This document provides specifications for a 5050RGBX-XX chip-on-top SMD type LED. It includes dimensions, materials used, electrical and optical characteristics, maximum ratings, bin codes, and CIE chromaticity coordinates for different color temperatures including cool white, natural white, warm white and warm lighting. The LED has a size of 5.5x5.0x1.6mm and contains four chips of red, green, blue and white colors packed inside a silicone resin cavity.
This document provides specifications for a chip-on-top SMD type LED called the XT1511-RGBX-XX. It includes details on the dimensions, materials, electrical and optical characteristics, applications, maximum ratings, and color bin specifications. The LED has a 5.5x5.0x1.6mm package size and contains 4 chips that can produce red, green, blue, and white light. It is intended for uses such as light strips, channel letters, and backlighting.
This document provides specifications for the SK6805 integrated light source LED. It includes details on the product overview, main applications, descriptions, dimensions, pin configurations, electrical parameters, data transmission methods, and packaging standards. The SK6805 is an LED with an integrated control circuit that allows for intelligent control of individual pixels in applications such as full color LED strips and screens. It has a 5.5x5.0x1.6mm package and operates from 3.5-5.5V while providing high brightness, scattering angle, consistency, and long life.
This document provides the specifications for the SK6812-P6 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, descriptions, dimensions, pin configurations, electrical parameters, data transmission methods, and packaging standards. The LED has integrated control circuitry and RGB chips in a single SMD package to provide intelligent control of pixels with uniform color mixing. It is suitable for applications such as full color LED strips and modules.
This document provides specifications for the SK6812MINI integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, dimensions, pin configurations, electrical parameters, timing diagrams, data transmission methods and structure, application circuits, performance graphs, and packaging standards. The LED has integrated control circuitry and RGB chips to allow for intelligent control of color and brightness at the pixel level through a digital interface.
This document provides specifications for the SK6812 integrated light source LED. It includes details on the product such as its dimensions, pin configuration, electrical parameters, typical application circuit, and packaging standard. The SK6812 features an integrated control circuit and RGB chips in a single SMD package. It uses a uni-polar NRZ data protocol for cascading multiple pixels in a line. Precautions are provided for storage, cleaning, and reflow soldering to protect the LED.
This document provides specifications for a chip-on-top SMD type LED called the XT1511-RGBX-XX. It includes details on the dimensions, materials, electrical and optical characteristics, applications, maximum ratings, and color bin specifications. The LED has a 5.5x5.0x1.6mm package size and contains 4 chips that can produce red, green, blue, and white light. It is intended for uses such as light strips, channel letters, and backlighting.
This document provides specifications for the SK6805 integrated light source LED. It includes details on the product overview, main applications, descriptions, dimensions, pin configurations, electrical parameters, data transmission methods, and packaging standards. The SK6805 is an LED with an integrated control circuit that allows for intelligent control of individual pixels in applications such as full color LED strips and screens. It has a 5.5x5.0x1.6mm package and operates from 3.5-5.5V while providing high brightness, scattering angle, consistency, and long life.
This document provides the specifications for the SK6812-P6 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, descriptions, dimensions, pin configurations, electrical parameters, data transmission methods, and packaging standards. The LED has integrated control circuitry and RGB chips in a single SMD package to provide intelligent control of pixels with uniform color mixing. It is suitable for applications such as full color LED strips and modules.
This document provides specifications for the SK6812MINI integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, dimensions, pin configurations, electrical parameters, timing diagrams, data transmission methods and structure, application circuits, performance graphs, and packaging standards. The LED has integrated control circuitry and RGB chips to allow for intelligent control of color and brightness at the pixel level through a digital interface.
This document provides specifications for the SK6812 integrated light source LED. It includes details on the product such as its dimensions, pin configuration, electrical parameters, typical application circuit, and packaging standard. The SK6812 features an integrated control circuit and RGB chips in a single SMD package. It uses a uni-polar NRZ data protocol for cascading multiple pixels in a line. Precautions are provided for storage, cleaning, and reflow soldering to protect the LED.
This document provides specifications for the XT1511RGBX-XX integrated light source LED. Some key details:
- It is a 5.5x5.0x1.6mm top SMD chip-on-top LED with a 0.25 watt power and integrated control circuit.
- The LED has red, green, blue and white color elements that can each be independently controlled through a 32-bit data protocol to mix colors.
- It is designed for applications like full color lights, modules, and displays through its ability to intelligently control individual pixel intensities.
This document specifies the SK6812RGBX-XX integrated light source LED. It includes:
1. Details on the LED's construction as a top SMD chip with integrated control circuit and pixel-level control of color and brightness.
2. Application examples including string lights, pixel screens, and more.
3. Specifications covering electrical characteristics, timing, data transmission, and color properties.
XT1506 have 6pin, which is similar with sk6812, and also very suitable for magic color led project.
Like use in led strip, led project.
bill_xt@Jercio.com
The document provides specifications for the XT1511-5mA integrated light source LED, including:
1) The LED has integrated control circuitry and RGB chips in a single package to form pixels with uniform color mixing.
2) It is suitable for applications like string lights, full color modules, and scene lighting.
3) Key parameters include a maximum forward voltage of 3.5-5.5V, static power consumption under 1mA, and data transmission speed up to 800Kbps.
This document provides specifications for the XT1511 integrated light source LED, including:
- Product overview of the XT1511 smart LED that integrates a control circuit and light emitting circuit.
- Main applications are full color LED lights and displays.
- Mechanical dimensions and pin configurations are provided, along with electrical parameters, timing waveforms, and data transmission methods for controlling multiple LEDs.
