The document discusses applications of a thermoformability analyzer to quantify and compare the thermoformability of plastic materials. It outlines key factors that affect thermoformability like material properties, processing parameters, and part design. Current test methods are described as inconsistent and not reflective of actual thermoforming conditions. The thermoformability analyzer aims to address these issues by simulating the full thermoforming process including heating, stretching in 3D, forming, and cooling, under controlled and repeatable conditions. Results from the analyzer can help processors optimize materials and processing parameters for thermoforming. A thermoformability index is proposed as a standardized metric to compare materials.

1. Applications of Thermoformability Analyzer Amit Dharia Transmit Technology Group, LLC Irving, Texas

7. Test Methods Inconsistent results, grip extrusion, annealing Hot tensile test Repeatable, effect of temperature DMTA Repeatable, correlates with Sag test, expensive equipment Stress Relaxation No external force, geometry dependent, measure of only melt strength Sag test > Tm, cooling effect, uni-directional, not applicable to all materials Melt Tension Easy, measure of only MW MFR Major Short coming Test Method

12. Variables Shrinkage Extrusion, storage Additive package impurity % of fillers Forming speed % regrind Type of fillers Plug temperature Volatiles Rho, k, Cp Plug material Color η o , η el Plug geometry Layers % LCB, % Xl Part geometry Residual stresses Tg, Tm, % Xc Forming Method Thickness Molecular Structure Process Feed Stock Material

14. Output Range Input Temp. vs. Time Plug assist, Vacuum Method Force vs. Time Any type Resin Type Test Input – Output Variable Plug Dwell time 10- 180 mm/second Forming Speed Variable Cooling Time 100 lb Maximum Force 23 C to 120 C Plug temperature Force vs. Depth Epoxy, Polished Aluminum Plug Material Force at Max Draw Depth Variable Heat Soak time Draw vs. time 60 C to 280 C Forming Temperature Force vs. Draw Depth 10 mil to 375 mil Sheet Thickness

15. Typical GUI Screen Sag Elastic Plastic Strain hardening Thinning

16. Results V,T

17. Technoform

18. Schematics of Technoform

19. Melt Strength = Resistance to Deformation @ T Melt Elasticity =Capability to deform @ T Stress (Force) % Draw or A/Ao Strain Hardening

20. Heating rates for various plastic materials (Heater at 600 C, 3” from upper, 2” from lower)

21. Effect of Crystallinity

22. Comparison of various PE

23. Effect of Forming Temperature

25. Effect of Melt Strength (% HMSCOPP in COPP)

26. HMSCOPP

27. COPP vs. HMSCOPP

28. Isothermal vs. Non-Isothermal 20 mm/s, 130 C, HIPS

29. Effect of Plug Temperature HIPS 35 mil, 130 C, 40 mm/s, No control

30. Effect of Plug Temperature-II 35 mil HIPS, 130 C, 40 mm/s, Plug at 23 C

31. Effect of Plug induced cooling -III HIPS (with and without hole)

32. Effect of Plug Material 35 mm HIPS, 40 mm/s, 130 C

33. Effect of Sheet Thickness on heating rates

34. Effect of Sheet Thickness

35. Effect of Color on heating Rate

36. Effect of Color CoPP, 35 mil, 40 mm/s, 160 C

37. Effect of Lot to Lot Variation 170 C, 40 mm/s, 190 mil TPO

38. Effect of Regrind (FR-ABS) 125 mil, 160 C, 40 mm/sec

39. Effect of Regrind (GPPS) 125 mil, 190 C, 40 mm/sec

40. Processing Window of Commercial TPOs

41. COPP- Nano clay Composites

42. CoPP-Nano Clay Composites