Pedro Amancio Chávez Ruiz
Electronic Engineer
Professional ID (Cedula Profesional) : 4806121
Dolores Hidalgo 4004,Campestre II, Reynosa, Tamps. ;México
Phone: Office:(899) 9210800ext-2777
Home: (899) 128-74-85 Cell Ph.:8991700810
e-mail : pedro.chavez@alpine-usa.com , amancio.chavez@gmail.com
Summary
To continue to grow in leadership and knowledge, excel in innovative technology applications,
interact and share with team members and colleagues, and develop world-class solutions to real world
challenges. To apply my technical expertise and Six Sigma techniques in solved opportunities keys ,
improvement & Quality projects, where I can increase and utilize my SMT skills and Six Sigma
knowledge, for a company that provides the potential for professional and academic growth.
ProfessionalBackground
ALCOM Electrónicos de México S.A de C.V. January 21st,2002 to date
SMT Senior Engineer (Current )
 Dedicated to supervise the process  Production Efficiency & Quality.
 Completed process capability reviews on automated surface mount line including solder
paste printer, Inspection machines ( AOI , SPI & X-ray ) ,pick & place equipment , Laser
Marking PCB and BGA Repair & X-Ray Inspection after BGA repair .
 Dedicated to solved problems and apply continuous improvement with Six Sigma
techniques as expertise on SMT Area.
 Radiologic Security Responsible for Mexican Commission for Radiologic and Nuclear
Regulation (Comision Nacional de Seguridad Nuclear y Salvaguardias, CNSNS, ESR
Encargado de Seguridad Radiologica).
 Implemented and introduce new equipment on SMT Lines ,where I went to validate
differents types of AOI technologies at USA ( Denver, California, Minnesota ) & Asia (
Japan & South Korea ).
 Inspection Engineers & Technicians Supervisor .
 Repair personneland 200% Inspectors Supervisor.
 Quality SMT , Repair and 200% Inspection Area Responsible.
 Physical Inventory responsible with the traceability system.
Process Engineer
 Perform pre-engineering duties including ordering stencils, deciding build technology
and purchasing any fixtures necessary for product build.
 Process development which included SMT Machine Programming (GSP solder printers
AOI & X-ray), process documentation.
 Technicians and Operators supervision.
 Optimization and monitoring SMT programs and supporting the production floor, and training
to the production personnel.
 Evaluation for AOI equipment between three different technologies (VISCOM, AD-1/MD-1 &
Orbotech).
 Installation of Orbotech Inspection machine.
Process & Test Engineer. Solder paste Reflow, Adhesive, Automatic Insertion , Automatic Optical and X-
ray Inspection Process ; LASER Marker of bar code on PCBs and designer of fixtures for solder paste
printers. Active participation in quality and cost reduction programs with ideas and improvements.
Production modifications/adjustments to inspection machines and screen printers machines increase yield
reading and reduce the PPM quality outgoing external, lower scrap rate. Technicians and Operators
supervision. Data Analysis, Determination root cause and corrective actions.
Activities:
 Transfer equipment and installation of Automatic Inspection machines from Yoshima-Kyodanchi
Iwaki, Japan plant to ALCOM Electronicos de Mexico (since November 20th, 2002 to December
1st, 2002).
 Implemented and Installed of an Automatic Optical Inspection machine in Alpine Electronics
MFG. Of America Inc. Greenwood, Indiana (since January 14th, 2003 to January 19th, 2003).
 Validation of an Automatic Optical Inspection machine AD-1 in Alpine Electronics MFG. Of
America Inc. Greenwood, Indiana (since September 14th, 2003 to September 19th, 2003).
 Validation of an Automatic Optical Inspection machine (AOI), SJ50 AGILENT/Hewlett Packard
Technologies at Agilent Technologies in Loveland, Colorado, (Since October 9th, 2003 to
October 11th, 2003).
 Transfer equipment and installation of X-Ray inspection machine from Alpine Electronics MFG.
Of America Inc. Greenwood, Indiana (since February 1st, 2004 to February 7th, 2004) to
ALCOM Electrónicos de Mexico.
Delphi Delco Electronics September 12th 2000 to January 18th 2002
Surface Mount Process Technical Support. Adhesive, Solder Paste Reflow, Insertion, Automatic
Inspection X- Ray Process. Responsiblefor components and materials assemblies, test and evaluation of prototype
designs. Implementation of analytical or physical parameter applied to the process and its evaluation. Plan and
coordinate automation programs, development and execution.Generate profiles of temperature. Schedule
equipment maintenance. Engineering and technical support in and outside the team.