This document provides the specifications for the XT9822 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, description, mechanical dimensions, pin configuration, general information, maximum ratings, electrical parameters, feature descriptions, typical application circuit, LED performance graphs, and packaging standard. It also provides application notes on dust and cleaning, moisture proof packaging, storage, reflow soldering characteristics, heat generation, and electrostatic discharge.
This document provides specifications for the SK6822 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, descriptions, dimensions, pin configurations, electrical parameters, timing diagrams, data transmission methods, and packaging standards. The SK6822 is an LED control circuit and light emitting circuit integrated into a single controlled LED source. It uses patented PWM technology to guarantee high consistency in pixel color output.
This document provides the specifications for the SK9822 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, applications, description, dimensions, pin configurations, parameters, features and application notes. The SK9822 is a two-wire transmission LED with integrated control circuit and RGB chips that provides 256 level grayscale and 32 brightness levels of adjustment. Precautions for use include ESD sensitivity, cleaning, moisture protection, storage conditions and heat management during reflow soldering.
The document provides specifications for the XT1511RGB-P8 integrated light source intelligent control chip-on-top SMD type LED. It is a 5.5x5.0x1.6mm top SMD type 0.2Watt power LED with an integrated control circuit and light emitting circuit that controls each lighting element as a pixel. The document outlines its main applications, descriptions, pin configurations, electrical parameters, timing diagrams and typical application circuits.
The document describes the specifications of the SK6812-RGBXP8-XX integrated light source LED chip. It is a 5.5x5.0x1.6mm top SMD type LED with 0.2 watts power. It has an integrated control circuit and light emitting circuit that allows each lighting element to act as a pixel controlled by a digital interface. The LED has low driving voltage, high brightness, scattering angle, good consistency, low power and long life. Main applications include full color LED strings, modules, lighting and electronic displays.
This document provides specifications for the SK6812RGB-P8 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, descriptions, pin configurations, electrical parameters, timing diagrams, data transmission methods, and typical application circuits. The LED has integrated control circuitry, supports 256 level grayscaling, and can be cascaded with data transmission speeds up to 800 Kbps. Proper use requires keeping the LED free of dust and avoiding organic solvents.
This document provides specifications for surface mountable inductors models FSR03 and FSR03-H produced by HT-TECH Corporation. It includes dimensions, electrical parameters, test equipment used, ordering information and packaging details for various inductor part numbers ranging from 0.027uH to 150uH. Tolerances are ±10% for FSR03 and ±30% for FSR03-H. Inductors are supplied in reels of 4,000 pieces per reel and operate from -25°C to 105°C or -25°C to 85°C depending on model.
This document provides specifications for an embedded controller type LED called the EC 15. It is a 1.5x1.5x0.65mm LED that contains an integrated control circuit. The document outlines its product overview, main features, pin configuration, mechanical dimensions, electrical characteristics, reliability testing standards, and cautions for use regarding dust, cleaning, moisture and ESD protection.
These switches are part of the PZ series including models with dia. from 12 to 30mm bushing. Sealed to IP68 or IP69K, easy to clean metal surface, long life (50 million cycles), ring or dot illumination, custom onfigurations
EDISON OPTO 2835 Horticulture series_v3_ENSamson Lin
This document provides specifications for Edison Opto's PLCC Series 2835 0.5W Horticulture LEDs. Key details include:
- The LEDs are intended for indoor plant cultivation applications like vertical farms and greenhouses.
- They offer high intensity and color uniformity to benefit plant growth while reducing cultivation costs.
- The document provides information on electrical and optical characteristics, binning structures, reliability data, and mechanical dimensions.
- Specification tables are given for parameters like wavelength, voltage, viewing angle, and thermal resistance. Characteristic curves illustrate properties like intensity vs. current and voltage vs. temperature.
The document provides specifications for the SK6812-XX integrated light source LED. It describes the LED as a 5.5x5.0x1.6mm top SMD type with 0.2 watts of power and integrated control circuitry. The LED uses pulse width modulation and data forwarding to control color and brightness across cascaded pixels with transmission distances over 10 meters. It provides pinouts, electrical parameters, timing diagrams, application examples, and color temperature ratings.
The anti vandal switch offer attractive, robust and durable switch, available with different bushing diameters(12 ~25mm), actuator shapes, available with LED illumination and engraving, Protection IP65 / IK09.
This anti-vandal switch features a easy clean, aesthetic look for high end products.
Our anti-vandal switches are popular for use in kiosk applications, ticket dispensers and industrial-type applications.
Also comes in black anodized finish.
Generating privacy-protected synthetic data using Secludy and MilvusZilliz
During this demo, the founders of Secludy will demonstrate how their system utilizes Milvus to store and manipulate embeddings for generating privacy-protected synthetic data. Their approach not only maintains the confidentiality of the original data but also enhances the utility and scalability of LLMs under privacy constraints. Attendees, including machine learning engineers, data scientists, and data managers, will witness first-hand how Secludy's integration with Milvus empowers organizations to harness the power of LLMs securely and efficiently.
This document provides specifications for the XT1511RGBX-XX integrated light source LED. Some key details:
- It is a 5.5x5.0x1.6mm top SMD chip-on-top LED with a 0.25 watt power and integrated control circuit.
- The LED has red, green, blue and white color elements that can each be independently controlled through a 32-bit data protocol to mix colors.
- It is designed for applications like full color lights, modules, and displays through its ability to intelligently control individual pixel intensities.
This document specifies the SK6812RGBX-XX integrated light source LED. It includes:
1. Details on the LED's construction as a top SMD chip with integrated control circuit and pixel-level control of color and brightness.
2. Application examples including string lights, pixel screens, and more.
3. Specifications covering electrical characteristics, timing, data transmission, and color properties.
XT1506 have 6pin, which is similar with sk6812, and also very suitable for magic color led project.
