碩士班最後一份投影片，介紹如何做簡報

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2. Powerpoint
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3. 1.Top Guideline
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4. 1.Top Guideline
• In the Audience’s Shoes
• Have A Skeleton
• Don’t Read Slides
• Don’t Inundate Your Listener
• Put Only Important Information
• Grammar and Spelling
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5. 1-1 In the audience’s shoes
• Who’s the listener?
• Can he/she remember my previous
work?
? ! ZZ
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6. 1-2 Have a skeleton
• Outline
• Remind audience where are we!
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7. 1-3 Don’t Read Slides
• Get the control of presentation!
• Extract the most important key words.
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8. Introduction
There are two Possible Ways to Minimize Corrosion
 The first is to strengthening the corrosion of copper so that
copper would not be corroded easily. When it comes to
strengthen, nanotwins give people an image of strengthening.
Therefore, is it possible to strengthen material by nanotwins is
an interesting topic.
 Another possible way to increase corrosion resistance is to
shield the copper from contacting the corrosive agent. One of
the most effective protective agent for copper from corrosion is
BTA.
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Chih-Jie Yang

9. Introduction
Possible Ways to Minimize Corrosion
 Strengthen the corrosion resistance.(Strengthening)
 Shield copper from corrosive agents (Shield)
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Chih-Jie Yang

10. 1-4. Don’t inundate your audience
• Too much information
• Unorganized information
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11. DC PO BTADC BTAPO
(111) 0.16 0.10 0.32 0.28
(200) 0.08 0.05 0.18 0.20
(220) 2.76 2.85 2.50 2.52
Samples share similar preferred orientation Cu(220).→Corrosion difference from crystal. orient. is eliminated.
Chih-Jie Yang

12. Discussion
2.Cryst. Orientation
DC PO BTADC BTAPO
(111) 0.16 0.10 0.32 0.28
(200) 0.08 0.05 0.18 0.20
(220) 2.76 2.85 2.50 2.52
All samples share similar preferred orientation Cu(220).
→Corrosion difference from crystal. orient. is eliminated.
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Chih-Jie Yang

13. Discussion
3.G.S Analysis
We can not explain corrosion
behavior by grain size variation!!
Luo et al. J. Electrochem. Soc.2012, 159, C80-C85
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Chih-Jie Yang

14. 1-5. Put Only Important Things
• Weight the importance of your info
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15. Outline
Motivation
Review
Results
Discussion
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Chih-Jie Yang

16. Outline
Motivation
Why we are concerned about corrosion?
What are the possible ways to minimize corrosion?
Review
Results
A corrosion resistance relationship b/w specimens was found.
Reasoning for the Relationship
Study of possible factors.
Explanation of the observed results.
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Chih-Jie Yang

17. 1-6. Grammar and Spelling
• Double check your unfamiliar words
nail oil-> nail polish
• Do not create special word usage.
• Beware of typos
╳
Crystal lattice is destroyed
Crystal lattice is damaged
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18. 2.Arrange Your Slides
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19. Arrange Your Slides
Figure
Individual
Object
Animation Illustration
Color
Overall
Alignment
Layout
Animation
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20. 2-1-1 Literature Figure
• Clear
• Cite reference
Zhigang et. al. IEEE Trans. Device Mater. Reliab. 2005,5,206
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21. 2-1-2. Data Plot
• Easy to read
• Avoid ambiguity
• Unit and Legend
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22. 2-1-2. Data Plot
• Easy to read
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23. 2-1-2. Data Plot
• Avoid ambiguity
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24. 2-1-3 Mind map
• Avail the SmartArt objects
• Not to be limited
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25. 2-1-3 Mind map
• Avail the SmartArt objects
Egun CVD ECD
• Grain size
Grain • Grain orientation
• Passivation film
Passive • Native oxide
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26. 2-1-3 Mind map
• Not to be limited
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27. Discussion
Corrosion
Surface Crystal Twinning
Roughness Orientation
Grain Size
BTA?
Twinned
BTA incorporated
Polish all samples Control to Cu(220)
by Cl- addition
Contradictory Trend
?
Corrodes Slower
Chih-Jie Yang