Delphi Delco Electronics July,26th 2000 to September,11th 2000
Professional CO-OP. Development projects as improve Profiles of temperature at Reflow Process.
Languages
Spanish, Native
English Write: 90%, Read :90%, Speak:90%.
Technical Training and Courses
 ANSI/ESD S20.202014 Training
July , 2015
 MIRTEC AOI Programming
South Korea , April 2012
 SPI ( Solder Paste Inspection )
Koh YoungTraining. Reynosa,
Tamps. March , 2012
 Radiologic SecurityResponsible
Course on SIRSA facility,Mexico
City,for Mexican Commission for
Radiologic andNuclear
Regulation (Comision Nacional de
Seguridad Nuclear y
Salvaguardias,Encargado de
Seguridad Radiologica, ESR
Approval No.
AOO.200/0232/2009), September
,21st – October , 2nd
2009
 SQL Server2005Management
MicrosoftCertification
Reynosa,Tamps.
July,7th
– 11 th 2008
 Black BeltSixSigmaCourse
UCEversityfacility, McAllen, Texas, USA
July,1st
2006to September,23th
2006
 Orbotech Inspection Machine Training
Programming
And Maitenance Training
Reynosa,Tamps.October,2005, by
Orbotech SupportEngineer.
 YVP-Xg YAMAHA Solder Printer
Programming
and Maintenance Training.
Reynosa,Tamps. June, 2004 , by Yamaha
SupportEngineers From Japan.
 X-Ray Inspection machine CXI 3600-3633
Nicolet
Greenwood ,Indiana ; February,April,
2004
 Automatic Inspection machines (AOI)
AD-1/MD-1.
Iwaki, Japan ; November – December
2002.
 LASER Marker of bar codes on PCBs
machine
Iwaki, Japan; November – December
2002.
 Siemens automated equipment: HS50,
80S20, 80S15, 80F3, 80F4; Reynosa,
Tamps; December 2000 – May 2000
 ISO 9000 Concepts
 ISO/TS 16949:2002 Concepts
 IPC Concepts
 Problem Analysis Solving
 Lean Manufacturing concepts
 5’s
 ESD
 Management Personal (Supervisors training)
by Narro y Asociado
 Repair Machine ERSA IR550
Computer Skills
Windows Office, Lotus Notes, GC Place, Microsoft SQL 2005, UNIX Concepts, Network Concepts, MINITAB 14.2

Ing._Pedro_Chavez_Ruiz_Resume2015

  • 1.
    Pedro Amancio ChávezRuiz Electronic Engineer Professional ID (Cedula Profesional) : 4806121 Dolores Hidalgo 4004,Campestre II, Reynosa, Tamps. ;México Phone: Office:(899) 9210800ext-2777 Home: (899) 128-74-85 Cell Ph.:8991700810 e-mail : pedro.chavez@alpine-usa.com , amancio.chavez@gmail.com Summary To continue to grow in leadership and knowledge, excel in innovative technology applications, interact and share with team members and colleagues, and develop world-class solutions to real world challenges. To apply my technical expertise and Six Sigma techniques in solved opportunities keys , improvement & Quality projects, where I can increase and utilize my SMT skills and Six Sigma knowledge, for a company that provides the potential for professional and academic growth. ProfessionalBackground ALCOM Electrónicos de México S.A de C.V. January 21st,2002 to date SMT Senior Engineer (Current )  Dedicated to supervise the process  Production Efficiency & Quality.  Completed process capability reviews on automated surface mount line including solder paste printer, Inspection machines ( AOI , SPI & X-ray ) ,pick & place equipment , Laser Marking PCB and BGA Repair & X-Ray Inspection after BGA repair .  Dedicated to solved problems and apply continuous improvement with Six Sigma techniques as expertise on SMT Area.  Radiologic Security Responsible for Mexican Commission for Radiologic and Nuclear Regulation (Comision Nacional de Seguridad Nuclear y Salvaguardias, CNSNS, ESR Encargado de Seguridad Radiologica).  Implemented and introduce new equipment on SMT Lines ,where I went to validate differents types of AOI technologies at USA ( Denver, California, Minnesota ) & Asia ( Japan & South Korea ).  Inspection Engineers & Technicians Supervisor .  Repair personneland 200% Inspectors Supervisor.  Quality SMT , Repair and 200% Inspection Area Responsible.  Physical Inventory responsible with the traceability system. Process Engineer  Perform pre-engineering duties including ordering stencils, deciding build technology and purchasing any fixtures necessary for product build.  Process development which included SMT Machine Programming (GSP solder printers AOI & X-ray), process documentation.  Technicians and Operators supervision.  Optimization and monitoring SMT programs and supporting the production floor, and training to the production personnel.  Evaluation for AOI equipment between three different technologies (VISCOM, AD-1/MD-1 & Orbotech).  Installation of Orbotech Inspection machine. Process & Test Engineer. Solder paste Reflow, Adhesive, Automatic Insertion , Automatic Optical and X- ray Inspection Process ; LASER Marker of bar code on PCBs and designer of fixtures for solder paste printers. Active participation in quality and cost reduction programs with ideas and improvements. Production modifications/adjustments to inspection machines and screen printers machines increase yield reading and reduce the PPM quality outgoing external, lower scrap rate. Technicians and Operators supervision. Data Analysis, Determination root cause and corrective actions. Activities:
  • 2.