Like use in led strip, led project.
bill_xt@Jercio.com
The document provides specifications for the XT1511-5mA integrated light source LED, including:
1) The LED has integrated control circuitry and RGB chips in a single package to form pixels with uniform color mixing.
2) It is suitable for applications like string lights, full color modules, and scene lighting.
3) Key parameters include a maximum forward voltage of 3.5-5.5V, static power consumption under 1mA, and data transmission speed up to 800Kbps.
This document provides specifications for the XT1511 integrated light source LED, including:
- Product overview of the XT1511 smart LED that integrates a control circuit and light emitting circuit.
- Main applications are full color LED lights and displays.
- Mechanical dimensions and pin configurations are provided, along with electrical parameters, timing waveforms, and data transmission methods for controlling multiple LEDs.
This document provides the specifications for the XT9822 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, description, mechanical dimensions, pin configuration, general information, maximum ratings, electrical parameters, feature descriptions, typical application circuit, LED performance graphs, and packaging standard. It also provides application notes on dust and cleaning, moisture proof packaging, storage, reflow soldering characteristics, heat generation, and electrostatic discharge.
This document provides specifications for the SK6822 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, descriptions, dimensions, pin configurations, electrical parameters, timing diagrams, data transmission methods, and packaging standards. The SK6822 is an LED control circuit and light emitting circuit integrated into a single controlled LED source. It uses patented PWM technology to guarantee high consistency in pixel color output.
This document provides the specifications for the SK9822 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, applications, description, dimensions, pin configurations, parameters, features and application notes. The SK9822 is a two-wire transmission LED with integrated control circuit and RGB chips that provides 256 level grayscale and 32 brightness levels of adjustment. Precautions for use include ESD sensitivity, cleaning, moisture protection, storage conditions and heat management during reflow soldering.
The document provides specifications for the XT1511RGB-P8 integrated light source intelligent control chip-on-top SMD type LED. It is a 5.5x5.0x1.6mm top SMD type 0.2Watt power LED with an integrated control circuit and light emitting circuit that controls each lighting element as a pixel. The document outlines its main applications, descriptions, pin configurations, electrical parameters, timing diagrams and typical application circuits.
The document describes the specifications of the SK6812-RGBXP8-XX integrated light source LED chip. It is a 5.5x5.0x1.6mm top SMD type LED with 0.2 watts power. It has an integrated control circuit and light emitting circuit that allows each lighting element to act as a pixel controlled by a digital interface. The LED has low driving voltage, high brightness, scattering angle, good consistency, low power and long life. Main applications include full color LED strings, modules, lighting and electronic displays.
This document provides specifications for the SK6812RGB-P8 integrated light source intelligent control chip-on-top SMD type LED. It includes details on the product overview, main applications, descriptions, pin configurations, electrical parameters, timing diagrams, data transmission methods, and typical application circuits. The LED has integrated control circuitry, supports 256 level grayscaling, and can be cascaded with data transmission speeds up to 800 Kbps. Proper use requires keeping the LED free of dust and avoiding organic solvents.
This document provides specifications for surface mountable inductors models FSR03 and FSR03-H produced by HT-TECH Corporation. It includes dimensions, electrical parameters, test equipment used, ordering information and packaging details for various inductor part numbers ranging from 0.027uH to 150uH. Tolerances are ±10% for FSR03 and ±30% for FSR03-H. Inductors are supplied in reels of 4,000 pieces per reel and operate from -25°C to 105°C or -25°C to 85°C depending on model.
This document provides specifications for an embedded controller type LED called the EC 15. It is a 1.5x1.5x0.65mm LED that contains an integrated control circuit. The document outlines its product overview, main features, pin configuration, mechanical dimensions, electrical characteristics, reliability testing standards, and cautions for use regarding dust, cleaning, moisture and ESD protection.
These switches are part of the PZ series including models with dia. from 12 to 30mm bushing. Sealed to IP68 or IP69K, easy to clean metal surface, long life (50 million cycles), ring or dot illumination, custom onfigurations
EDISON OPTO 2835 Horticulture series_v3_ENSamson Lin
This document provides specifications for Edison Opto's PLCC Series 2835 0.5W Horticulture LEDs. Key details include:
- The LEDs are intended for indoor plant cultivation applications like vertical farms and greenhouses.
- They offer high intensity and color uniformity to benefit plant growth while reducing cultivation costs.
- The document provides information on electrical and optical characteristics, binning structures, reliability data, and mechanical dimensions.
- Specification tables are given for parameters like wavelength, voltage, viewing angle, and thermal resistance. Characteristic curves illustrate properties like intensity vs. current and voltage vs. temperature.
The document provides specifications for the SK6812-XX integrated light source LED. It describes the LED as a 5.5x5.0x1.6mm top SMD type with 0.2 watts of power and integrated control circuitry. The LED uses pulse width modulation and data forwarding to control color and brightness across cascaded pixels with transmission distances over 10 meters. It provides pinouts, electrical parameters, timing diagrams, application examples, and color temperature ratings.
The anti vandal switch offer attractive, robust and durable switch, available with different bushing diameters(12 ~25mm), actuator shapes, available with LED illumination and engraving, Protection IP65 / IK09.
This anti-vandal switch features a easy clean, aesthetic look for high end products.
Our anti-vandal switches are popular for use in kiosk applications, ticket dispensers and industrial-type applications.
Also comes in black anodized finish.
Generating privacy-protected synthetic data using Secludy and MilvusZilliz
During this demo, the founders of Secludy will demonstrate how their system utilizes Milvus to store and manipulate embeddings for generating privacy-protected synthetic data. Their approach not only maintains the confidentiality of the original data but also enhances the utility and scalability of LLMs under privacy constraints. Attendees, including machine learning engineers, data scientists, and data managers, will witness first-hand how Secludy's integration with Milvus empowers organizations to harness the power of LLMs securely and efficiently.
