED Packaging
 Key Components of a Packaged LED
 LED Packaging Typical Process Flow
 Trends in GaN LED Chip Designs
 Low and Middle Power LED Packaging
 High Power LED Packaging
 LED Package Power vs. Application
 Cost Structure of Packaged LED
 Supply Chain (Equipment and Material)

7
o Wafer Bonding P158
 Position in the Process Flow
 Synthesis
 Introduction
 Process Selection
 Technologies (Status, Trends and Alternatives)
 Carrier Substrate
 Equipment Suppliers
 Miscellaneous - IP Aspects
o Substrate Removal P168
 Synthesis
 Introduction
 Technologies
 Laser Lift Off
• Overview
• Equipment Suppliers
• IP Aspects
• Yield Aspects
 Chemical Lift Off
 Other Techniques
 The Case of GaAs-Based LEDs
o Die Singulation P180
 Synthesis
 Introduction
 Overview of Die Singulation Techniques
 Diamond Scribing
 UV Laser Scribing
 Scribing & Breaking - Comparison of Scribing Techniques
 Blade Dicing
• Overview
• Advantages & Drawbacks
 Laser Dicing / Ablation
• Overview
• Advantages & Drawbacks
• Focus on Serial Multibeam Laser Dicing
 Stealth Dicing
• Overview
• Comparison with Traditional Dicing Techniques
 Plasma Dicing
• Introduction
• Technologies of Panasonic and Plasma-Term
 Global Benchmark of Dicing Technologies
 Comparison of Die Singulation Technologies for LED
 Cost Aspects
 Dicing (and Backgrinding) Tape
 Equipment Suppliers
 Market Share by Technology
o Packaging Substrates (1/2) P205
 Synthesis
 Introduction
 Low and Middle Power Packaged LEDs
• Overview
• New Materials (PCT, EMC, SMC and Ceramic)
 High Power Packaged LEDs
• Thermal Management of High Power LEDs
• Leadframe Substrates
• Ceramic Substrates
• Choosing the Substrate Type

8
o Packaging Substrates (2/2) P205
 Chip On Board
• Substrate Comparison - MCPCB vs. Ceramic PCB
• COB vs. Package Substrate
 Packaging Substrate Market
• Substrates vs. Circuit Board Material Options
• Choosing the Right Substrate
• High Power LED Substrate - Market Share by Substrate Type
• High Power LED Substrate Volume and Revenue Forecast (2012 -2021)
o ESD Protection P245
 Synthesis
 ESD / EOS Issues of High Power LEDs
 Where are ESD / TVS Diodes Used?
 Typical Symptom of ESD / EOS Damage
 Zener / Avalanche Diodes
• Overview
• Illustration
• Trends
 Zener / Avalanche Diodes Suppliers
 Zener / Avalanche Diodes Volume and Revenue Forecast (2012 - 2021)
o Die Attach (1/2) P257
 Synthesis
 Introduction
 Overview of Materials and Techniques
 Resin / Adhesives
• Epoxy, Acrylic and Silicone
• Silver-Filled Epoxy
• Gold-Filled Epoxy
o Die Attach (1/2) P257
 HMP Eutectic Soldering
• Au/Sn Solder Paste
• Metallization Techniques
• Flux Eutectic vs. Direct Eutectic
 Silver Sintering
 Potential Failure Associated to Die Attach
 Comparison of Die Attach Techniques
• Gluing vs. Soldering
• Matching with Packaging Substrate
 Die Attach Material vs. LED Package Power (and Applications)
 Die Attach Technique vs. LED Package Type
 Die Attach Material Volume and Revenue Forecast (2012 - 2021)
o Interconnections P286
 Position in the Process
 Synthesis
 Overview
 Wire Bonding
• Overview
• Comparison of Techniques
• Challenges
• Typical Failure
• Alternative - Ribbon Bonding
 Flip Chip
• Overview
• Layout Principles and Technologies
• Main Techniques
• Underfill
• Trends

9
o Encapsulation / Primary Optics P316
 Synthesis
 Introduction
 Materials
• Overview
• Epoxy vs. Silicone
• Silicone (Overview and Comparison of Silicone Types)
 Process
• Overview of Main Techniques
• Dispensing
• Molding
• Transfer vs. Compression Process
• Processability
• Comparison (Dispensing vs. Molding)
 Interactions Encapsulant / Phosphors
• Overview
• Focus on Phosphor Sedimentation
• Focus on Chemical Compatibility
 Failure Mechanisms
 Material Suppliers (Overview, Analysis, Emerging Players & Recent Exits)
 The Case of Packaged LED Lens
• Material
 Trends
• Epoxy vs. Silicone
• Other Developments
 Price Trends
 Encapsulant Volume and Revenue Forecast (2012 - 2021)
 Packaged LED Lens Material Volume and Revenue Forecast (2012 -2021)
o Phosphors (1/2) P350
 Synthesis
 The Different Ways to Generate White Light!
 Key Requirements for LED Downconverters
 LED Downconverters for Display Applications
 LED Downconverters for Lighting Applications
 Major White LED Designs
• Downconverter Combinations
• Trends
 Configurations and Deposition Methods
 On-Chip Configuration
• Overview
• Comparison
• The Case of CSP
 Remote Phosphor
 Material / Compositions
• Yellow Phosphors
• Green and Red Phosphors
• Focus on Garnets
• Focus on Silicates
• Focus on Nitrides and Oxynitrides
• Focus on Mn4+ Red Phosphors (PFS / KFS)
• Focus on “UV Chip + RGB Phosphor” Solutions
• Trends
• Timeline
• Application Matrix
 Competitive Landscape
• Overview
• Focus on China