     Transfer equipmentand installation of Automatic Inspection machines from Yoshima-Kyodanchi Iwaki, Japan plant to ALCOM Electronicos de Mexico (since November 20th, 2002 to December 1st, 2002).  Implemented and Installed of an Automatic Optical Inspection machine in Alpine Electronics MFG. Of America Inc. Greenwood, Indiana (since January 14th, 2003 to January 19th, 2003).  Validation of an Automatic Optical Inspection machine AD-1 in Alpine Electronics MFG. Of America Inc. Greenwood, Indiana (since September 14th, 2003 to September 19th, 2003).  Validation of an Automatic Optical Inspection machine (AOI), SJ50 AGILENT/Hewlett Packard Technologies at Agilent Technologies in Loveland, Colorado, (Since October 9th, 2003 to October 11th, 2003).  Transfer equipment and installation of X-Ray inspection machine from Alpine Electronics MFG. Of America Inc. Greenwood, Indiana (since February 1st, 2004 to February 7th, 2004) to ALCOM Electrónicos de Mexico. Delphi Delco Electronics September 12th 2000 to January 18th 2002 Surface Mount Process Technical Support. Adhesive, Solder Paste Reflow, Insertion, Automatic Inspection X- Ray Process. Responsiblefor components and materials assemblies, test and evaluation of prototype designs. Implementation of analytical or physical parameter applied to the process and its evaluation. Plan and coordinate automation programs, development and execution.Generate profiles of temperature. Schedule equipment maintenance. Engineering and technical support in and outside the team. Delphi Delco Electronics July,26th 2000 to September,11th 2000 Professional CO-OP. Development projects as improve Profiles of temperature at Reflow Process. Languages Spanish, Native English Write: 90%, Read :90%, Speak:90%. Technical Training and Courses  ANSI/ESD S20.202014 Training July , 2015  MIRTEC AOI Programming South Korea , April 2012  SPI ( Solder Paste Inspection ) Koh YoungTraining. Reynosa, Tamps. March , 2012  Radiologic SecurityResponsible Course on SIRSA facility,Mexico City,for Mexican Commission for Radiologic andNuclear Regulation (Comision Nacional de Seguridad Nuclear y Salvaguardias,Encargado de Seguridad Radiologica, ESR Approval No. AOO.200/0232/2009), September ,21st – October , 2nd 2009  SQL Server2005Management MicrosoftCertification Reynosa,Tamps. July,7th – 11 th 2008  Black BeltSixSigmaCourse UCEversityfacility, McAllen, Texas, USA July,1st 2006to September,23th 2006  Orbotech Inspection Machine Training Programming And Maitenance Training Reynosa,Tamps.October,2005, by Orbotech SupportEngineer.  YVP-Xg YAMAHA Solder Printer Programming and Maintenance Training. Reynosa,Tamps. June, 2004 , by Yamaha SupportEngineers From Japan.  X-Ray Inspection machine CXI 3600-3633 Nicolet Greenwood ,Indiana ; February,April, 2004  Automatic Inspection machines (AOI) AD-1/MD-1. Iwaki, Japan ; November – December 2002.  LASER Marker of bar codes on PCBs machine Iwaki, Japan; November – December 2002.  Siemens automated equipment: HS50, 80S20, 80S15, 80F3, 80F4; Reynosa, Tamps; December 2000 – May 2000  ISO 9000 Concepts  ISO/TS 16949:2002 Concepts  IPC Concepts  Problem Analysis Solving  Lean Manufacturing concepts  5’s  ESD  Management Personal (Supervisors training) by Narro y Asociado  Repair Machine ERSA IR550 Computer Skills Windows Office, Lotus Notes, GC Place, Microsoft SQL 2005, UNIX Concepts, Network Concepts, MINITAB 14.2