Die Attach, also alternatively known as Die Bonding, is the highly precise process of attaching a semiconductor die/chip to a substrate or package such as a leadframe, die or PCB board. Read More: https://tinyurl.com/yc7jnuxu

1. Die Attach
Our Die Attach Product Families
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2. Die Attach Overview
Die Attach, also alternatively known as
Die Bonding, is the highly precise
process of attaching a semiconductor
die/chip to a substrate or package such
as a leadframe, die or PCB board.

3. Our Die Attach Product Families
Rubber Tips
Rubber Holders
Pick Up Tools
Ejection Systems
Adhesive Systems
Holding Systems
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4. Rubber Tips
Rubber Tips are a line of replaceable Pick
Up Tools that can cater to a wide range of
different applications.
One of the main benefits its ability to
absorb the impact that the Pick and Place
process may have on the die or device.

5. Rubber Holders
We manufacture Common holders, Tri-
Lock holders, Compression holders, and
Magnetic Holders that are designed to fit
our Rubber Tips for various process and
application requirements.

6. Pick Up Tools
The family of Pick Up Tools designed and
manufactured by Oricus consists of
Tungsten Carbide Tools, Hybrid Pick
Tools, Alloy/Superalloy Steels Tools, and
Engineering Plastics Tools.

7. Ejection Systems
Our Ejector Systems product line is
made up of Standard Ejector Needles,
Twin Ejector Needles, Quad Ejector
Needles, Needle Holders and Pepper
Pots.

8. Adhesive Systems
Our Adhesive Systems lineup comprises
of Dispensing Tools, Stamping Tools,
Spanker Tools and Flux Systems. Each
of these tools play a crucial role in the
Adhesive Dispensing process.

9. Holding Systems
Holding Systems for Die Attach are
made up of Anvil Blocks and Comb
Clamps, each of them playing a specific
role to ensure components are securely
held during the Die Attach process.

10. Thank You
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