10
o Phosphors (2/2) P350
 Price Trends
• Introduction
• Focus on YAG and Nitrides
 Quantum Dots
• Benefits & Challenges
• Display Applications
• Lighting Applications
 Phosphor Volume Forecast (2012-2021) - Remote vs. On-Chip
 Phosphor Revenue Forecast (2012-2021) - Split by Material
o Wafer Level Packaging P394
 Synthesis
 Overview
 Manufacturing Status of WLP
 True WLP
 Technology Challenges
 Trends
o Conclusion P402
o Appendix P406

11
Biography & contact
ABOUT THE AUTHORS
Pars Mukish
Pars Mukish holds a master’s degree in Materials Science & Polymers (ITECH - France) and a master’s degree in Innovation &
Technology Management (EM Lyon - France). Since 2015, he has overseen developing LED, OLED, and sapphire activities as a
Business Unit Manager at Yole Développement. Previously, Pars worked for several years as a Marketing Analyst and Techno-
Economic Analyst at the CEA (French Research Center).

12
Sample of the report

13
Total MOCVD
capacity
increased
almost by a
factor x5 since
2010 driven
mostly by China
(x25).
GaN MOCVD Capacity Evolution per Region (2010-2016)
LED EPITAXY CAPACITY TRENDS

14
LED packaging companies have emerged in time in what could be simplistically summarized as 4 waves:
• 1st wave: The technology pioneers which developed GaN chips and white LED technologies through the 1990’s are usually referred to in the
industry as the big 5.
• 2nd wave: A large group of LED companies later appeared in Taiwan composed of start ups leveraging technologies developed by the Industrial
Technology Research Institute (ITRI) as well as existing optoelectronic components manufacturers leveraging on their existing competences and
infrastructure to enter the high brightness LED business.
• 3rd wave: After year of R&D and strong IP activities, both LG and Samsung invested massively in LED chip and packaging capacity in order to
partially supply internal needs for LCDTV backlight and positioning themselves for future growth in the lighting business.
• 4th wave: The strong focus on energy and technology in the China’s 12th 5-year plan made vast amount of subsidies available in order to develop a
strong LED supply chain from chips to systems.This resulted in the emergence of 100’s of new LED packaging and luminaire companies.
History of the LED industry - Industrial landscape
STATUS OF THE LED INDUSTRY
1st wave:
“The big 5”
• Nichia (JP)
• Toyoda Gosei (JP)
• Osram (EU)
• Philips Lumileds (US)
• Cree (US)
2nd wave:
Taiwan and Korea “start ups” and new entrants
• Everlight (TW)
• Oasis (TW)
• Unity Opto (TW)
• Edison Opto (TW)
• Lite On (TW)
• Harvatek (TW)
• Kingbright (TW)
• BrightLED (TW)
• Seoul Semiconductors (KR) (…)
3rd wave:
The Korean Chaebols
(Conglomerates)
• LG (KR)
• Samsung (KR)
4th wave:
China’s12th 5-Year Plan
• Honglitronics (CN)
• Nationstar (CN)
• Refond (CN)
• MLS (CN)
• Jufei (CN)
• Mason (CN) (…)
1995 - 2000 2000-2006 2007-2008 2011-2015

15
Smart lighting
will provide a
further boost to
lighting
applications.
We expect
“planned
obsolescence” to
become part of
the luminaire
maker strategy in
consumer
application.
LED MarketTrends - General Lighting
STATUS OF THE LED INDUSTRY
• General lighting will drive LED demand.
• Strong penetration in outdoor and architectural lighting.
• Accelerating penetration in residential lighting.
• Better prospects than initially expected for LED as replacement of fluorescent tubes.
• Better prospects than expected in industrial lighting.
• Socket saturation won’t occur as fast as initially anticipated!
• Models usually assumed that because of the long lifetime of LEDs, the market will saturate once the majority of the light sockets have
been converted… BUT:
• Actual lifetime is not as long as initially anticipated: 20,000-25,000 hours (or less) rather than 50,000 to 100,000 hours (initially quoted by
the industry).
• Smart lighting will trigger obsolescence in some markets.
• The availability of efficient, cheap and versatile light sources (LED) will increase the average consumption of artificial light per capita.
Photo credit: Nasa

16
Overall
utilization rate
stands at 74% in
Q3-2016 after
Epistar
decreased its
capacity.
GaN MOCVD Capacity Supply vs. DemandTrends
LED EPITAXY CAPACITY TRENDS
Highlights:
Wafer consumption dropped significantly in Q3- and Q4-2015 but recovered rapidly in the first half of 2016 and reached record high in
early Q3. We expect demand to show some seasonal weakness in Q4 as LED makers adjust their inventory but not at the scale
experienced in 2015.
Capacity increase over the last 12 months reflects mostly process efficiency improvement and new reactor procurement at San’an.
However, not all reactors have been started yet
LED Reactor End Demand vs. Capacity

