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How to Develop
Qualification Programs
for Lead Free Products
               by

          Mike Silverman
         Managing Partner
          Ops A La Carte
      mikes@opsalacarte.com
       www.opsalacarte.com
          (408) 472-3889
Abstract
There are significant reliability uncertainties around
Lead-Free Solder.

Even if your product does not need to be compliant,
the materials and processes that make up your
product are changing.

As one major consumer product team concluded,
“doing nothing would double the field failure rate of
the electronics.”

This implies that we must do more than just change
solder and components when transitioning in order to
achieve good reliability. We must also review the
design.
Abstract

During this time of rapid transition, there is a
significant new body of knowledge to
understand in order to determine the areas
of greatest risk to the reliability of your
product.

Once we understand the risks, we must then
incorporate this new knowledge into the
redesign of the product.
Abstract

In this presentation, we will highlight a few of
these significant risk areas and show how
techniques such as HALT and ALT can
assure that the transition has been
accomplished successfully from the
perspective of Reliability.
Risks from Temperature
                                                                                                 -55 to 125C,
Effects of Temperature Cycling on Long-                                                         70 minute cycle
Term Reliability of Pb-Free Solder Joints
♦ Can we predict time to failure for Pb-
  free solder joints? YES
♦ So, when should you be concerned?
          Components highly susceptible to
          solder joint fatigue
             •   Large chip resistors,
             •   Ceramic BGAs,
                                                                          10




                                                   SAC life / SnPb life
             •   Leadless ceramic chip carriers,
             •   Non-underfilled CSPs,                                    8
             •   Etc.
          Max solder joint temperature greater                            6         2512 Resistor on FR4 (25 - 80C)
          than 80ºC with dwell times greater
                                                                          4
          than 4 hours
          At least one thermal cycle per day and                          2
                                                                                   Ceramic BGA on FR4 (0 - 100C)
          a desired lifetime of more than 10
          years                                                           0
                                                                               0     100      200     300     400     500

 This slide provided courtesy of DfR Solutions                                             Dwell Time (min)
Risks from Mechanical Loading
                        (Effects of Board Flexing, Shock, and Vibration)


♦ Post-reflow handling
          Increased risk of failure? Conflicting
          results
             • Sensitive to time after reflow
          Some companies moving to restrict board-
          level strain
             • From 1000 to 750 to 500 microstrain
♦ Shock and Drop
          Some degradation in performance                                   3.0E-03
          Board plating seems to play a large role                          2.5E-03
                                                                                                        SnPb




                                                       PWB surface strain
          (SnNi weaker than SnCu)                                                                       SnAgCu
                                                                            2.0E-03
♦ Vibration                                                                 1.5E-03
          SAC worse under low-cycle fatigue, where
                                                                            1.0E-03
          most failures occur
                                                                            5.0E-04

                                                                            0.0E+00
                                                                                  1,000       100,000          10,000,000
                                                                                          Cycles to Failure
 This slide provided courtesy of DfR Solutions
HALT for RoHS at
HALT and HASS Labs



 Pb-Free Results at
Results

♦ 10 Products went through A-B Comparison of Lead
  vs. Pb-Free at HALT & HASS Labs
♦ In all cases, both solder and components were
  changed to Pb Free. Boards went through design
  review and changes to deal with RoHS issues.
♦ Comparison was between products using Pb
  Solder and Pb Components vs. products using Pb
  Free Solder and Pb Free Components. We did not
  include mixed assemblies in this study (if we had,
  conclusions would be different - mixed assemblies have proven to
  produce weaker solder joints, especially with certain package types)
Results

SUMMARY OF FINDINGS:
♦ No Significant Differences in Limits achieved !!
Two Notes of Caution with this statement
1) In all cases, customers had gone through some level of Design
    Review and Design Changes before the HALT – you cannot expect
   same results by just changing components
2) A change of limits from HALT does not always mean a change of
   reliability because acceleration factor is different between Lead &
   Pb-Free. HALT is a means of giving you a good approximation as to
   the change in reliability, but to know the exact change (in terms of
   MTBF), you must conduct a lower acceleration ALT.
Results

Once we have redesigned the product and
re-qualified it using HALT, we can then use
this knowledge to write guidelines for future
products.