Unlock the Future of Search with MongoDB Atlas_ Vector Search Unleashed.pdfMalak Abu Hammad
Discover how MongoDB Atlas and vector search technology can revolutionize your application's search capabilities. This comprehensive presentation covers:
* What is Vector Search?
* Importance and benefits of vector search
* Practical use cases across various industries
* Step-by-step implementation guide
* Live demos with code snippets
* Enhancing LLM capabilities with vector search
* Best practices and optimization strategies
Perfect for developers, AI enthusiasts, and tech leaders. Learn how to leverage MongoDB Atlas to deliver highly relevant, context-aware search results, transforming your data retrieval process. Stay ahead in tech innovation and maximize the potential of your applications.
#MongoDB #VectorSearch #AI #SemanticSearch #TechInnovation #DataScience #LLM #MachineLearning #SearchTechnology
Introduction of Cybersecurity with OSS at Code Europe 2024Hiroshi SHIBATA
I develop the Ruby programming language, RubyGems, and Bundler, which are package managers for Ruby. Today, I will introduce how to enhance the security of your application using open-source software (OSS) examples from Ruby and RubyGems.
The first topic is CVE (Common Vulnerabilities and Exposures). I have published CVEs many times. But what exactly is a CVE? I'll provide a basic understanding of CVEs and explain how to detect and handle vulnerabilities in OSS.
Next, let's discuss package managers. Package managers play a critical role in the OSS ecosystem. I'll explain how to manage library dependencies in your application.
I'll share insights into how the Ruby and RubyGems core team works to keep our ecosystem safe. By the end of this talk, you'll have a better understanding of how to safeguard your code.
Ivanti’s Patch Tuesday breakdown goes beyond patching your applications and brings you the intelligence and guidance needed to prioritize where to focus your attention first. Catch early analysis on our Ivanti blog, then join industry expert Chris Goettl for the Patch Tuesday Webinar Event. There we’ll do a deep dive into each of the bulletins and give guidance on the risks associated with the newly-identified vulnerabilities.
Digital Marketing Trends in 2024 | Guide for Staying AheadWask
https://www.wask.co/ebooks/digital-marketing-trends-in-2024
Feeling lost in the digital marketing whirlwind of 2024? Technology is changing, consumer habits are evolving, and staying ahead of the curve feels like a never-ending pursuit. This e-book is your compass. Dive into actionable insights to handle the complexities of modern marketing. From hyper-personalization to the power of user-generated content, learn how to build long-term relationships with your audience and unlock the secrets to success in the ever-shifting digital landscape.
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
Letter and Document Automation for Bonterra Impact Management (fka Social Sol...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on automated letter generation for Bonterra Impact Management using Google Workspace or Microsoft 365.
Interested in deploying letter generation automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Ocean lotus Threat actors project by John Sitima 2024 (1).pptxSitimaJohn
Ocean Lotus cyber threat actors represent a sophisticated, persistent, and politically motivated group that poses a significant risk to organizations and individuals in the Southeast Asian region. Their continuous evolution and adaptability underscore the need for robust cybersecurity measures and international cooperation to identify and mitigate the threats posed by such advanced persistent threat groups.
A Comprehensive Guide to DeFi Development Services in 2024Intelisync
DeFi represents a paradigm shift in the financial industry. Instead of relying on traditional, centralized institutions like banks, DeFi leverages blockchain technology to create a decentralized network of financial services. This means that financial transactions can occur directly between parties, without intermediaries, using smart contracts on platforms like Ethereum.
In 2024, we are witnessing an explosion of new DeFi projects and protocols, each pushing the boundaries of what’s possible in finance.
In summary, DeFi in 2024 is not just a trend; it’s a revolution that democratizes finance, enhances security and transparency, and fosters continuous innovation. As we proceed through this presentation, we'll explore the various components and services of DeFi in detail, shedding light on how they are transforming the financial landscape.
At Intelisync, we specialize in providing comprehensive DeFi development services tailored to meet the unique needs of our clients. From smart contract development to dApp creation and security audits, we ensure that your DeFi project is built with innovation, security, and scalability in mind. Trust Intelisync to guide you through the intricate landscape of decentralized finance and unlock the full potential of blockchain technology.
Ready to take your DeFi project to the next level? Partner with Intelisync for expert DeFi development services today!
Main news related to the CCS TSI 2023 (2023/1695)Jakub Marek
An English 🇬🇧 translation of a presentation to the speech I gave about the main changes brought by CCS TSI 2023 at the biggest Czech conference on Communications and signalling systems on Railways, which was held in Clarion Hotel Olomouc from 7th to 9th November 2023 (konferenceszt.cz). Attended by around 500 participants and 200 on-line followers.
The original Czech 🇨🇿 version of the presentation can be found here: https://www.slideshare.net/slideshow/hlavni-novinky-souvisejici-s-ccs-tsi-2023-2023-1695/269688092 .
The videorecording (in Czech) from the presentation is available here: https://youtu.be/WzjJWm4IyPk?si=SImb06tuXGb30BEH .
Monitoring and Managing Anomaly Detection on OpenShift.pdfTosin Akinosho
Monitoring and Managing Anomaly Detection on OpenShift
Overview
Dive into the world of anomaly detection on edge devices with our comprehensive hands-on tutorial. This SlideShare presentation will guide you through the entire process, from data collection and model training to edge deployment and real-time monitoring. Perfect for those looking to implement robust anomaly detection systems on resource-constrained IoT/edge devices.
Key Topics Covered
1. Introduction to Anomaly Detection
- Understand the fundamentals of anomaly detection and its importance in identifying unusual behavior or failures in systems.