17
More and more
packaged LED
manufacturers
moving to
module level!
Vertical Integration - Module Level
RECENT TRENDS IN THE PACKAGED LED INDUSTRY
• Packaged LED manufacturers master LED binning strategy which represent a strong competitive advantage for LED lighting module
assembly.
• Process manufacturing variability creates multiple binning of LED parameters: Color control / Flux control /VF control.
• Good binning strategy helps to select the LEDs for:
• Reaching the product specification.
• Guarantying the supportability.
• Minimizing the stocks.
• Control of LED production allows to stabilize value at module level using variable LEDs.
LED
Full Proliferation
Color, flux and voltage
specification
Substrate
(size, material, connectivity version…)
ASSEMBLY LED LINE FOR LED MODULE
Binning
Tables
Pick &
Place
Reflow Control LED Module
Source: LED Module Report - Yole Développement©2016 | www.yole.fr | LED Packaging 2017: Market, Technology and Industry Landscape | Sample

18
Most of the
COB LED
manufacturers
are located in
Asia.
Industry - Overview of Suppliers
COB LED
US:
Cree, Bridgelux, Lumileds (…)
+ 3 other players detailled in
the report
Russia:
XX
South Korea:
Seoul Semi., LG Innotek (…)
+ 6 other players detailled in the report
China:
Honglitronic, APT, CETC Huaying Electronics (…)
+ 17 other players detailled in the report
Germany:
Osram
Japan:
Sharp, Nichia, (…)
+ 4 other players
detailled in the report
Taiwan:
Edison Opto, Lextar,
Everlight (…)
+ 14 other players
detailled in the report
Finland:
XX

19
While a
dedicated
supply chain has
emerged,
sapphire
filaments are
often produced
from rejected
LED wafers.
Manufacturing Process (1/2)
LED FILAMENT
• The filament substrates typical dimension is: 30 (L) * 0.8 (W) * 0.4 to 0.8 (thickness) mm.
• They were initially cut with wire saws from 2” sapphire wafers (in many cases, reject from production for LED substrates).
• As demand increased, a dedicated supply chain emerged: many suppliers now start from a rectangular brick which is then sliced into
individual window blanks before double side polishing. Laser cutting has replaced diamond wire saws.
• The filaments are then assembled onto a lead frame to facilitate subsequent processing for the manufacturing of the COB-type
filament (silver electrode metallization, die attach, interconnect, phosphor coating…).
Sapphire filament substrates
Picture: Zhejiang Terios New Energy
Finished and assembled LED filaments
Picture: Tevaja

20
Compared to
MESA and
vertical
structures, Flip
Chip LED can
offer advantages
toward reliability
and lifetime,
luminous output,
package size and
manufacturing
cost.
Benefits (1/2)
FLIP CHIP LED
• Flip Chip (FC) LED manufacturing process use (in most case) a gold-tin eutectic direct bonding method where the chip is “stuck” on
to the package substrate.
• Such structure of package allow for several features compared to MESA and vertical LEDs which have some unavoidable
disadvantages, such as faulty wire weld, surge strike, insufficient resistance to high current, bond wire breakage caused by the thermal
expansion and contraction of packaging silicone, yield affected by bond wire in manufacturing process (…).
No Wire Bonding
Reduce LEDs damage risk1
Increase light emitting area
Reduce package size
Low Sheet Resistance
/ Low Driving Current
Allow for better thermal dissipation
Low Thermal
Resistance
Allows for high electrical currents
Flip Chip
LED
-
Direct
Bumping
or Eutectic
Bonding
Increase of reliability
and lifetime
Increase of luminosity
(with increased
operating efficiency)
Potential increase of
lm/W and lm/$
Decrease of package
size and allow for new
package structure
1. As gold wire can break during LED manufacturing process, under LED operation with huge temperature differences (…).

21
• Nichia has developed a CSP architecture to enable light output only on top of the LED contrary to other LED manufacturers.
• It allow to place the LEDs close to each other on the PCB because there is no side emission of the light and therefore no mutual absorption of light.
• Gap between LED can be reduced to 0.2mm compared to 1mm for conventional CSP LEDs.
• Following Nichia statement, there is no color shifting contrary to other CSP LEDs.
Differences in CSP Architectures / Packages
CSP LED
Difference between Nichia and conventional CSP architecture
Source: Nichia
• Seoul Semiconductor has developed its own CSP architecture that is simpler than conventional CSP
design since there is no ceramic substrate.
• WICOP (Wafer Level Integrated Chip on PCB) is designed to directly connect the chip to the PCB as there
is no intermediate substrate.
• As the LED chip is directly connected onto the PCB, hence its thermal dissipation channel is especially
short, and has low thermal resistance. As a result, the driving current is double that of the average LED
package.
• Even if there are some differences between CSP LED manufacturers in the architecture of the “package”,
all CSP LEDs have no need for main parts such as package or wire bonding.
Difference between Seoul
Semiconductor CSP and conventional
CSP architecture
Source: Seoul Semiconductor

22
LED Packaging Process Flow
OVERVIEW OF LED PACKAGING
Epiwafer
Carrier wafer
Epitaxial
substrate
Die
Lens
Carrier wafer
MESA
&
Vertical
Flip
Chip
LEGEND
Only for vertical LED
packaging
Can be “mixed” with
interconnection for Flip
Chip LED packaging