There are some generic lead-free design
guidelines that exist, but because this is new
and because of the many variables involved,
most companies are developing their own
and very little public info is available.
HALT for RoHS at
 National Instruments

Pb-Free HALT Results at
RoHS Prototype Builds

♦All real test and measurement products (not
 test vehicles)
   Prototypes to evaluate RoHS impact on design
   and process
   All assemblies HALT tested to failure, inspected,
   and cross-sectioned
   Split builds with RoHS and non-RoHS
   Assemblies for comparison
   Design and process changes made to increase
   robustness
   No new RoHS failure modes but earlier onset of
   failures seen
RoHS Process Highlights

♦Lead-Free Solder used: SAC305 alloy, no
 clean
♦Immersion Silver, RoHS-designed PCBs
♦Max Temperatures Reached: ~ 255C
♦Incoming XRF validation on all parts
RoHS HALT Failure Analysis

♦ Cracked Solder       ♦ PCB Laminate
  Joint: BGA ball to     Cracks – BGA, also
  BGA substrate          called “pad
                         cratering”
RoHS HALT Failure Analysis


♦ Cracked traces to   ♦ BGA pads
  BGA pads – outer      separated from PCB
  rows
RoHS HALT Failure Analysis


♦ Cracks in BGA     ♦ Laminate Cracks -
  Laminate            Repair
RoHS Prototypes: HALT
           Failure Analysis
♦Changes made as a result of FA:
   Enhanced ICT (In Circuit Test) Strain Test
   Process
    • Reduced allowable strain from 1000 to 500 uE
   Restricted choice of PCB laminates
   Widened BGA traces, tear-dropped pads where
   feasible
   Restricted # and types of repair allowed
   Modified receiving processes: Added checks,
   XRF
   Modified manufacturing processes
HALT for RoHS at
      Xantrex


Pb-Free HALT Results at
Objectives
♦HALT products in the following order:
    Consumer product specifications: 0°C to +40°C (<$100).
    Residential product specifications: 0°C to +40°C.
    Portable/Towable product specifications: -10°C to +60°C.
    Programmable product specifications: 0°C to +50°C.
    Vehicle/Distributed product specifications: -25°C to +65°C.
♦Determine robustness of RoHS products.
♦Comparisons done on identical designs.
♦Design issues will be resolved later.


             Note: All HALTs done on a QualMark OVS2.5xLF
                   and OVS3 Typhoon chambers.
HALT Results for
                     175Watt Inverter

♦ Four each Pb-based and RoHS units were compared.
♦ The Pb units died at 5, 15, and 25Grms.



                        Lead         RoHS
         Cold           -40°C        -30°C
         Hot            100°C        90°C
         Rapid        -50°C/80°C   -50°C/80°C
         Vibration     18Grms       22Grms
         Must Meet    -30°C/80°C   -30°C/80°C
         # Units          4            4
HALT Results for
                    100-200Watt Inverters


              Lead       Lead       Lead        Lead        RoHS
Cold          -50°C      -50°C      -20°C      -20°C        -20°C
Hot           90°C       90°C        70°C       79°C        65°C
Rapid       -50°C/80°C -50°C/80°C -20°C/70°C -10°C/75°C   -20°C/60°C
Vibration    6Grms      Not done    5Grms     Not done     23Grms
Must Meet -30°C/80°C -30°C/80°C -30°C/80°C -30°C/80°C -30°C/100°C
# Units         4          4          4          4            4
HALT Results for 1KW Residential
       Inverter/Charger


                Lead       RoHS
  Cold          -20°C      -30°C
  Hot           70°C        70°C
  Rapid       -20°C/60°C -20°C/60°C
  Vibration    28Grms     25Grms
  Must Meet   -30°C/80°C -30°C/80°C
  # Units         4          4
HALT Results for 1KW Residential
       Inverter/Charger


              Lead       RoHS
Cold          -35°C      -50°C
Hot           110°C      100°C
Rapid       -40°C/95°C -40°C/90°C
Vibration   >22Grms     >24Grms
Must Meet   -30°C/80°C -30°C/80°C
# Units        22          2
Some Questions…

♦Any cost increase of RoHS vs Pb parts?
   Less than 5%.
♦Should HALT dwell times change with RoHS?
   No. The air exchange rates are very high.
♦With RoHS, can I use the Pb HASS profile?
   This is dependant on the OL and DL encountered.
   If the same, then yes. If not, then investigate root
   cause and make determination. Recommend
   rerunning life portion of POS.
Next Steps

1) Determine if you are going to transition to
  RoHS
2) Review your environment and assess the
  risks
3) Develop a customized test plan to mitigate
  the risks
4) Carry out the testing and feed the results
  back into the design process

…and of course, we can help you with all of these.
ANNUAL RELIABILITY SYMPOSIUM
                    May 7-11, 2007
                   Santa Clara, CA
1) Design for Reliability (DfR) - Learn the building block tools for reliability during the concept
and design phase. May 7-8

