Integrated circuits are placed into protective packages in order to allow efficient assembly and handling onto PCBs (printed circuit boards) and to protect the electronic devices from damage. Different sort of packaging techniques are present. Packaged IC component inspector systems primarily increase the throughput and boost the package changeover than traditional methods. The market has been segmented into by IC packaged inspection type surface mounting, through-hole mounting, pin grid array, ball grid array, flip chip inspection, plastic encapsulated IC inspection, flat package, molded underfill inspection among others. Moreover, the market has been also segmented by end use industry which includes consumer electronics, industrial equipment, aerospace and military, automotive, telecommunication, healthcare among others. The market for packaged IC component inspector by region has been segmented into, Europe, Asia Pacific, North America, MEA (Middle East and Africa) and South America.

1. Integrated circuits are placed into protective packages in order to allow efficient assembly and
handling onto PCBs (printed circuit boards) and to protect the electronic devices from damage.
Different sort of packaging techniques are present. Packaged IC component inspector systems
primarily increase the throughput and boost the package changeover than traditional methods. The
market has been segmented into by IC packaged inspection type surface mounting, through-hole
mounting, pin grid array, ball grid array, flip chip inspection, plastic encapsulated IC inspection, flat
package, molded underfill inspection among others. Moreover, the market has been also segmented
by end use industry which includes consumer electronics, industrial equipment, aerospace and
military, automotive, telecommunication, healthcare among others. The market for packaged IC
component inspector by region has been segmented into, Europe, Asia Pacific, North America, MEA
(Middle East and Africa) and South America.
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Integrated circuit packages are made of different sort of materials for instance plastic of a molded
package, silicon circuit contained within the package and ceramic package. Each package material
carries different mechanical characteristics, for example elastic modulus and thermal expansion,
primarily which cater to development of mechanical stresses when the whole package is subjected
to thermal excursions. Circuits are exponentially smaller in size and defects have become smaller
and much more difficult to identify or detect. Detecting defects is a crucial process in order to
prevent mechanical, electrical and thermal failures. To ensure no defects reach the end users,
packaged semiconductor producers are looking for advanced analytic capabilities along with finer-
resolution imaging to fine-tune their processes and designs. In addition, increasing customer
demand for higher throughput to enable 100% semiconductor inspection at production speeds is
also fueling the market for packaged IC component inspector.
Some of the defects which are inspected by the packaged IC component inspector include number of
the cracks in the IC die, delamination of one package interface from another and cracks in the body
of the package. Some of the major inspection system application includes flip chip inspection,
stacked die imaging, multi-chip and hybrid module inspection and ball grid arrays among others.
Increasing technological advancement in the field of semiconductor component manufacturing is
one of the prime reasons behind the growth of packaged IC inspection globally. Major
semiconductor component manufacturer are focusing on innovating improved semiconductor
inspection technology to meet the complex packaging challenges. Improved performance, fault less
semiconductor components, higher throughput are some of the prime characterization of packaged
IC component inspector, which in turn is fueling the application in different end use industries.
Cyclical nature of semiconductor industry may be considered as one of the restraining factor which
may inhibit the growth of the packaged IC component inspector market. However, application of
packaged IC component inspector for nanoelectronics industry is one of the prime opportunities for
the market.
In 2016, North America held the largest market share in terms of revenue for the packaged IC
component inspector market, followed by Asia Pacific and Europe. The U.S. is leading the packaged
IC component inspector market in North America. In Asia Pacific, China, Japan, and India, South
Korea among others are some of the major market contributing in the positive development of the
market for packaged IC component inspector. Germany, Italy, U.K., France among others are
contributing positive share in the packaged IC component inspector market. In Middle East and
Africa, there has been considerable advancement and development in the field of electronics and
other industries for example, automotive and telecommunication sector is stimulating the demand

2. for packaged IC component inspector market. In South America, Brazil and Argentina are anticipated
to contribute positive growth over the forecast period from 2017 to 2025.
KLA Tencor Corporation (The U.S.), Sonix, Inc. (The U.S.) and Nidec Corporation (Japan) among
others are some of the key players operating in the packaged IC component inspector market
globally.
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