2. Understanding Edge (IoT)
- Learn about edge computing and IoT, and how they enable real-time data processing and decision-making at the source.
3. What is ArgoCD?
- Discover ArgoCD, a declarative, GitOps continuous delivery tool for Kubernetes, and its role in deploying applications on edge devices.
4. Deployment Using ArgoCD for Edge Devices
- Step-by-step guide on deploying anomaly detection models on edge devices using ArgoCD.
5. Introduction to Apache Kafka and S3
- Explore Apache Kafka for real-time data streaming and Amazon S3 for scalable storage solutions.
6. Viewing Kafka Messages in the Data Lake
- Learn how to view and analyze Kafka messages stored in a data lake for better insights.
7. What is Prometheus?
- Get to know Prometheus, an open-source monitoring and alerting toolkit, and its application in monitoring edge devices.
8. Monitoring Application Metrics with Prometheus
- Detailed instructions on setting up Prometheus to monitor the performance and health of your anomaly detection system.
9. What is Camel K?
- Introduction to Camel K, a lightweight integration framework built on Apache Camel, designed for Kubernetes.
10. Configuring Camel K Integrations for Data Pipelines
- Learn how to configure Camel K for seamless data pipeline integrations in your anomaly detection workflow.
11. What is a Jupyter Notebook?
- Overview of Jupyter Notebooks, an open-source web application for creating and sharing documents with live code, equations, visualizations, and narrative text.
12. Jupyter Notebooks with Code Examples
- Hands-on examples and code snippets in Jupyter Notebooks to help you implement and test anomaly detection models.
Nunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdfflufftailshop
When it comes to unit testing in the .NET ecosystem, developers have a wide range of options available. Among the most popular choices are NUnit, XUnit, and MSTest. These unit testing frameworks provide essential tools and features to help ensure the quality and reliability of code. However, understanding the differences between these frameworks is crucial for selecting the most suitable one for your projects.
Salesforce Integration for Bonterra Impact Management (fka Social Solutions A...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on integration of Salesforce with Bonterra Impact Management.
Interested in deploying an integration with Salesforce for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Your One-Stop Shop for Python Success: Top 10 US Python Development Providersakankshawande
Simplify your search for a reliable Python development partner! This list presents the top 10 trusted US providers offering comprehensive Python development services, ensuring your project's success from conception to completion.
Your One-Stop Shop for Python Success: Top 10 US Python Development Providers
5050 rgbw xx rev.03 en(nut)
1. Jercio(Shenzhen)Technology Co.,Ltd.
4th.Floor 2 Building NanFeng Industrial Zone Business Road No.11 ShiLong Community Shiyan Street
Baoan District City ShenZhen TEL:0755-27863413 FAX:0755-27863413
/17 Document No.: XT / 5050RGBX-XX Rev. No.: 031
5050RGBX-XX
SPECIFICATION
CHIP-ON-TOP SMD TYPE LED
Document No.: JX/ 5050RGBX-XX
Model No.: 5050RGBX-XX
Description: 5.5x5.0x1.6mm Top SMD Type 4-chips 0.4 Watt Power
RGBW Flash Color LED
Material: InGaN or AlInGaP Chip Inside
Rev. No.: 03
Date: 2015-11-04
ELECTROSTATIC
SENSITIVE DEVICES
2. Jercio(Shenzhen)Technology Co.,Ltd.
4th.Floor 2 Building NanFeng Industrial Zone Business Road No.11 ShiLong Community Shiyan Street
Baoan District City ShenZhen TEL:0755-27863413 FAX:0755-27863413
/17 Document No.: XT / 5050RGBX-XX Rev. No.: 032
SPECIFICATION OF CHIP ON TOP SMD TYPE LED
Chip on Top SMD LED Light Source
Model: 5050RGBX-XX
These SMD LEDs are packaged in the industry standard CLPP6 package. These high-reliability
and high-brightness LEDs are designed to work in a wide range of environmental conditions and
are ideally suited for use in illumination applications. Their wide viewing angle makes these LEDs
ideally suited for channel letter, or general backlighting and illumination applications. The flat top
emitting surface makes it easy for these LEDs to mate with light pipes. All components are
produced by packing high-performance LED chips and silicon resin with proprietary phosphors.
1. Features and Benefits
. Ideal for LED lighting application to avoid multi-shadows
. Higher heat conductivity for better thermal management
. Provide variable and innovative array LED layout designs and combinations
. Reduce the initial development cost and time
. High lumen-performance per dollar cost
. Lead free reflow solder compatible with RoHS compliant
2. Applications
. Light Strip
. Channel Letter
. Backlight
3. Dimensions and Materials
. Dimensions: 5.5 mm x 5.0 mm x 1.6 mm
. Packages: Top SMD
. Capsulated Resin: Silicone Resin with Aluminate Phosphor
. Electrodes: Ag Plating
. Chips: Total 4 chips packed in a cavity
5.40
+ R
-
1.20 1.20
+ G
-
5.00 1.20
+ B
-
0.70 +
w
0.70-8-
5.00
5.40
1.
6
1+ 2-
3+ 4-
5+ 6-
1.20
7+ 8-
+1 2 - R
+3 4 - G
+5 6 - B
+7 8 - W
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1mm unless otherwise noted
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3. General Information
5050 RGBX –XX
5050: 5.5x5.0x1.6mm
RGBX:
R 620-630NM
G 515-530NM
B 460-470NM
X: W White Color
Y 585-595nm
AX: BW Blue White 5700-7500K NW
Natural White 3800-4500K WS
Warm Sunlight 2700-3200K GW
GOLD White 2400-2700K
Note: Typical CRI for White (2400 K – 7500 K CCT) is 80.