23
For both GaAs-
based and
Sapphire-based
LEDs, wafer
bonding enables
improved
thermal,
electrical and/or
optical
properties.
Introduction (2/2)
WAFER BONDING
• In such designs (i.e.:VTF andTFFC LEDs), Sapphire is replaced by another carrier that offers higher thermal conductivity:
• Silicon-based LEDs involve also the transfer to a silicon carrier (i.e.: bonding step) and removal of the original Silicon
substrate. Indeed, unlike Sapphire which is transparent, Silicon re-absorbs most of the light emitted toward the substrate.
This significantly decreases the efficiency of the LED. The most common solution to the problem is to use a vertical LED structure:
• Regarding GaN-based LEDs (i.e.:GaN-on-GaN LEDs), no wafer bonding process is required.
Epitaxy Substrate
LED Epitaxial Layers
1. LED epiwafer
Bonding Layer
Bonding Layer
Carrier substrate
Epitaxy Substrate
Bonding Layer
Carrier substrate
LED Epitaxial Layers Bonding layer
Carrier substrate
4. VTF LED structure
Bonding Layer
n-contact pad
Epitaxy Substrate
Bonding Layer
Bonding Layer
Carrier substrate
Epitaxy Substrate
Bonding Layer
Carrier substrate
LED Epitaxial Layers Bonding layer
Carrier substrate
Bonding Layer
n-contact pad
Typical process flow of Vertical
Thin Film (VTF) LED
manufacturing
n-GaN
p-GaN
Epitaxy Substrate (Si)
Mirror layer
Carrier substrate (Si)
n-GaN
p-GaN
Epitaxy Substrate (Si)
Mirror layer
n-GaN
p-GaN
Active layers
Epitaxy
Substrate (Si)
Emitted
light
Absorbed
light
n-GaN
p-GaN
Mirror layer
Carrier substrate (Si)
1. LED-on-Si 2. Mirror layer deposition 3. Carrier substrate bonding 4. Substrate removal
Bonding and removal
process for LED-On-Si
2. Carrier substrate bonding 3. Substrate removal

24
LLO is the most
common substrate
removal technique
used for volume
manufacturing.
However, IP
constraints,cost,
performance
limitations and
damage caused to
the epilayer
provide incentive
for the
development of
alternatives.
OtherTechniques
SUBSTRATE REMOVAL
• We have identified 3 new techniques for substrate removal but current performance (development status) are not sufficient yet to
directly compete with LLO.
Technique Developer Comments
Chemical Mechanical
Planarization
ASTRI
• The process uses standard grinding and polishing combined with “polish stops”
structures made of hard material embedded into the structure to protect the
epi layers.
• Potentially, multiple wafers can be processed in batch.Also, there is less patent
issues than for LLO.And an increase of yield in terms of reverse current
specification can be achieved compared to LLO.
Electrochemical Etching
Yale
University
• Substrate removal technique based on the creation of a nanoporous layer of
GaN using an electrochemical etcher. Further nitride layers are then grown.A
new substrate can then be applied to the top of the structure and the growth
substrate removed at the weakened nanoporous region.
MechanicalTransfer
NTT
• NTT has developed a technique for growing high-quality layered BN thin films
on sapphire substrates, and also growing high-quality GaN-based thin films on
BN. Since in this structure the cleavable BN plays the role of a release layer, one
can easily detach the GaN-based thin-film devices from the sapphire substrates
and transfer them to the other substrate.
More details on these OtherTechniques
given in appendix

25
Global Benchmark of DicingTechnologies (i.e.: Not LED-Centric) (1/2)
DIE SINGULATION
Blade Dicing Laser Ablation Stealth Dicing Plasma Dicing
Upfront cost $200k XX XX
Cost of
Ownership (CoO)
Medium XX Medium XX
Technology type Chipping Chipping No chipping No chipping
Debris Dust XX Dust-free XX
Water XX Required No water / cleaning required XX
Die strength Low XX Medium XX
Production yield Dicing line limitation Not so good: Line limitation Low kerf loss better yield High productivity
Thermal effect on
the device
Heat effect Heat effect Unaffected Heat-free
Wafer breakage Breakage strength Wafer breakage Superior breakage strength Chip strength: > 3,000 MPa
Main Advantages
• Standard process suitable for thick
wafer (> 250µm)
• XX
• Clean process
• XX
• XX
• High level device strength
• Independent of die size
• XX
• XX
Main Drawbacks
• Dirty process
• Crack propagation
• Increased damage for thinner wafers
and small die
• XX
• Lateral damage
• XX
• Scratch on the surface > 200 µm
• XX
• XX
• Heat propagation can damage the die
• Disruptive technology
• XX

26
The diversity of
LED structures,
power levels,
applications and
process
equipment
considerations
require different
die attach
solutions to
optimize cost
and performance
aspects.
Die Attach Material vs. LED Package Power (and Applications)
DIE ATTACH
ApplicationThermal ConductivityDie Attach Material
LEGEND
LOW POWER SUPER HIGH POWERHIGH POWERMIDDLE POWER
XX
XX
XX, XX, XX
LED Downlight
XX
Automotive Exterior Lighting (DRL,Tail, Signal)
Auto Head Lamp
T8 Tube Lamps
7 - XXW/mK
XX - XXW/mK > 200W/mKXX - 200W/mK
• XX
• XX
• Silver-Filled Epoxy
• XX
Pressure-Assisted Sintered
Ag
Pressureless SinteredAg
XX
Performance(ThermalandReliability)
0 - 0.3W > 4W1 - 4W0.3 - 1W
Source: Yole Développement / Alpha

