With the fast technological progress of sensors, processors, operating system and AI, more and more data are generated and processed. Cloud computing is usually the 1st choice for such tasks, however, cloud computing does have many limitations, like real-time processing, security, scalability etc. Cloud needs to work together with the end point to achieve the best result. in the presentation, I will introduce the concept, example and progress of edge computing, as well as the challenges we are facing to push more computing and analytics to the edge.
Los números que usamos provienen de los algoritmos arábigos, los cuales fueron popularizados por los árabes aunque su origen se remonta a los fenicios. Estos algoritmos representan ángulos, con 1 siendo un ángulo, 2 siendo dos ángulos, y así sucesivamente hasta 9 ángulos. El cero representa cero ángulos.
With the fast technological progress of sensors, processors, operating system and AI, more and more data are generated and processed. Cloud computing is usually the 1st choice for such tasks, however, cloud computing does have many limitations, like real-time processing, security, scalability etc. Cloud needs to work together with the end point to achieve the best result. in the presentation, I will introduce the concept, example and progress of edge computing, as well as the challenges we are facing to push more computing and analytics to the edge.
Los números que usamos provienen de los algoritmos arábigos, los cuales fueron popularizados por los árabes aunque su origen se remonta a los fenicios. Estos algoritmos representan ángulos, con 1 siendo un ángulo, 2 siendo dos ángulos, y así sucesivamente hasta 9 ángulos. El cero representa cero ángulos.
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive functioning. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms.
11. 台北富邦銀行 朱玉君 於 2012/1/9 下午 06:27:51 下載. 拓墣產研 版權所有,未經授權,不得轉載。
Silicon Interposer
TSMC CoWoS(Chip on Wafer on Substrate) Flow:
DRAM DRAM
Front-side Chip on Wafer Bonded Chip on
Process & Thinning Final
Logic
Wafer Interposer Substrate
TSV & Backside Test
Bonding Dicing Bonding
Formation Process
Source: TSMC;拓墣產業研究所整理,2012/01 11