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4. Absolute Maximum
Ratings (Thermal Pad Temperature @25℃)
ITEM SYMBOL
ABSOLUTE MAXIMUM
UNIT
RATING
White 0.072
Power Dissipation
Red/Amber 0.048
Pd W
Green 0.072
Blue 0.072
D.C Forward Current If 20 mA
Pulse Forward Current (*1) Ifp 100 mA
Thermal Resistance , Junction-Case (*2) Rθj-c 230 ℃/W
Reverse Voltage Vr 5 V
Operating Temperature Topr - 20~+65 ℃
Storage Temperature Tstg - 40~+100 ℃
Soldering Temperature (Reflow) (*3) Tsld max.240 < 5sec ℃
*1: Ifp conditions: 1/10 Duty Cycle & 0.1ms for pulse width.
*2: Rth test condition: Mounted on PC Board FR 4 (pad size≥40mm2)
*3: Reflow method: 1.2mm MCPCB from body for 5 seconds not exceeding the recommended
maximum temperature.
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5. Electrical/Optical Characteristics
. Forward Voltage (Thermal Pad Temperature @25℃)
Color SYMBOL
TEST
MIN. TYP. MAX. UNIT
CONDITIONS
White If=20 mA 2.8 3.3 3.6 V
YELLOW If=20 mA 1.8 2.0 2.4 V
VfRed If=20 mA 1.8 2.0 2.4 V
Green If=20 mA 2.8 3.3 3.6 V
Blue If=20 mA 2.8 3.3 3.6 V
. Reverse Current (Thermal Pad Temperature @25℃)
Color SYMBOL
TEST
MIN. TYP. MAX. UNIT
CONDITIONS
White VR=5 V -- -- 5 µA
Yellow VR=5 V -- -- 5 µA
Red IR VR=5 V -- -- 5 µA
Green VR=5 V -- -- 5 µA
Blue VR=5 V -- -- 5 µA
. Luminous Flux (Thermal Pad Temperature @25℃)
Color SYMBOL
TEST
MIN. TYP. MAX. UNIT
CONDITIONS
White If=20 mA 5.0 6.0 -- lm
Yellow If=20 mA 1.0 2.0 -- lm
Red Φv If=20 mA 1.0 2.0 -- lm
Green If=20 mA 3.0 4.0 -- lm
Blue If=20 mA 1.0 2.0 -- lm
. Color Temperature or Dominate Wavelength (Thermal Pad Temperature @25℃)
Color SYMBOL
TEST
MIN. TYP. MAX. UNIT
CONDITIONS
Yellow If=20 mA -- 590 -- nm
Red If=20 mA -- 625 -- nm
λd
Green If=20 mA -- 520 -- nm
Blue If=20 mA -- 465 -- nm
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. Bin Code List For Reference (Thermal Pad Temperature @25℃)
Item Bin Code SYMBOL
TEST
MIN. MAX. UNIT
CONDITIONS
A2 1.8 2.0
RED
A3
Vf If=20 mA
2.0 2.2
A4 2.2 2.4
Forward A5 2.4 2.6
V
Voltage B2 2.8 3.0
BLUE B3
Vf If=20 mA
3.0 3.2
GREEN B4 3.2 3.4
B5 3.4 3.6
Note: Measurement tolerance of the forward voltage: ±0.1V
6. Hue Bin Specification for Yellow、Red、Green、Blue
Name Code λd MIN (nm) λd MAX (nm)
YELLOW
YL1 585 590
YL2 590 595
RED
HR1 620 625
HR2 625 630
BLUE
BL5 460 465
BL6 465 470
PG2 515 520
GREEN PG3 520 525
PG4 525 530
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7. White Color Temperature Ranks & CIE Color Rank (Refer to CIE 1931 chromaticity
diagram)
CIE chromaticity coordinates (ANSI Cool White)
CA X1 Y1 X2 Y2 X3 Y3 X4 Y4
CA 0.305649 0.30617 0.29869 0.31022 0.30422 0.31765 0.31118 0.3136
CB 0.311181 0.3136 0.30422 0.31765 0.30975 0.32508 0.31671 0.32103
CC 0.316713 0.32103 0.30975 0.32508 0.31529 0.33252 0.32225 0.32847
CD 0.322245 0.32847 0.31529 0.33252 0.32082 0.33995 0.32778 0.3359
CE 0.327777 0.3359 0.32082 0.33995 0.32635 0.34738 0.33331 0.34333
ANSI Blue White Color bin structures
Blue White Graph
5700K5850K
0.35
6000K
CE
6350K
0.34
6500K CD
6800K
Y
CC0.33
7500K
CB
0.32
CA
0.31
X0.30 0.31 0.32 0.33 0.34
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CIE chromaticity coordinates (ANSI Natural white)
CA X1 Y1 X2 Y2 X3 Y3 X4 Y4
NA 0.3662 0.3541 0.3578 0.3594 0.3623 0.3666 0.3707 0.3612
NB 0.3707 0.3612 0.3623 0.3666 0.3669 0.3737 0.3753 0.3683
NC 0.3753 0.3683 0.3669 0.3737 0.3714 0.3808 0.3798 0.3754
ND 0.3798 0.3754 0.3714 0.3808 0.3759 0.3879 0.3844 0.3825
NE 0.3844 0.3825 0.3759 0.3879 0.3805 0.3950 0.3889 0.3897
ANSI Natural White Color bin structures
Natural White Graph
0.40 4000K 3900K
4150K
0.39 NE
4200K
ND
0.38
NCY
4400K
0.37
4500K
NB
NA
0.36
0.35
X 0.380.35 0.36 0.36 0.37 0.37 0.38 0.39 0.39 0.40
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CIE chromaticity coordinates (ANSI Warm White)
CA X1 Y1 X2 Y2 X3 Y3 X4 Y4
KA 0.427 0.386 0.420 0.393 0.426 0.399 0.433 0.392
KB 0.433 0.392 0.426 0.399 0.431 0.405 0.438 0.398
KC 0.438 0.398 0.431 0.405 0.437 0.411 0.444 0.404
KD 0.444 0.404 0.437 0.411 0.442 0.417 0.449 0.410
KE 0.449 0.410 0.442 0.417 0.448 0.423 0.455 0.416