27
• White light from packaged LEDs is generated by combining blue photons from LED chips with photons of other colors from phosphor material(s).
However, as phosphors are mostly produced as powders, LED manufacturers have to blend it the encapsulant to suspend the phosphor powder
and allow for simple deposition onto the blue LED chip.
• Many encapsulating materials are available on the market with a wide variety of physical and performance characteristics. LED packagers evaluate
performance of such materials along optical, mechanical, chemical and thermal metrics (with some figures of merit bearing more importance to
the overall package performance than others).
• Additionally, they have to make sure that such material will have the best fit with the phosphor used.
• Below are presented key parameters to consider for encapsulant and potential associated interactions with phosphor materials.
Interactions Encapsulant / Phosphors - Overview
ENCAPSULATION / PRIMARY OPTICS
KEY PARAMETERS
OF
INTERACTIONS
BETWEEN
ENCAPSULANT
AND PHOPSHORS
OPTICAL PROPERTIES
MECHANICAL PROPERTIES
CHEMICAL COMPATIBILITY
THERMAL CONDUCTIVITY
CURING PROCESS
More details on Each Parameter of
Interactions in appendix

28
Encapsulant
material should
represent a
market volume
of ~XX Metric
Tons by 2021,
mostly driven
by Methyl
Silicone (and
Phenyl Silicone)
materials.
EncapsulantVolume Forecast (2012-2021)
ENCAPSULATION / PRIMARY OPTICS

29
Phosphor
quantity can
vary significantly
from one type
of package to
another.
On-Chip Configuration - Overview
PHOSPHORS
• Downconverters are usually mixed with a binder (Silicone, Epoxy) and deposited on the device. Alternatively, they can be in a ceramic
form or embedded into a solid-state binder that is paired with phosphor chips afterwards (e.g.: glass).The major types are:
Increasing phosphor packing density
Casting (Dispersion): XX
CREE Osram
Conformal Coating
Package level:
Conformal Coating or
Pre-Form – Chip only:
Philips
LumiledsPicture: System Plus Consulting
Volume conversion On-Chip conversion
Cost efficient but:
• Particle segregation, binder viscosity hard to control.
• XX
• XX
 For XX and XX power packages.
Better color uniformity & XX (especially with
ceramics) but more expensive.
 2014: Mostly for XX packages.
 2015+: Increased adoption in XX.

30
Silicates were
developed as an
alternative to
YAG and will
lose ground as
YAG IP falls into
public domain.
Material / Compositions - Focus on Silicates
PHOSPHORS
• M2SiO4:Eu2+ (M=Ba, Sr, Ca) phosphors were originally studied in the 60’s.
• Compositions for LEDs silicate phosphors and the associated intellectual property has been
asserted by a group called the BOSE consortium, consisting of Tridonic, Leuchtstoffwerk
Breitungen (LWB) and Litec (now part of Merck) all assignees on the fundamental
US6809347 silicate patent. The consortium later added Toyoda Gosei which extended the
claims.
• The BOSE consortium later signed a cross licensing agreement with Intematix. Attempt by
the consortium to trademark the name BOSE for phosphors was denied after a complaint
by electronic audio company Bose.
• Other companies like GE and Osram also own some IP on silicate phosphors for LEDs.
• Compositions have been developed to cover the green and red portions of the spectra,
from 500 to more than 610 nm. However, thermal quenching and chemical instability are
often issues for the most extreme wavelength.
• Significant progress has been made on those aspects. Various types of coating have been
used to improve stability and performance have improved on a continuous basis.
Performance of the best silicates are now approaching those of Yellow/Green YAG
phosphors. However, those higher performance silicates come at a cost premium.
• Yellow silicates are being quickly displaced by YAG. Green silicates remain used in display
applications. Orange silicates offer a cheaper alternative to some nitride for mid power LED
where photon flux and operating temperature are not too high.
Companies constituting the BOSE consortium
or having cross licensing agreement on silicates

31
RELATED REPORTS
Discover more related reports
within our bundles here.

ORDER FORM
LED Packaging 2017: Market, Technology and Industry Landscape
SHIPPING CONTACT
First Name:
Email:
Last Name:
Phone:
PAYMENT
BY CREDIT CARD
Visa Mastercard Amex
Name of the Card Holder:
Credit Card Number:
Card Verification
Value (3 digits except AMEX: 4 digits):
Expiration date:
BY BANK TRANSFER
BANK INFO: HSBC, 1 place de la Bourse,
F-69002 Lyon, France,
Bank code: 30056, Branch code: 00170
Account No: 0170 200 1565 87,
SWIFT or BIC code: CCFRFRPP,
IBAN: FR76 3005 6001 7001 7020 0156 587
RETURN ORDER BY
• FAX: +33 (0)472 83 01 83
• MAIL: YOLE DÉVELOPPEMENT, Le Quartz,
75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France
SALES CONTACTS
• North America - Steve Laferriere: +13106 008 267
laferriere@yole.fr
• Europe RoW - Lizzie Levenez: + 49 15 123 544 182
levenez@yole.fr
• Japan Rest of Asia - Takashi Onozawa: +81 3 6869 6970
onozawa@yole.fr
• Greater China - Mavis Wang: +886 979 336 809
wang@yole.fr
• Specific inquiries: +33 472 830 180 – info@yole.fr
(1)
Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date:
December 14, 2016
/
ABOUT YOLE DEVELOPPEMENT
BILL TO
Name (Mr/Ms/Dr/Pr):
Job Title:
Company:
Address:
City:
State:
Postcode/Zip:
Country*:
*VAT ID Number for EU members:
Tel:
Email:
Date:
PRODUCT ORDER
Please enter my order for above named report:
One user license*: Euro 5,490
Multi user license: Euro 6,490
- The report will be ready for delivery from December 14, 2016
- For price in dollars, please use the day’s exchange rate. All reports are
delivered electronically at payment reception. For French customers,
add 20% for VAT
I hereby accept Yole Développement’s Terms and Conditions of Sale(1)
Signature:
*One user license means only one person at the company can use the report.
Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to
corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement
group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics
Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and RD
organizations worldwide to help them understand markets and follow technology trends to develop their business.
MEDIA EVENTS
• i-Micronews.com, online disruptive technologies website
• @Micronews, weekly e-newsletter
• Communication webcasts services
• Events: Yole Seminars, Market Briefings…
More information on www.i-micronews.com
CONTACTS
For more information about :
• Consulting Services: Jean-Christophe Eloy (eloy@yole.fr)
• Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Report Business: Fayçal Khamassi (khamassi@yole.fr)
• Press relations: Sandrine Leroy (leroy@yole.fr)
CONSULTING
• Market data research, marketing analysis
• Technology analysis
• Reverse engineering costing services
• Strategy consulting
• Patent analysis
More information on www.yole.fr
REPORTS
• Collection of technology market reports
• Manufacturing cost simulation tools
• Component reverse engineering costing
analysis
• Patent investigation
More information on www.i-micronews.com/reports
FINANCIAL SERVICES
• Mergers Acquisitions
• Due diligence
• Fundraising
More information on Jean-Christophe Eloy
(eloy@yole.fr)

