This document discusses the components and working of semiconductor wafer handlers. It describes the front end which includes carriers, load ports, and interfaces and the back end which includes robots and sensors. It also explains the overhead transport system, different types of robots used, and calibration processes to test the accuracy and uptime of the handler system.

1. Handlers
Semiconductor Wafer
Handling
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2. Introduction
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3. HCL Technologies

4. Purpose
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5. Components
Front End
 Foup / Carrier / Cassette
 Load Port
 Interface
Back End
 Robots
 Sensors
- Power Cut Sensor
- Slot Count Sensor
- Load Port Sensor
 Pre-Aligner
 Stage
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6. Wafer
HCL TechnologiesWafer

7. Foup / Carrier / Cassette
Carrier
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Carrier

8. Overhead Transport System
Overhead Transport HCL Technologies

9. Robots
Frogleg Robot Leapfrog Robot Quadra Robot
Pre-Aligner Robot
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10. Working
Recipe
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11. HCL Technologies
Working Demo

12. Front End
EFEM
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13. Carrier
Contains Contains
Wafer
Handler’s Input
Overhead
Transport
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14. Back End
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15. HCL Technologies
Backend Demo

16. Calibration & Testing
 Vibration Test
 Up Time of Handler System
 Robot’s Accuracy
 Sensors Test
 Auto Calibration
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17. References
 www.Kensigtonlaboratories.com
 www.SEMI.org
 www.wafercare.com
 Owens Instruments
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18. THANK YOU !!
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