Key benefit : 1) regular flux shot and stable dispensing 2) no component movement 3) long green strength 4) excellent wetting 5) excellent cleaning performance 6) low solder void content (<1%).

1. Nich Top Company
TACKY ASSEMBLY
FLUXES
16 Jul. 2009
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2. Typical Applications
Nich Top Company
1) SMT & Rework
BGA Back End
2) Ball-Attach (BA) Component Flip Chip Component
3) Package on Package (PoP)
4) Stud Bumping (SB)
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3. Typical Applications Nich Top Company
Au Wire
Tacky
Flux Solder sphere
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4. Product Overview
Nich Top Company
TACKY
FLUXES &
Water-Clean PASTES
No-Clean
Dispensing
Printing
Dipping
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5. Product Overview
Nich Top Company
SC88 Key Benefits
DISPENSING
APPLICATION ONLY
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6. Nich Top Company
Properties desired for Tacky Flux
SC88 Key Benefits
Air free filled syringes, no misses.
Compatible with epoxy under fill (REL0 formulation).
Adapted for lead-bearing and lead-free alloys.
Suitable for fast dispensing (1mg in 100ms) without choking.
Regular dots from Day 1 to Day 5 at 22-24°C.
No component movement.
Thermally stable at up to 280°C.
Low, clear no-clean post-soldered flux residue.
Easy-clean formula, if desired (isopropanol, Zestron & Vigon products).
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7. Flux Type: No-Clean Nich Top Company
Application: Dispensing
Dispensing
AF 218-1 Printing
AF 218-2
Solids content: 39 % Solids content: 70 %
Density @25°C: 0.92 g/cm3 Density @25°C: 0.92 g/cm3
Viscosity @25°C: 12 000 cP Viscosity @25°C: 18 000 cP
Peak Tack Force: 2.8 g/mm2 Peak Tack Force: 3.7 g/mm2
Flux Type: REL0 Flux Type: ROL0
SIR (J-STD-004): 1 x 108 Ω SIR (J-STD-004): 1 x 108 Ω
SIR (Bellcore): >2 x 104 MΩ SIR (Bellcore): >2 x 104 MΩ a
Copper Mirror: Pass Copper Mirror: Pass
Ag chromate test: Pass Ag chromate test: Pass
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8. Flux Type: Water-Clean Nich Top Company
Application: Dispensing
Dispensing
AF 918-1 Printing
AF 918-2
Solids content: 80 % Solids content: 80 %
Density @25°C: 0.95 g/cm3 Density @25°C: 0.95 g/cm3
Viscosity @25°C: 42 000 cP Viscosity @25°C: 32 000 cP
Peak Tack Force: 1.8 g/mm2 Peak Tack Force: 1.5 g/mm2
Flux Type: ORL0 Flux Type: ORH1
SIR (J-STD-004)*: >1 x 108 Ω SIR (J-STD-004)*: >1 x 108 Ω
SIR (Bellcore)*: >2 x 104 MΩ SIR (Bellcore)*: >2 x 104 MΩ
* after cleaning * after cleaning
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9. Dispensing Nich Top Company
performance
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10. Dispensing performance Nich Top Company
What most assemblers expect
• Regular deposits at 20-25°C
• Homogeneous through complete
use of syringe
• No choking at 20-25°C up to 5 days.
• Deposits remain tacky up to 16 hours
• Steady dispensing equipment
AF 218
0,4mm; 1 bar; 100 ms
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11. Soldering Nich Top Company
performance
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12. Suitable Temperature Profiles
AF 218 & AF 918 SAC 305 (Alpha Lead-free tin-bar) Nich Top Company
Temp/°
C MMMMMMMM Tpeak 245°C
MMMMMMMM
MMMMMMMM
MMMMMMMM
MMMMMMMM
MMMMMMMM
MMIIII
MMM
MM
MM
MM
MM
Tliq
217°C 30-45s
Ramp: 1-2
°C/s
Time/s
Hallway Reflow Profile
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13. Suitable Temperature Profiles
AF 918 SAC 305 Nich Top Company
Amkor Reflow Profile
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14. Suitable Temperature Profiles
AF 918 SAC 305 Nich Top Company
Stats ChipPAC Reflow Profile
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15. Soldering performance
AF 918 SAC 305 600µm BGA spheres Nich Top Company
AF 918
OSP Cu ENIG
Senju WF6300LFHV
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16. Soldering performance
AF 918 SAC 305 600µm BGA spheres Nich Top Company
IIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIII
AFDAFD 218
AFD 218
IIIIIIIIIIIII
AFD 218
IIIIIIIIIIIII
AF 918218 IIIIIIIIIIIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIIIIIIIIIIII
Senju IIIIIIIIIIIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIIIIIIIIIIII
WF6300LFHV
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17. Soldering performance Nich Top Company
AF 218 with 600µm SAC 305 spheres (air)
Reflection from camera‘s LEDs
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18. RELIABILITY TEST
AF 918 Sn96.5Ag3.6 600µm sphere Nich Top Company
Ball-Shear Ball Cross-section
High reliability for good circuit function
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19. RELIABILITY TEST
AF 918 Sn96.5Ag3.6 600µm sphere Nich Top Company
IMC’s
Low void content (<3%)
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20. RELIABILITY TEST
AF 918 Sn96.5Ag3.6 600µm sphere Nich Top Company
Low void content (<1%)
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21. Cleaning Nich Top Company
performance
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22. Cleaning performance Nich Top Company
Before cleaning After cleaning
1. In-line DI water cleaner
2. Water temperature: 60C
3. Belt speed of 1 m/min
4. Pressure: 60PSI spray.
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23. Cleaning performance Nich Top Company
Free of flux and solder debris after cleaning
Excellent cleaning performance
Bright solder surface
Consistently good results at different cleaning stations
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24. Key benefits Nich Top Company
Regular flux shots and stable dispensing
No component movement
Long green strength (minimum 2 hours for a 1mm3 dot)
Excellent wetting
Excellent cleaning performance
Low solder void contents (<1%)
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25. Nich Top Company
Thank You
for your kind attention and
patience for listening to my
presentation
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