Definitions: “Acceptance”: Action by which the Buyer accepts
the terms and conditions of sale in their entirety. It is done by
signing the purchase order which mentions “I hereby accept
Yole’s Terms and Conditions of Sale”.
“Buyer”: Any business user (i.e. any person acting in the course
of its business activities, for its business needs) entering into the
following general conditions to the exclusion of consumers acting
in their personal interests.
“Contracting Parties” or “Parties”: The Seller on the
one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any
rights held by the Seller in its Products, including any patents,
trademarks, registered models, designs, copyrights, inventions,
commercial secrets and know-how, technical information,
company or trading names and any other intellectual property
rights or similar in any part of the world, notwithstanding the fact
that they have been registered or not and including any pending
registration of one of the above mentioned rights.
“License”: For the reports and databases, 3 different licenses
are proposed. The buyer has to choose one license:
• One user license: one person at the company can use the report.
• Multi-user license: the report can be used by unlimited users
within the company. Subsidiaries and Joint-Ventures are not
included.
• Corporate license: purchased under “Annual Subscription”
program, the report can be used by unlimited users within the
company. Joint-Ventures are not included.
“Products”: Depending on the purchase order, reports or
database on MEMS, CSC, Optics/MOEMS, Nano, bio… to
be bought either on a unit basis or as an annual subscription.
(i.e. subscription for a period of 12 calendar months). The
annual subscription to a package (i.e. a global discount based
on the number of reports that the Buyer orders or accesses
via the service, a global search service on line on I-micronews
and a consulting approach), is defined in the order. Reports are
established in PowerPoint and delivered on a PDF format and the
database may include Excel files.
“Seller”: Based in Lyon (France headquarters), Yole
Développement is a market research and business development
consultancy company, facilitating market access for advanced
technology industrial projects. With more than 20 market
analysts, Yole works worldwide with the key industrial companies,
RD institutes and investors to help them understand the markets
and technology trends.
1. SCOPE
1.1 The Contracting Parties undertake to observe the following
general conditions when agreed by the Buyer and the Seller.
ANY ADDITIONAL, DIFFERENT, OR CONFLICTING
TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS
ISSUED BY THE BUYER AT ANY TIME ARE HEREBY
OBJECTED TO BY THE SELLER, SHALL BE WHOLLY
INAPPLICABLE TO ANY SALE MADE HEREUNDER AND
SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the
Contracting Parties after clear and non-equivocal consent
by any duly authorized person representing the Buyer. For
these purposes, the Buyer accepts these conditions of sales
when signing the purchase order which mentions “I hereby
accept Yole’s Terms and Conditions of Sale”. This results in
acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written
acceptance and confirmation by the Seller, within [7 days] from
the date of order, to be sent either by email or to the Buyer’s
address. In the absence of any confirmation in writing, orders
shall be deemed to have been accepted.
2. MAILING OF THE PRODUCTS
2.1 Products are sent by email to the Buyer:
• within [1]
month from the order for Products already
released; or
• within a reasonable time for Products ordered prior to
their effective release. In this case, the Seller shall use its best
endeavours to inform the Buyer of an indicative release date
and the evolution of the work in progress.
2.2 Some weeks prior to the release date the Seller can propose
a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in
respect of article 2.2 above, and including incases where a
new event or access to new contradictory information would
require for the analyst extra time to compute or compare
the data in order to enable the Seller to deliver a high quality
Products.
2.3 The mailing of the Product will occur only upon payment
by the Buyer, in accordance with the conditions contained
in article 3.
2.4. The mailing is operated through electronic means either by
email via the sales department or automatically online via an
email/password. If the Product’s electronic delivery format
is defective, the Seller undertakes to replace it at no charge
to the Buyer provided that it is informed of the defective
formatting within 90 days from the date of the original
download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer
shall immediately verify the quality of the Products and their
conformity to the order. Any claim for apparent defects or
for non-conformity shall be sent in writing to the Seller within
8 days of receipt of the Products. For this purpose, the Buyer
agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior
information to the Seller, even in case of delayed delivery.
Any Product returned to the Seller without providing prior
information to the Seller as required under article 2.5 shall
remain at the Buyer’s risk.
3. PRICE, INVOICING AND PAYMENT
3.1 Prices are given in the orders corresponding to each Product
sold on a unit basis or corresponding to annual subscriptions.
They are expressed to be inclusive of all taxes. The prices
may be reevaluated from time to time. The effective price is
deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing
to acquire in the future the specific report and agreeing on the
fact that the report may be release later than the anticipated
release date. In exchange to this uncertainty, the company will
get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to
Yole Développement, credit card or by electronic transfer to
the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request
down payments from the Buyer. In this case, the need of down
payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written
agreement. If the Buyer fails to pay within this time and fails
to contact the Seller, the latter shall be entitled to invoice
interest in arrears based on the annual rate Refi of the «BCE»
+ 7 points, in accordance with article L. 441-6 of the French
Commercial Code. Our publications (report, database, tool...)
are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct,
