Mike Ryland presented the design of a dense memory module connector. Some key points: - The connector uses a tapered beam contact design to uniformly distribute stress along the contact length and minimize local stress concentrations. Simulation found the design can withstand the target 5.3 gram normal force per contact. - Prototypes of the tapered beam contacts were manufactured and tested, showing the design had minimal permanent deformation after a 0.015mm deflection. - The complete DMM module design houses the pin-socket-BGA interconnect array and includes features for thermal management within a 1U chassis. - Tolerance analysis and simulations were performed to validate the design could meet requirements with the expected variances

1. Engineering Presentation
By
Mike Ryland

2. ABOUT ME
• Graduated from CSUN in 2004 (B.S.M.E.)
• Core member of CSUN FSAE 2003/04 Race
Team
• 10+ Years experience in New Product
Development
• ProEngineer CREO and Solidworks expert
power user
• Experienced with Aerospace Qualification /
Documentation
• Advanced Interconnect design experience
• Design of custom Military connectors for use
in Harsh Environments (Tactical
Communications)
• Design for Space Applications (1,000,000
cycle RF switches)
• Pursuing M.S.M.E at CSUN (15 of 30 units
completed)

3. Professional Experience
EATON, Camarillo, Ca. 09/2013 to 01/2015 (1 Year, 5 Months)
Senior Product Engineer
HAAS Automation, Oxnard, Ca. 04/2013 to 08/2013 (4 months)
Mechanical Engineer III (R&D)
ISI, Camarillo, Ca. 06/2012 to 04/2013 (10 month contract)
Project Engineer
PTI Technologies, Oxnard, Ca. 07/2008 to 06/2012 (4 years)
Mechanical Engineer
Dow Key Microwave, Ventura, Ca. 09/2006 to 07/2008 (2 Years)
Mechanical Design Engineer
PTI Technologies, Oxnard, Ca. 06/2004 to 08/2006 (2 years, 2 months)
Manufacturing Engineer

4. Certifications
• GD&T per ASME y14.5 1994 - Geometric Learning Solutions
• Solidworks Cosmos Professional - Go Engineer
• Solidworks PDM Jumpstart - Go Engineer
• Solidworks Routing
• Enovia PLM Administrator certifications - Enovia
• Solidworks Advanced Surface Design - Solidworks World
• Solidworks Mold Design / Plastics - Solidworks World
Professional and Personal Development
• Eaton University – Six Sigma
• Eaton University – Project management
• Eaton University – Project Management Certification
• Eaton University – ProLaunch for Project Management
• Eaton University – Feasibility studies
• Eaton University – Influencing and Peer Communication
• Eaton University – Managing Risk in Engineering Project

5. Recent Awards (Eaton)

6. My Engineering Degree

7. GD&T Certification

8. TECHNICAL PRESENTATION
“DENSE MEMORY MODULE”

9. Custom Connector

10. Connector - Card Interface

11. Contact to Pad Alignment Challenge

12. Edge Card Connector Concept Design

13. DMM Connector Configuration

14. DMM Connector Configuration
Top View

15. DMM Connector Configuration
Bottom View (Pin Array)

16. Pin Socket Interconnect Array

17. Pin-Socket-BGA/LGA Array Interconnects

18. DMM Board Thermal Management

19. 1U Chasis and DMM Module Detail

20. Contact Design

21. Contact Design cont.

22. Contact Design cont.

23. Housing Design

24. Housing Design cont.

25. Housing Design cont.

26. Tolerance Analysis

27. Tolerance Analysis cont.

28. Connector Prototype

29. Contact Prototypes

30. Contact Prototypes

31. PERMANENT SET AFTER .015 DEFLECTION

32. MAX RESIDUAL STRESS, K000029902
NORMAL FORCE, BENDING STRESS AND PERMANENT SET

33. MAX STRESS (Uniform Distribution)
 TAPERED BEAM UNIFORMELY
DISTRIBUTES STRESS ALONG THE
LENGTH OF THE CONTACT/BEAM.
 MINIMIZE LOCAL STRESS
CONCENTRATIONS, UTILIZING FULL
LENGTH OF BEAM TO DISTRIBUTE
STRESS.
 NORMAL FORCE 5.3 GRAMS PER
CONTACT
• MAX STRESS/DEFLECTION OCCURS AT STEP 10 OF 26,
1.528 SECONDS INTO THE 4.2 SECOND SIMULATION
USING A PARABOLIC LOADING/UNLOADING CURVE.
• STEPS ARE .042 SECONE INCREMENTS.

34. STRESS DISTRIBUTION (cont).
ANIMATION DEMONSTRATING
ONE COMPLETE CYCLE OF
“LOADING-UNLOADING”
 TAPERED BEAM
UNIFORMELY DISTRIBUTES
STRESS ALONG THE LENGTH
OF THE CONTACT/BEAM.
 MINIMIZE LOCAL STRESS
CONCENTRATIONS,
UTILIZING FULL LENGTH OF
BEAM TO DISTRIBUTE
STRESS.
 NORMAL FORCE 5.3
GRAMS PER CONTACT
• MAX STRESS/DEFLECTION OCCURS AT STEP
10 OF 26, 1.528 SECONDS INTO THE 4.2
SECOND SIMULATION USING A PARABOLIC
LOADING/UNLOADING CURVE.
• STEPS ARE .042 SECONE INCREMENTS.

36. REACTION FORCE (X) MOMEMT = 5.3 GRAMS

38. MAX FIBRE/SURFACE STRESSES
TENSION (+) AND COMPRRESSIVE (-) STRESSES

39. SETUP AND ASSUMPTIONS
 INPUT CURVE –
LOADING/UNLOADING
CYCLE
 .015 PRESCRIBED
DISPLACEMENT
 NO “FIXED” CONSTRAINTS
WERE USED.
 “ROLLER/SLIDER” AND
REFERENCE GEOMETRY/
SYMMETRY WAS USED TO
MAKE SIMULATIONS AS
REALISTIC AS POSSIBLE.

40. Solder Tab K000029903
STRESS ANALYSIS

41. DEFLECTION

42. DEFLECTION (Cont)

43. STRAIN

44. Final DMM Module

45. Questions