William T. Topolski is an electro-mechanical designer with over 15 years of experience designing products for industries including semiconductor, computer, medical, and telecommunications. He has extensive experience using Pro-E/Creo for 3D modeling and has worked on projects involving architectural home design, wafer inspection equipment, military vehicle power systems, and more. His technical skills include Pro-E, sheet metal design, cabling documentation, and ASME standards.

1. William T. Topolski Campbell, CA
topolski@sbcglobal.net (408) 374-4712
Electro-Mechanical Designer with extensive experience in Electro-Mechanical Packaging Design. Working in diverse
industries which include both military and commercial sectors. Designing products for the Semi-conductor, Computer
and Computer Peripherals, Medical Electronics / Pharmaceutical and Tele-communications Industries. Established and
implemented high efficiency documentation and engineering control systems in start-up environments. Designing and
doing architectural design using Pro-E to produce highly functional design concepts by utilizing what would be wasted
volume in normal home design. Presently using PTC Creo2
TECHNICAL SKILLS:
• Pro-E Designer -15 Years
• E/M Packaging Design
• Power Supply Packaging
• Sheet Metal Design
• ASME Y14.100 /Y14.5
• WildFire4 / Creo2
• Machined Components
• Castings/ Plastic Components
• Bus Bar Design
• Cabling/Interconnect Documentation
PROFESSIONAL EXPERIENCE:
FREE-LANSING .
ARCHITECTUAL DESIGN 2013 to
2014
Designed and built Mountain Home in the Tahoe area using Pro-e to produce a highly functional design maximizing
total utilization of available volume in home. Modeled furnisher and appliances to determine placement of lighting
scheme, working with panelized home manufacturer for a factory built design, was the Owner Builder contractor
coordinated subcontractors and as a DIY’er completed all of the tiling, painting, electrical and finish plumbing,
installed kitchen. All granite design was designed with Pro-E and worked with fabricator in cutting granite to size.
Presently working on a redesign for home in Campbell using Pro-E for Kitchen design. Modeling appliances,
cabinetry, and track lighting systems and furnisher to produce a 3-d model prior to construction. Pro-e solid
models documentation available upon request.
KLA-TENCOR, Milpitas, CA
E /M PACKAGING DESIGNER Mar 2011 to Oct
30, 2012
Design and documentation of wafer loader products. Generating Pro-E models of machined components and sheet
metal frame parts. Modeling parts and assembles utilizing skeleton framework structure to enable rapid
turnaround of designs of similar structures. Methodology allows for easy swap out of major components such as
robot handlers and variation in inspection tool configurations allowing for new frame designs to be released to
market in highly efficient and accelerated time frame.
• Pro-E Modeling Wildfire 4 • PRO-INTRALINK/WINDCHILL 9.1

2. William T. Topolski Campbell, CA
• Solid modeling
• Assemblies
• Interconnect documentation
• ASME Y14. Machined Components
• SSME Y14.100 & ASME Y14.5 (M)
BAE SYSTEMS LAND AND ARMAMENT, Santa Clara, CA
E/M PACKAGING DESIGNER Aug. 2005 to Nov,
2010 Involved in the packaging of high energy (600v, 1600 amp) power systems for use in military land vehicles,
power systems utilizing IGBT technology. Working within guide lines of the DOD Fire Wall for highly sensitive
data.
• Pro-E Modeling Wildfire 4
• PRO-INTRALINK/WINDCHILL
• Solid modeling
ASML INC, Scotts Valley, CA
E/M PACKAGING DESIGNER Mar. 2002 to May,
2002 Contract assignment to generate PRO-E detail and assembly documentation on 300mm Wafer Process
Equipment. Detailing heater plates and elevator documentation for outsourcing program.
KLA-TENCOR, Milpitas, CA
E /M PACKAGING DESIGNER Oct.2000 to
Nov.2001 Involved in the Design of state of art CMP devices. Involved in layout of optical system, layout and
design of device housings, design and document cabling and wiring system. Building Pro-E solids model and
generating complete Mfg. Documentation.
NOVELLUS SYSTEMS INC, San Jose, CA
E/M PACKAGING DESIGNER Apr. 2000 to Oct,
2000 Involved in the Design of 300mm Wafer Process Equipment. Sheet metal, Packaging, Cabling, ECO
processing. PRO-E, AUTOCAD & ACCEL.
KLA-TENCOR INC, San Jose, CA
E/M PACKAGING DESIGNER Jun. 1997 to
Mar. 2000 Concentration in the electronic packaging design, doing volumetric allocations of each of the Involved
in the Design of state of the art 300mm Wafer Inspection Station. Electronics sub-systems. Building Pro-E solids
model and generating complete Mfg. documentation of all sheet metal components using Pro-E Sheet metal
Module.
NETWORK EQUIPMENT TECHNOGLIES INC, Redwood City, CA
E/M PACKAGING DESIGNER Dec.1995 to
May 1997 Packaging of ATM switches for high speed telecommunication shelf.
Designing and converting design from Auto-Cad design to PRO-E modeling system. Design of card cages and
power supplies enclosures which integrate into rack & panel system.
EDUCATION:
San Jose State University, Design Drafting Technology

3. William T. Topolski Campbell, CA
Central County Occupational Center (C.C.O.C.) Auto Cad and DOS
Foothill College, Supervisory Management
Northrop Institute of Technology Mechanical Engineering