during the contract, the Seller will have the right to invoice
at the stage in progress, and to take legal action for damages.
4. LIABILITIES
4.1 The Buyer or any other individual or legal person acting on
its behalf, being a business user buying the Products for its
business activities, shall be solely responsible for choosing the
Products and for the use and interpretations he makes of the
documents it purchases, of the results he obtains, and of the
advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable
pecuniary loss, caused by the Products or arising from a
material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental
or consequential damages (including, but not limited to,
damages for loss of profits, business interruption and loss of
programs or information) arising out of the use of or inability
to use the Seller’s website or the Products, or any information
provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other
inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been
obtained from sources believed to be reliable. The Seller
does not warrant the accuracy, completeness adequacy or
reliability of such information, which cannot be guaranteed to
be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice
to the Buyer from time to time be modified by or substituted
with similar Products meeting the needs of the Buyer. This
modification shall not lead to the liability of the Seller,
provided that the Seller ensures the substituted Product is
similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that
the Products contain defects, the Seller undertakes to replace
the defective products as far as the supplies allow and without
indemnities or compensation of any kind for labor costs,
delays, loss caused or any other reason. The replacement is
guaranteed for a maximum of two months starting from the
delivery date. Any replacement is excluded for any event as set
out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing
of the Products are given for information only and are not
guaranteed. If such deadlines are not met, it shall not lead to
any damages or cancellation of the orders, except for non
acceptable delays exceeding [4] months from the stated
deadline, without information from the Seller. In such case only,
the Buyer shall be entitled to ask for a reimbursement of its first
down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied,
including, without limitation, those of sale ability and fitness for
a particular purpose, with respect to the Products. Although
the Seller shall take reasonable steps to screen Products for
infection of viruses, worms, Trojan horses or other codes
containing contaminating or destructive properties before
making the Products available, the Seller cannot guarantee
that any Product will be free from infection.
5. FORCE MAJEURE
The Seller shall not be liable for any delay in performance directly
or indirectly caused by or resulting from acts of nature, fire, flood,
accident, riot, war, government intervention, embargoes, strikes,
labor difficulties, equipment failure, late deliveries by suppliers or
other difficulties which are beyond the control, and not the fault
of the Seller.
6. PROTECTION OF THE SELLER’S IPR
6.1 All the IPR attached to the Products are and remain the
property of the Seller and are protected under French and
international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce,
redistribute, resell or publish the Product, or any part of it
to any other party other than employees of its company. The
Buyer shall have the right to use the Products solely for its
own internal information purposes. In particular, the Buyer
shall therefore not use the Product for purposes such as:
• Information storage and retrieval systems;
• Recordings and re-transmittals over any network (including
any local area network);
• Use in any timesharing, service bureau, bulletin board or
similar arrangement or public display;
• Posting any Product to any other online service (including
bulletin boards or the Internet);
• Licensing, leasing, selling, offering for sale or assigning the
Product.
6.3 The Buyer shall be solely responsible towards the Seller of
all infringements of this obligation, whether this infringement
comes from its employees or any person to whom the Buyer
has sent the Products and shall personally take care of any
related proceedings, and the Buyer shall bear related financial
consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for
the needs of the contract. This person will be the recipient
of each new report in PDF format. This person shall also be
responsible for respect of the copyrights and will guaranty that
the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact
shall decide who within the Buyer, shall be entitled to access
on line the reports on I-micronews.com. In this respect, the
Seller will give the Buyer a maximum of 10 password, unless
the multiple sites organization of the Buyer requires more
passwords. The Seller reserves the right to check from time
to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee
of the buyer can access the report or the employee of the
companies in which the buyer have 100% shares. As a matter
of fact the investor of a company, the joint venture done with
a third party etc..cannot access the report and should pay a
full license price.
7. TERMINATION
7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for
the entire costs that have been incurred as at the date of
notification by the Buyer of such delay or cancellation. This
may also apply for any other direct or indirect consequential
loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions
or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the
non-breaching Party shall be entitled to terminate all the
pending orders, without being liable for any compensation.
8. MISCELLANEOUS
All the provisions of these Terms and Conditions are for the
benefit of the Seller itself, but also for its licensors, employees
and agents. Each of them is entitled to assert and enforce those
provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION
9.1 Any dispute arising out or linked to these Terms and
Conditions or to any contract (orders) entered into in
application of these Terms and Conditions shall be settled
by the French Commercial Courts of Lyon, which shall have
exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and
the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES

