Mentor M.A.D. overview

5. R&D Centers Mechanical Analysis Group Dedicated Global Sales & Support

8. Customers: ~7,500 users at ~2,500 sites

9. Typical Applications FloEFD & FloTHERM

13. The only way a company like Linn can prosper in a cut-throat marketplace is through a faster design process which delivers products that are demonstrably superior. FloTHERM helps us achieve this goal Martin Dalgleish Head of Commercial Affairs, Linn ‘‘ ’’ Linn is an independent precision engineering company specialising in high-quality sound reproduction. Their entertainment systems can be found throughout the world in royal residences, luxury homes and in Aston Martin motorcars. Linn are the leading supplier of multi-zone entertainment systems to the Superyacht industry, where Linn systems have been proven in the harsh maritime environment for over a decade. Linn use FloTHERM software in the design of their power amplifiers, where rapid and efficient dissipation of heat is an essential factor in the ultimate performance of the system. FloTHERM enables their mechanical engineers to optimize the performance of critical heatsink designs to ensure that Linn’s products are compact and reliable.

15. Combining FloTHERM PCB and FloTHERM has helped to reduce the number of engineering prototypes we require, reducing cost and time to market Wei-Pin Wu, Principal Engineer Johnson Controls ‘‘ ’’ Johnson Controls is a designer and manufacturer of in-car electronics including instrument panels and overhead systems. They develop both the printed circuit boards and the electronics housing. FloTHERM PCB is used to model the performance of the printed circuit board, and FloTHERM to review how heat is controlled in the final product. The synchronization of these applications allows Johnson Controls to create a computer model of the entire product testing environment. Automotive electronics conform to strict performance standards - twice as demanding as those in the domestic environment. Our technology has helped Johnson Controls to meet these standards while they speed up the product development cycle. The future goal is to eliminate the need for engineering prototypes altogether.

17. To reliably measure the interface resistance we needed a transient measuring method. We chose the T3Ster ® because of its compactness and ease of use, allowing us to improve data acquisition and processing of the transient thermal data. We were able to improve the accuracy of TIM measurements and measure the contribution of the different components – the heater chip, thermal interface, cooling cap, second interface, and heat sink Dr. Bruno Michel Advanced Thermal Packaging Manager IBM Zurich Research Laboratory, Switzerland ‘‘ ’’ The performance of Thermal Interface Materials (TIMs) has become a thermal “bottleneck” between a high performance chip package and its heat sink. Bruno Michel and his Advanced Thermal Packaging team at the IBM Zurich Research Laboratory speculated that voiding within TIMs produced with thermal pastes could be reduced by minimizing pressure gradients in the paste during thermal cycling. The idea the team hit on was to develop a novel type of interface structure using Hierarchically Nested Channels (HNCs) that would allow the paste to flow more easily during thermal cycling. Naturally, the researchers wanted to test their hypothesis under conditions that closely mimic an actual processor, interface and heat sink. Having built a suitable experimental setup, the team chose MicReD’s T3Ster® equipment to perform the thermal measurements with successful results .