28. Arrange Your Slides
Figure
Individual
Object
Animation/Figure Illustration
Color
Overall
Alignment
Layout
Animation
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29. 2-2 Animation/Figure Illustration
• Use animation/Figure to illustrate your
idea
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30. 2-2 Animation/Figure Illustration
1.E-gun deposition: Ti 30nm Cu 300nm
2.Photolithography:spin coating AZ4620 5um
3.Electrodeposition:H2SO41M,pH=1,NaCl10- 3M
4.Mechanical Polish:2400 grit paper->clothing
5.Polarization test: Electrolyte:HNO3 0.1M
6. Immersion Test: Electrolyte:HNO3 0.1M
7. Characterization:TEM,SEM,AFM,XRD
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31. Exp. Flow
E-Gun Deposition Mechanical Polish Immersion Test
Cu Seed Ti:30nm
Ti 2400 grit paper Electrolyte:
Cu:300nm
Si ↓ HNO3 0.1M
300 nm Al2O3 Test time
12 hours
Photolithography
AZ-4620
5㎛ Polarization Test
Characterization
Electrolyte:
Electrodeposition
HNO3 0.1M SEM
H2SO4 1M
Sweep V:
-0.5~2V
XRD
pH=1 Sweep rate: AFM
NaCl 10-3M
BTA 10-4M
0.05V/S
TEM
Chih-Jie Yang

32. Discussion
Better R. for BTA
Corrosion Copper Oxidation
Protected Regions
1
2
1 1 1
2 1
2 1 1
2 2
1 1
1
1 2
Conclusion
Incorporated Amount:
BTAPO>BTADC
Corrosion Resistance
BTAPO>BTADC
Chih-Jie Yang

33. Arrange Your Slides
Figure
Individual
Object
Animation/Figure Illustration
Color
Overall
Alignment
Layout
Animation
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34. 2-3. Color
• Use similar color through the ppt
• Simple background
• Avoid bright/fluorescent color

35. 2-3. Color
• Avoid bright/fluorescent color
Twin structures in specimen were
characterized by TEM technique.
Copper foil was stripped from
substrate first.
Then it was adhered to copper grid by
AB glue and placed still for 12 hours
for the glue to dry

36. Arrange Your Slides
Figure
Individual
Object
Animation/Figure Illustration
Color
Overall
Alignment
Layout
Animation
36

37. 2-4. Alignment
• Alignment all the objects
(Centered/Left)
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38. Exp. Flow
E-Gun Deposition Mechanical Polish Immersion Test
Cu Seed Ti:30nm
Ti 2400 grit paper Electrolyte:
Cu:300nm
Si ↓ HNO3 0.1M
300 nm Al2O3 Test time
12 hours
Photolithography
AZ-4620
5㎛ Polarization Test
Characterization
Electrolyte:
Electrodeposition HNO3 0.1M
Sweep V: SEM
H2SO4 1M
-0.5~2V XRD
Sweep rate:
pH=1
0.05V/S AFM
NaCl 10-3M
BTA 10-4M TEM
Chih-Jie Yang

39. Exp. Flow
E-Gun Deposition Mechanical Polish Immersion Test
Cu Seed Ti:30nm
Ti 2400 grit paper Electrolyte:
Cu:300nm
Si ↓ HNO3 0.1M
300 nm Al2O3 Test time
12 hours
Photolithography
AZ-4620
5㎛ Polarization Test
Characterization
Electrolyte:
Electrodeposition
HNO3 0.1M SEM
H2SO4 1M
Sweep V:
-0.5~2V
XRD
pH=1 Sweep rate: AFM
NaCl 10-3M
BTA 10-4M
0.05V/S
TEM
Chih-Jie Yang

40. Arrange Your Slides
Figure
Individual
Object
Animation/Figure Illustration
Color
Overall
Alignment
Layout
Animation
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41. 2-5. Animation
• Use animation to highlight your key
point.
• Get the control
• Keep it simple
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42. Review-Shield
Benzotriazole (BTA)
BTA
CMP Corr. ED
Inhibitor Additives
 Roughness
 Inhibitive 
Matjaz et al. Corrosion Science 2010,52, 2737–2749
G.S.
Capability  C.E.
W/O BTA
 Inclusion
W/ BTA
Protection Protection
BTA as additives
?
Discuss Corr. Ability
Mansfeld et al. Corrosion 1971,27, 289-293
Chih-Jie Yang

43. Review-Shield
Benzotriazole (BTA)
BTA
CMP Corr. ED
Inhibitor Additives
 Roughness
 Inhibitive 
Matjaz et al. Corrosion Science 2010,52, 2737–2749
G.S.
Capability  C.E.
W/O BTA
 Inclusion
W/ BTA
Protection Protection
BTA as additives
?
Discuss Corr. Ability
Mansfeld et al. Corrosion 1971,27, 289-293
Chih-Jie Yang

44. 3.The Most Important Thing
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45. The Most Important Thing
• In the audience’s shoes
• Get the control of the present
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