33
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
MEMS Sensors
LED
Compound
Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy
Management
Power
Electronics
Displays
RF
Devices
Techno.
©2016 | www.yole.fr | About Yole Développement

34
4 BUSINESS MODELS
o Consulting and Analysis
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
www.yole.fr
o Reports
• Market Technology reports
• Patent Investigation and patent infringement risk
analysis
• Teardowns Reverse Costing Analysis
• Cost SimulationTool
www.i-Micronews.com/reports
o Financial services
• MA (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management optimization
www.yolefinance.com
www.bmorpho.com
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast services
• Events
www.i-Micronews.com

35
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
MA operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr

36
OUR 2016 REPORTS PLANNING (1/2)
MARKET ANDTECHNOLOGY REPORTS
byYole Développement
o MEMS SENSORS
− Gas Sensor Technology and Market 2016
− Status of the MEMS Industry 2016
− Sensors for Cellphones andTablets 2016
− Inkjet Printhead Market Technology Trends 2016
− Sensors for Biometry and Recognition 2016
− Finger Print Sensors Market andTechnologies 2016
− Silicon Photonics 2016
− Emerging NonVolatile Memories 2016
o IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology MarketTrends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones Robots: Market Opportunities and Technology
Evolution 2016
− Silicon Photonics 2016
o MEDTECH
− BioMEMS: Microsystems for Healthcare Applications 2016
− Point of Need Testing 2016:Application of MicrofluidicTechnologies
o ADVANCED PACKAGING
− Fan-Out WLP:Technology Trends and Business Update 2016
− Embedded Die Packaging:Technologies and Markets Trends 2016
− 2.5D 3D IC Business Update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
− Fan-in Wafer Level Packaging: Market and Technology Trends 2016
o MANUFACTURING
− Equipment and Materials for Fan Out Technology (Wafer vs Panel)**
− Equipment and Materials for 3D T(X)V Technology**
− Thinning Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics,
LED, CMOS 2016
**To be confirmed

37
OUR 2016 REPORTS PLANNING (2/2)
o COMPOUND SEMICONDUCTORS
− Power SiC 2016: Materials, Devices, Modules, and Applications
− GaN Modules, Devices and Substrates for Power Electronics 2016
− Sapphire Applications Market 2016: from LED to Consumer Electronics
− GaN RF Devices Market:Applications, Players,Technology, and Substrates
2016 – 2022
− RF components and modules for cellphones 2016**
o LED
− Sapphire Applications and Market 2016: From LED to Consumer Electronics
− Thermal Management for LED and Power 2016
− LED Packaging 2016
− Microdisplays and MicroLEDs 2016**
− UV LEDs - Technology, Manufacturing and Application Trends
− OLED for Lighting - Technology, Industry and Market Trends 2016
− Automotive Lighting:Technologies, Industry and MarketTrends 2016
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and MarketTrends for Power Electronics
2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− GaN Modules, Devices and Substrates for Power Electronics 2016
− InverterTechnologies Trends Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation
2016
− Thermal Management for LED and Power 2016
− GaN RF Devices Market:Applications, Players,Technology, and Substrates
2016 - 2022
o BATTERY
− Stationary Storage and Automotive Li-ion Battery Packs
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers
PATENT ANALYSIS by Knowmade
o Patent Infringement (crossed analysis based on Knowmade and System Plus
Analysis expertise)
o Patent Investigation (crossed analysis based on Knowmade Yole Développement
expertise)
o Patent Landscape
TEARDOWN REVERSE COSTING by System Plus
Consulting
More than 30 teardowns and reverse costing analysis and cost simulation tools to be
published in 2016.

38
OUR 2015 PUBLISHED REPORTS LIST
o MEMS SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology Market Trends
− Infrared Detector Technology Market Trends
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace
Industrial
− Emerging Non Volatile Memory (NVM) Technology Market Trends
o IMAGING OPTOELECTRONICS
− Camera Module Industry
− Uncooled Infrared Imaging Technology Market Trends
− Status of the CMOS Image Sensors
− Infrared Detector Technology Market Trends
o MEDTECH
− Sample Preparation Automation Through Emerging Microfluidic Technologies
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro
Diagnostic, and Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics
applications
− GaN and SiC Devices for Power Electronics Applications
o LED
− LED Lighting Module Technology, Industry and Market Trends 2015
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors Quantum Dots 2015: LED Downconverters for Lighting Displays
o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
Electricity Storage Solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics
applications
− GaN and SiC Devices for Power Electronics Applications
o ADVANCED PACKAGING
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
− Flip Chip: Technologies and Markets Trends
− Fan-Out and Embedded Die: Technologies Market Trends
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and
LED Applications
− Emerging Non Volatile Memory (NVM) Technology Market Trends

39
CONTACT INFORMATION
Follow us on
• Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Japan Asia:Takashi Onozawa, Representative Director,Yole KK
Email: onozawa@yole.fr
• RoW: Jean-Christophe Eloy, CEO President,Yole Développement
Email eloy@yole.fr
• Report business
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr
• Japan Asia:Takashi Onozawa, Representative Director,Yole KK.
Email: onozawa@yole.fr
• Greater China: Mavis Wang, Business Development Director
Email: wang@yole.fr
• Financial services
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr
• General
• Email: info@yole.fr

LED Packaging 2016: Market, Technology and Industry Landscape - 2016 Report by Yole Developpement

Recommended

Recommended

More Related Content

More from Yole Developpement

More from Yole Developpement (20)

Recently uploaded

Recently uploaded (20)

LED Packaging 2016: Market, Technology and Industry Landscape - 2016 Report by Yole Developpement