ANSI Warm White Color bin structures
Warm White Graph
0.43 2900K 2850K
2800K
3000K
0.42
3100K
KE
KD
Y
KC0.41
3150K
3200K
KB
0.40
KA
0.39
0.42 0.43 0.44 X 0.45 0.46 0.47
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CIE chromaticity coordinates (ANSI Warm Lighting)
CA X1 Y1 X2 Y2 X3 Y3 X4 Y4
GA 0.459741 0.3982 0.4548 0.4045 0.4613 0.4096 0.4662 0.4033
GB 0.466212 0.4033 0.4613 0.4096 0.4677 0.4147 0.4727 0.4084
GC 0.472682 0.4084 0.4677 0.4147 0.4742 0.4198 0.4792 0.4135
GD 0.479152 0.4135 0.4742 0.4198 0.4807 0.4248 0.4856 0.4185
GE 0.485622 0.4185 0.4807 0.4248 0.4872 0.4299 0.4921 0.4236
GA1 0.462676 0.3945 0.4597 0.3982 0.4662 0.4033 0.4693 0.3994
GB1 0.469255 0.3994 0.4662 0.4033 0.4727 0.4084 0.4758 0.4044
GC1 0.475835 0.4044 0.4727 0.4084 0.4792 0.4135 0.4824 0.4093
GD1 0.482415 0.4093 0.4792 0.4135 0.4856 0.4185 0.489 0.4142
GE1 0.488995 0.4142 0.4856 0.4185 0.4921 0.4236 0.4956 0.4192
ANSI Warm Lighting Color bin structures
Golden White Graph
0.43
0.42
Y
0.41
0.40
2500K 2400K
2600K
GE 2300K
2700K GD GE1
GC
GD1
GB
GC1
GA
GB1
GA1
0.39
0.45 0.46 0.47 0.48 X 0.49 0.50 0.51
Color coordinates measurement allowance is ± 0.005
To order specify color temperature ranks, please contact OPSCO Lighting
Holdings LTD. for further information.
Thermal Pad Temperature @25℃ @ 20mA
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8. 1 Optical-Electrical Characteristic Graphs (InGaN)
Typical Relative Luminous Flux vs. Forward Current Forward Voltage vs. Forward Current
150% 150
120%
Lu
mi
no
us
Fl
ux
100%
C
ur
re
nt
(
m
A)
80%
20
60%
N
or
m
ali
ze
d
F
or
w
ar
d
40%
10
20%
0.00
10 15 20 150
1
1.0 2.0 3.0 4.0 5.00 50 0.0
Forward Current(mA) Forward Voltage(V) Tj=25 °C
Thermal Pad Temperature vs. Relative Light Output Wavelength Characteristics
120% R
el
ati
ve
E
mi
ssi
on
Di
str
ib
uti
on
100%
GREENN
or
m
ali
ze
d
Lu
mi
no
us
Fl
ux
100%
BLUE
GW80%
WS
80%
60%
NW
BW60%
40%
40%
20% 20%
0.00
20 40 60 80 100 120
0.00
450 500 550 600 650 700 750 8000 400
Thermal Pad Temperature (T=25°C) Wavelength (nm)
F
or
w
ar
d
C
ur
re
nt
(
m
A)
Thermal Pad Temperature vs. Forward Current
100
80
60
40
20
0
0 20 40 60 80 100 120 Thermal Pad Temperature (°C)
Typical Radiation Pattern 120°
0
30°
60°
90°
90 75 60 45 30 15 0 0.2 0.4 0.6 0.8 1.0
Radiation Angle
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8.2 Optical-Electrical Characteristic Graphs (AlInGaP)
Typical Relative Luminous Flux vs. Forward Current Forward Voltage vs. Forward Current
150% 150
120%
Lu
mi
no
us
Fl
ux
100%
C
urr
en
t(
m
A)
80%
20
60%
N
or
m
ali
ze
d
Fo
rw
ar
d
40% 10
20%
0.00 1
0 10 15 20 30 50 0.0
Forward Current(mA)
1.5 3.0 4.5
Forward Voltage(V) Tj=25 °C
Thermal Pad Temperature vs. Relative Light Output Wavelength Characteristics
N
or
m
ali
ze
d
Lu
mi
no
us
Fl
ux
120% R
el
ati
ve
E
mi
ss
io
n
Di
str
ib
uti
on
100%
100%
80%
Yellow
Red
80%
60%
60%
40%
40%
20% 20%
0.00
20 40 60 80 100 120
0.00
450 500 550 600 650 700 750 8000 400
Thermal Pad Temperature (T=25°C) Wavelength (nm)
F
or
w
ar
d
C
ur
re
nt
(
m
A)
Thermal Pad Temperature vs. Forward Current
50
40
30
20
10
0
0 20 40 60 80 100 120 Thermal Pad
Temperature (°C)
Typical Radiation Pattern 120°
0
30°
60°
90°
90 75 60 45 30 15 0 0.20.4 0.6 0.8 1.0
Radiation Angle
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9. Packaging Standard:
5 0 5 0 R G B W -B W
C A T H O D E ID E N T IF IC A T IO N
T A P E F E E D D IR E C T IO N C A R R IE R T A P E
C O V E R T A P E
R E E L (1 7 8 x 1 2 m m )
(IN N E R 1 0 0 0 p c s L E D M A X )
E S D P O L Y E T H Y L E N E B A G
S M D
P R O D U C T N O .: 5 0 5 0 R G B W -B W
Q U A N T IT Y .: 1 0 0 0 P C S
L o t N o .: L W 2 0 1 4 0 8 1 1 0 2 -1 0
R ):6 2 0 -6 2 5 N M
G ):5 2 0 -5 2 5 N M
B ):4 6 5 -4 7 0 N M
B W ):6 0 0 0 -6 8 0 0 K
D A T E :2 0 1 4 -0 8 -1 2
L A B E L S K E T C H IN G
The reel pack is applied in SMD LED. The LEDs are packed in cardboard boxes after packaging in normal or anti-
electrostatic bags. cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. The
boxes are not water resistant and therefore must be kept away from water and moisture.