2) Design for Manufacturability (DfM) - Learn what tools are needed to produce great products
with high quality. May 9

3) Design for Warranty Cost Reduction (DfW) - Introduces a proven warranty event cost model
that helps identify warranty cost red. Solutions. May 10

4) Design of Experiments (DoE) - Includes basic statistics behind a DOE as well as a workshop in
which we perform a DOE on a specific product. May 9-10

5) Best Accelerated Reliability Test Methods: HALT, ALT, and RDT – This course will review
each of the best Accelerated Test Methods and show when to use each. Great for those already
familiar with the concepts of HALT as well as those that are newcomers to the field. May 7-8

6) Fundamentals of Climatic Testing - Review the different types of climatic tests—temperature,
humidity, altitude, rain, solar, salt/fog, & more. May 9-10

7) Software Reliability - Highlights “best practices” in S/W Reliability and explains their
application & positive impact to each of the development life cycle phases: Concept, Design,
Implementation, & Testing. May 11
NEW TEST LAB

Ops A La Carte LLC is proud to announce that we now own and operate

HIGHLIGHTS ABOUT

  •   Tested over 500 products in over 50 different industries
  •   Second oldest HALT facility in the world, established in 1995 (originally owned by QualMark)
  •   Most experienced staff with over 50 years of combined experience in HALT and HASS
  •   We only use degreed engineers to run all our HALT.
  •   HALT equipment has all latest technology – only lab in region
  •   Our HALT/HASS services are fully integrated with our other consulting services.
  •   We provide HALT/HASS services on a world-wide basis, using partner labs for tests outside California.




                    990 Richard Ave., Suite 101
                      Santa Clara, CA 95050
                          (408) 654-0499
   HALT and HASS Labs        www.haltandhasslabs.com       Ph: (408) 654-0499         Fx: (408) 255-5789
                          990 Richard Ave., Suite 101, Santa Clara, CA 95050
TEST LAB CAPABILITIES
HALT & HASS Labs adds two more pieces of Reliability Test equipment.

In addition to our two HALT chambers, we now have an electro-dynamic
shaker capable of doing two axis sine and random, and we also have a
Combined Temperature/Humidity chamber. Both chambers add versatility
to the types of reliability tests we can perform.

HERE IS A LIST OF SOME OF THE SPECS WE CAN TEST TO:

                                •   DO160
                                •   IEC
                                •   IEEE
                                •   ISTA/ASTM
                                •   JEDEC
                                •   MIL-STD-810
                                •   SAE
                                •   SEMI
                                •   Telcordia
                                •   and more


  HALT and HASS Labs      www.haltandhasslabs.com       Ph: (408) 654-0499   Fx: (408) 255-5789
                       990 Richard Ave., Suite 101, Santa Clara, CA 95050

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Using HALT for Developing Qualification Programs for Lead-Free Products

