Perkin elmer-4410
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This document discusses the Perkin Elmer PE 4410 sputtering deposition system. It notes that the PE 4410 uses a delta-shaped cathode that eliminates the need for a large uniformity aperture, dramatically increasing throughput while maintaining uniformity. The delta cathode also allows for higher target utilization of up to 35% before needing to change targets compared to circular cathodes. This results in lower cost per wafer and less frequent target changes for the PE 4410 sputtering system.
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Perkin elmer-sputter-deposition spare parts-cathodes
Perkin elmer-4410
- 1. Perkin Elmer PE 4410 Sputtering Deposition Systems Page 1 of 3 20 Years Proven True "Work Horse" Sputter Home | Products | Services | Spare Parts | Wanted | Contact Us | Site Map AccuSputter AW 4450 | Perkin-Elmer 4480 | Perkin-ELmer 4450 | Perkin-ELmer 4410 | Perkin-ELmer 4400 | Perkin-ELmer 2400- 8SA | Perkin-Elmer 2400-8L Sputtering Equipment Perkin-Elmer PE 4410 Sputtering Systems AccuSputter AW 4450 - Brand New We have been focusing on providing solutions and enhancements to Perkin-Elmer Sputtering Systems including Perkin-Elmer 4480 Perkin-Elmer PE4400, PE 4410, PE 4450, PE 4480, PE 2400 Series. These OEM Sputter Coating systems have been Perkin-ELmer 4450 used in production and R&D since 1980"s and 1990's. They have been proven to be a true "work horse". Perkin-ELmer 4410 Please contact us by e-mail ( sales@perkin-elmer- sputter.com) to check whether the fully refurbished and Perkin-ELmer 4400 upgraded Perkin-ELmer PE 4410 Sputter Deposition is available. Perkin-ELmer 2400-8SA Perkin-Elmer 2400-8L Perkin-Elmer Sputtering Deposition Download Information PDFWORD THE DELTA CATHODE SYSTEM:MODEL 4410 Perkin-Elmer's Model 4410 delta cathode production sputtering system is designed for high yield in production environments demanding maximum throughput for metal deposition. It also provide a high level of flexibility in process control for other materials. The 4410 uses a delta-shaped cathode that eliminate the need for a large-area uniformity-shaping aperture. This dramatically increases throughput while maintaining high wafer-to-wafer uniformity. Contrasted with circular cathodes, target utilization is substantially higher. Up to 35% of the target can be sputtered before target change, and some 60% of the sputtered material actually reaches the substrate pallet. This results in a lower cost per wafer and less frequent target changes. Up to three delta or 8-inch round targets http://www.perkin-elmer-sputter.com/perkin-elmer-4410.htm 12/14/2012