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TOP SMD LED Application Notes
1. Features
The Purposes of making the customers and users to have a clear understanding on the ways how to use the
LED.
2. Description
Generally. The LED can be used the same way as other general purposed semiconductors. When using the TOP SMD
LED, the following precautions must be taken to protect the LED.
3Cautions
3.1. Dust & Cleaning
This emitter has a silicone surface, There are many benefits to the silicone surface in terms of optical properties and improved
reliability. However, silicone is a softer material and prone to attract dust. While a minimal amount of dust and debris on the LED
will not cause significant reduction in illumination, steps should be taken to keep the emitter free of dust.
These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies in an
enclosed area after installing the emitters.
Surface condition of this device may change when organic solvents such as trichloroethylene or acetone were applied.
Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs. When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin of not.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasonic cleaning on the LEDs
depends on factors such as ultrasonic power. Baking time and assembled condition. Before cleaning, a pre-test should be
done to confirm whether any damage to the LEDs will occur.
3.2. Moisture Proof Package
In order to avoid the absorption of moisture during transportation and storage, LED are packed in the aluminum envelop, A
desiccant is included in the aluminum envelop as it absorbs moisture. When moisture is absorbed into the AMT package it
may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and
damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to
a minimum in the package.
3.3. Storage
In order to avoid the absorption of moisture, It is recommended to store SMD LED (in bulk or taped) in the dry box (or
the desiccator ) with a desiccant, Otherwise to store them in the following environment as recommended.
a. Temperature: 5℃~30℃ b. Humidity: 60% RH Max
It is recommended to solder the LED as soon as possible after unpacking the aluminum envelop, But in case that the
LED have to be left unused after unpacking envelop again is requested.
The LED should be soldering within 1 hours after opening the package. If
baking is required, A baking treatment should be performed as follows:
70℃±5℃ for more than 24 hours.
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3.4. Reflow Soldering Characteristics
In testing, Has found S50 LEDs to be compatible with JEDEC J-STD-020C,using the parameters listed below. As a
general guideline recommends that users follow the recommended soldering profile provided by the manufacturer of
solder paste used.
Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs
and Configurations of reflow soldering equipment.
Critical Zone TL to TP
amp-up
L L
(°C
) s max
Te
mp
era
tur
e MIN
Ramp down
ts
(Preheat)
T 25°C to Peak
Times
Profile Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Ts max to Tp ) 3℃/second max. 3℃/second max.
Preheat: Temperature Min (Ts min) 100℃ 150℃
Preheat: Temperature Min (Ts max) 150℃ 200℃
Preheat: Time ( ts min to ts max ) 60-120 seconds 60-180 seconds
Time Maintained Above: Temperature (TL) 183 ℃ 217 ℃
Time Maintained Above: Time (t L) 60-150 seconds 60-150 seconds
Peak/Classification Temperature (T P) 215 ℃ 240 ℃
Time Within 5℃ of Actual Peak Temperature ( tp) <10 seconds <10 seconds
Ramp-Down Rate 6℃/second max. 6℃/second max.
Time 25 ℃ to Peak Temperature <6 minutes max. <6 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
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3.5. Heat Generation
Thermal design of the end product is of paramount importance. Please consider the heat generation of
the LED when making the system design. The coefficient of temperature increase per input electric
power is affected by the thermal resistance of the circuit board and density of LED placement on the
board, as well as components. It is necessary to avoid in tense heat generation and operate within the
maximum rating given in this specification. The operating current should be decided after considering
the ambient maximum temperature of LEDs
3.6. Electrostatic Discharge & Surge Current
Electrostatic discharge (ESD) or surge current (EOS) may damage LED.
Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever
handling of LED. All devices, equipment and machinery must be properly grounded.
It is recommended to per form electrical test to screen out ESD failures at final inspection. It is
important to eliminate the possibility of surge current during circuitry design.
3.7. Other
Can not take any responsibility for any trouble that are caused by using the LEDs at conditions
exceeding our specifications.
These LEDs are designed and manufactured for standard applications such as electric home
appliances, communication equipment, office equipment, electronic equipment and so on.
It is recommended to consult us in advance if user’s application requires any particular quality or
reliability which concerns human life. Examples would be medical equipment, aerospace applications,
traffic signals, safety system equipment and so on.
Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating
when using the LEDs with matrix drive.
The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
The formal specification must be exchanged and signed by both parties before large volume purchase
begins. The appearance and specifications of the product may be modified for improvement without
notice.
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Change History
FCN No. Date Rev. No. Changes/Reason of changes
2014-10-07 01 Initial Document
2014-12-22 02 Modifying dimensions
2015-11-04 03 Parameter correction
Items Signatures Date
Note
Prepared by Kevin Zhu 2015-11-04
Checked by
Approved by
FCN#