  • 1. How to Develop Qualification Programs for Lead Free Products by Mike Silverman Managing Partner Ops A La Carte mikes@opsalacarte.com www.opsalacarte.com (408) 472-3889
  • 2. Abstract There are significant reliability uncertainties around Lead-Free Solder. Even if your product does not need to be compliant, the materials and processes that make up your product are changing. As one major consumer product team concluded, “doing nothing would double the field failure rate of the electronics.” This implies that we must do more than just change solder and components when transitioning in order to achieve good reliability. We must also review the design.
  • 3. Abstract During this time of rapid transition, there is a significant new body of knowledge to understand in order to determine the areas of greatest risk to the reliability of your product. Once we understand the risks, we must then incorporate this new knowledge into the redesign of the product.
  • 4. Abstract In this presentation, we will highlight a few of these significant risk areas and show how techniques such as HALT and ALT can assure that the transition has been accomplished successfully from the perspective of Reliability.
  • 5. Risks from Temperature -55 to 125C, Effects of Temperature Cycling on Long- 70 minute cycle Term Reliability of Pb-Free Solder Joints ♦ Can we predict time to failure for Pb- free solder joints? YES ♦ So, when should you be concerned? Components highly susceptible to solder joint fatigue • Large chip resistors, • Ceramic BGAs, 10 SAC life / SnPb life • Leadless ceramic chip carriers, • Non-underfilled CSPs, 8 • Etc. Max solder joint temperature greater 6 2512 Resistor on FR4 (25 - 80C) than 80ºC with dwell times greater 4 than 4 hours At least one thermal cycle per day and 2 Ceramic BGA on FR4 (0 - 100C) a desired lifetime of more than 10 years 0 0 100 200 300 400 500 This slide provided courtesy of DfR Solutions Dwell Time (min)
  • 6. Risks from Mechanical Loading (Effects of Board Flexing, Shock, and Vibration) ♦ Post-reflow handling Increased risk of failure? Conflicting results • Sensitive to time after reflow Some companies moving to restrict board- level strain • From 1000 to 750 to 500 microstrain ♦ Shock and Drop Some degradation in performance 3.0E-03 Board plating seems to play a large role 2.5E-03 SnPb PWB surface strain (SnNi weaker than SnCu) SnAgCu 2.0E-03 ♦ Vibration 1.5E-03 SAC worse under low-cycle fatigue, where 1.0E-03 most failures occur 5.0E-04 0.0E+00 1,000 100,000 10,000,000 Cycles to Failure This slide provided courtesy of DfR Solutions
  • 7. HALT for RoHS at HALT and HASS Labs Pb-Free Results at
  • 8. Results ♦ 10 Products went through A-B Comparison of Lead vs. Pb-Free at HALT & HASS Labs ♦ In all cases, both solder and components were changed to Pb Free. Boards went through design review and changes to deal with RoHS issues. ♦ Comparison was between products using Pb Solder and Pb Components vs. products using Pb Free Solder and Pb Free Components. We did not include mixed assemblies in this study (if we had, conclusions would be different - mixed assemblies have proven to produce weaker solder joints, especially with certain package types)
  • 9. Results SUMMARY OF FINDINGS: ♦ No Significant Differences in Limits achieved !! Two Notes of Caution with this statement 1) In all cases, customers had gone through some level of Design Review and Design Changes before the HALT – you cannot expect same results by just changing components 2) A change of limits from HALT does not always mean a change of reliability because acceleration factor is different between Lead & Pb-Free. HALT is a means of giving you a good approximation as to the change in reliability, but to know the exact change (in terms of MTBF), you must conduct a lower acceleration ALT.
  • 10. Results Once we have redesigned the product and re-qualified it using HALT, we can then use this knowledge to write guidelines for future products. There are some generic lead-free design guidelines that exist, but because this is new and because of the many variables involved, most companies are developing their own and very little public info is available.
  • 11. HALT for RoHS at National Instruments Pb-Free HALT Results at
  • 12. RoHS Prototype Builds ♦All real test and measurement products (not test vehicles) Prototypes to evaluate RoHS impact on design and process All assemblies HALT tested to failure, inspected, and cross-sectioned Split builds with RoHS and non-RoHS Assemblies for comparison Design and process changes made to increase robustness No new RoHS failure modes but earlier onset of failures seen
  • 13. RoHS Process Highlights ♦Lead-Free Solder used: SAC305 alloy, no clean ♦Immersion Silver, RoHS-designed PCBs ♦Max Temperatures Reached: ~ 255C ♦Incoming XRF validation on all parts
  • 14. RoHS HALT Failure Analysis ♦ Cracked Solder ♦ PCB Laminate Joint: BGA ball to Cracks – BGA, also BGA substrate called “pad cratering”
  • 15. RoHS HALT Failure Analysis ♦ Cracked traces to ♦ BGA pads BGA pads – outer separated from PCB rows
  • 16. RoHS HALT Failure Analysis ♦ Cracks in BGA ♦ Laminate Cracks - Laminate Repair
