This document discusses fundamentals of cutting processes. It explains that knives are used to cut apples because they are harder and sharper than the apple, while tungsten carbide or diamond tools are used to cut harder metals like steel. It also discusses common machining operations like turning, milling and drilling which remove material. These operations require setting the depth of cut, feed rate and cutting speed. The document classifies machine tools and describes zones of heat generation and dissipation during cutting. It discusses tool wear and factors considered in rating machinability like tool life, forces, surface finish and material removal rate.

1. FUNDAMENTALS OF CUTTING
M.PALANIVENDHAN
ASSISTANT PROFESSOR
DEPARTMENT OF
AUTOMOBILE ENGINEERIN
SRM UNIVERSITY

2. What Do We Use To Cut A Apple ?

3. Which Tool?
Scale
Knife

4.  Knife is Harder
 Knife is Sharper
 It is used to cut, with ease
i.e Approach Angle

5. What Do We Use To Cut Steel or Cast
Iron or Stainless Steel?
 Tungsten Carbide – Since it’s harder than
most of the materials.
Diamond is hardest than all other materials.

6. What is Common in this Process?
Turning
Milling
Drilling
Grinding

7. These
Operations
have
material
being
removed
What is Common in this Process?

8. What is required for machining?
Depth of Cut - Preset interference between
tool and work piece
Feed - Motion to bring in additional
material for machining
Speed - What generates the basic
wedge and cuts

9. Machine Classifications
 Turning Center or Lathe
 Vertical Machining Centre (VMC)
 Horizontal Machining Centre (HMC)
 Special Purpose Machines (SPM)

10. Zones of Heat Generation
Shear Zone
Chip Tool Interface
Tool Work
Interface
Work

11. Heat Dissipation
Work
80% Energy is
converted to heat
18% of Energy
is converted to heat
2% of energy
converted to heat

12. TOOL WEAR
 Gradual Tool Wear
– Unavoidable but controllable
 Premature Wear or failure
– Avoidable

13. How Do We Rate Machinability?
 Tool life in minutes
 Cutting forces and Power consumed
 Quality of Surface Finish
 Chip formation
 Material removal rate