  • 17. RoHS Prototypes: HALT Failure Analysis ♦Changes made as a result of FA: Enhanced ICT (In Circuit Test) Strain Test Process • Reduced allowable strain from 1000 to 500 uE Restricted choice of PCB laminates Widened BGA traces, tear-dropped pads where feasible Restricted # and types of repair allowed Modified receiving processes: Added checks, XRF Modified manufacturing processes
  • 18. HALT for RoHS at Xantrex Pb-Free HALT Results at
  • 19. Objectives ♦HALT products in the following order: Consumer product specifications: 0°C to +40°C (<$100). Residential product specifications: 0°C to +40°C. Portable/Towable product specifications: -10°C to +60°C. Programmable product specifications: 0°C to +50°C. Vehicle/Distributed product specifications: -25°C to +65°C. ♦Determine robustness of RoHS products. ♦Comparisons done on identical designs. ♦Design issues will be resolved later. Note: All HALTs done on a QualMark OVS2.5xLF and OVS3 Typhoon chambers.
  • 20. HALT Results for 175Watt Inverter ♦ Four each Pb-based and RoHS units were compared. ♦ The Pb units died at 5, 15, and 25Grms. Lead RoHS Cold -40°C -30°C Hot 100°C 90°C Rapid -50°C/80°C -50°C/80°C Vibration 18Grms 22Grms Must Meet -30°C/80°C -30°C/80°C # Units 4 4
  • 21. HALT Results for 100-200Watt Inverters Lead Lead Lead Lead RoHS Cold -50°C -50°C -20°C -20°C -20°C Hot 90°C 90°C 70°C 79°C 65°C Rapid -50°C/80°C -50°C/80°C -20°C/70°C -10°C/75°C -20°C/60°C Vibration 6Grms Not done 5Grms Not done 23Grms Must Meet -30°C/80°C -30°C/80°C -30°C/80°C -30°C/80°C -30°C/100°C # Units 4 4 4 4 4
  • 22. HALT Results for 1KW Residential Inverter/Charger Lead RoHS Cold -20°C -30°C Hot 70°C 70°C Rapid -20°C/60°C -20°C/60°C Vibration 28Grms 25Grms Must Meet -30°C/80°C -30°C/80°C # Units 4 4
  • 23. HALT Results for 1KW Residential Inverter/Charger Lead RoHS Cold -35°C -50°C Hot 110°C 100°C Rapid -40°C/95°C -40°C/90°C Vibration >22Grms >24Grms Must Meet -30°C/80°C -30°C/80°C # Units 22 2
  • 24. Some Questions… ♦Any cost increase of RoHS vs Pb parts? Less than 5%. ♦Should HALT dwell times change with RoHS? No. The air exchange rates are very high. ♦With RoHS, can I use the Pb HASS profile? This is dependant on the OL and DL encountered. If the same, then yes. If not, then investigate root cause and make determination. Recommend rerunning life portion of POS.
  • 25. Next Steps 1) Determine if you are going to transition to RoHS 2) Review your environment and assess the risks 3) Develop a customized test plan to mitigate the risks 4) Carry out the testing and feed the results back into the design process …and of course, we can help you with all of these.
  • 26. ANNUAL RELIABILITY SYMPOSIUM May 7-11, 2007 Santa Clara, CA 1) Design for Reliability (DfR) - Learn the building block tools for reliability during the concept and design phase. May 7-8 2) Design for Manufacturability (DfM) - Learn what tools are needed to produce great products with high quality. May 9 3) Design for Warranty Cost Reduction (DfW) - Introduces a proven warranty event cost model that helps identify warranty cost red. Solutions. May 10 4) Design of Experiments (DoE) - Includes basic statistics behind a DOE as well as a workshop in which we perform a DOE on a specific product. May 9-10 5) Best Accelerated Reliability Test Methods: HALT, ALT, and RDT – This course will review each of the best Accelerated Test Methods and show when to use each. Great for those already familiar with the concepts of HALT as well as those that are newcomers to the field. May 7-8 6) Fundamentals of Climatic Testing - Review the different types of climatic tests—temperature, humidity, altitude, rain, solar, salt/fog, & more. May 9-10 7) Software Reliability - Highlights “best practices” in S/W Reliability and explains their application & positive impact to each of the development life cycle phases: Concept, Design, Implementation, & Testing. May 11
  • 27. NEW TEST LAB Ops A La Carte LLC is proud to announce that we now own and operate HIGHLIGHTS ABOUT • Tested over 500 products in over 50 different industries • Second oldest HALT facility in the world, established in 1995 (originally owned by QualMark) • Most experienced staff with over 50 years of combined experience in HALT and HASS • We only use degreed engineers to run all our HALT. • HALT equipment has all latest technology – only lab in region • Our HALT/HASS services are fully integrated with our other consulting services. • We provide HALT/HASS services on a world-wide basis, using partner labs for tests outside California. 990 Richard Ave., Suite 101 Santa Clara, CA 95050 (408) 654-0499 HALT and HASS Labs www.haltandhasslabs.com Ph: (408) 654-0499 Fx: (408) 255-5789 990 Richard Ave., Suite 101, Santa Clara, CA 95050
  • 28. TEST LAB CAPABILITIES HALT & HASS Labs adds two more pieces of Reliability Test equipment. In addition to our two HALT chambers, we now have an electro-dynamic shaker capable of doing two axis sine and random, and we also have a Combined Temperature/Humidity chamber. Both chambers add versatility to the types of reliability tests we can perform. HERE IS A LIST OF SOME OF THE SPECS WE CAN TEST TO: • DO160 • IEC • IEEE • ISTA/ASTM • JEDEC • MIL-STD-810 • SAE • SEMI • Telcordia • and more HALT and HASS Labs www.haltandhasslabs.com Ph: (408) 654-0499 Fx: (408) 255-5789 990 Richard Ave., Suite 101, Santa Clara, CA 95050