YINTR21180-Status-of-the-MEMS-Industry-2021_Sample.pdf

From Technologies to Markets
© 2021
From Technologies to Markets
Status of the
MEMS Industry
2021
Market and Technology
Report 2021
Sample

2
2
Status of the MEMS Industry 2021 | Sample | www.yole.fr | ©2021
GLOSSARIES
ADAS: Advanced Driver Assistance System
AF: Auto-Focus
AHRS: Attitude & Heading Reference System
AI: Artificial Intelligence
AR: Augmented Reality
ANC: Active Noise Cancellation
ASIC: Application Specific Integrated Circuit
ASP: Average Selling Price
AUV: Autonomous Underwater Vehicle
BAP: Barometric Air Pressure
BAW: Bulk Acoustic Wave
CAGR: Compound Annual Growth Rate
CIS: CMOS Image Sensor
cMUT: Capacitive Micromachined Ultrasound Transducer
CPU: Central Processing Unit
DLP: Digital Light Processing
DOF: Degree Of Freedom
DPF: Diesel Particulate Filter
DSP: Digital Signal Processing
ECG: ElectroCardioGram
ECM: Electret Condenser Microphone
ESC: Electronic Stability Control
FADEC: Full Authority Digital Engine Control
FBAR: Thin-Film Bulk Acoustic Resonator
GPF: Gasoline Particulate Filter
GPU: Graphics Processing Unit
HMD: Head-Mounted Display
HUD: Heads-Up Display
HVAC: Heating, Ventilation & Air Conditioning
IC: Integrated Circuit
IDM: Integrated Device Manufacturer
IJ: Ink Jet
IMU: Inertial Measurement Unit
IoT: Internet of Things
IP: Intellectual Property
IR: Infra Red
LWIR: Long Wave Infra Red
M&A: Mergers & Acquisitions
MAP: Manifold Air Pressure
MEMS: Micro-Electro-Mechanical System(s)
MIMO: Multiple Input Multiple Output
MOEMS: Micro Opto-Electro-Mechanical System(s)
MOS: Metal Oxide Semiconductor
NDIR: Non-Dispersive Infra Red
NED: Nanoscopic Electrostatic Drive
NPU: Neural Processing Unit
OIS: Optical Image Stabilization
pMUT: Piezo Micromachined Ultrasound Transducer
PVS: Personal Vision Systems
PZT: Lead Zirconate Titanate
RF: Radio Frequency
ROV: Remotely Operated Vehicle
SAW: Surface Acoustic Wave
SNR: Signal to Noise Ratio
SoC: System on Chip
SOI: Silicon On Insulator
TPMS: Tire Pressure Monitoring Systems
UAV: Unmanned Aerial Vehicle
UGV: Unmanned Ground Vehicle
V2X: Vehicle To Everything
VOA: Variable Optical Attenuator
VOC: Volatile Organic Compound
VR: Virtual Reality
WLO: Wafer Level Optics
YoY: Year-on-Year

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• MEMS (micro electro mechanical systems) are semiconductor devices that include moving parts in the µm - mm range
and use a photolithography process for manufacturing. A MEMS sensor converts physical values (such as velocity,
temperature…) into an electric signal.
Supply chain positioning of MEMS sensors:
• MEMS sensor chips are made of silicon (front-end manufacturing), generally assembled with an ASIC chip, and
packaged in first-level packaging (back-end manufacturing). Second-level packaging adds further electronics, robust
housing, and connectors. In this report we only consider first-level packaging’s value, and not 2nd-level,
module value.
• Exceptions: For applications that integrate chips directly in second-level packaging (automotive HVAC or oil, etc),
we consider a theoretical first-level packaging value.
DEFINITIONS
Second-level packaging
(module, transducer, transmitter)
Sensor + ASIC
packaged
Sensor alone or sensor + ASIC chips
(multi-chip packages or monolithic)
First-level packaging: devices
mainly considered for
market forecasts
Systems
(automotive, ex. powertrain)
Front-end Back-end

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APPLICATIONS TRACKED BYYOLE DÉVELOPPEMENT FOR EACH MEMS DEVICE (1/3)
Inkjet heads
Consumer and office
Large/wide format printers -
for graphics and technical
Industrial & printing (digital
press, label, ceramics,
textile..)
Thermal disposable head
Thermal permanent head
Piezoelectric permanent head
Thermal permanent printhead
Thermal permanent printhead
Pressure sensors
Pressure sensors for automotive
Pressure sensors
for industrial
Pressure sensors
for consumer
Pressure sensors for
medical
Pressure sensors
for aeronautics
MAP Power Train
BAP Power Train
Particle Filter (DPF, GPF) Power Train
Fuel Tank Evaporation (EVAP) Power Train
Exhaust Gas Recirculation (EGR) Power Train
Engine Oil Power Train
Automatic Transmission Oil Power Train
TPMS Safety
Brake Booster Safety
Side Airbags Safety
Pedestrian protection Safety
HVAC
Thermal runaway
Process control
HVAC
Transportation
Smart phones &
tablets
Drones
Wearables
Smart homes/buildings
Electronic cigarettes
Blood monitoring invasive
Blood monitoring non-invasive
Respiratory
Smart inhaler
Others
Air Data
FADEC
Hydraulic & others
Si microphones
Consumer Medical Automotive Others
Cellphone
Tablets
Laptops
Wearables
Others (Home Automation, PMP,
Laptop, handheld GPS, PC peripherals,
toys…)
Medical
(Hearing aids)
Automotive
Industrial,
defense, high
end
Accelerometers
Single accelerometers for consumer Accelerometers for automotive
Accelerometers
for medical
Accelerometers for industrial
Accelerometers for
aeronautics
Accelerometers for
defense
Cellphone
Tablets
Gaming
Remote controls
Wearables
Others (Home automation, PMP, Laptop,
handheld GPS, PC peripherals, toys…)
Standalone airbag front sensor
Airbag peripheral sensor
ESC acceleration sensor
Roll over sensing
TPMS
Other: integrated GPS, active suspension,
safety, vibration, EPB
Accelerometer for
pacemakers
Accelerometer for
other healthcare
applications
Seismic - geophones
Antenna stabilization
Industrial vibration monitoring
Inclinometers
Offshore - Directional drilling + survey
GPS aiding, agriculture / mobile mapping
Other industrial applications
AHRS
Navigation
Other aero (vibration
monitoring...)
Missiles, guided
munitions, bombs
Defense stabilization
systems
Navigation and other
defense applications

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5
Gyroscopes
Single Gyroscopes for consumer
Gyroscopes for
automotive
Gyroscopes for industrial
Gyroscopes for
medical
Gyroscopes for aeronautics Gyroscopes for defense
Mobile phone
Mobile phone (OIS)
Tablets
Gaming
Remote controls
Wearables
Others (DSC, PMP, laptop, handheld GPS,
PC peripherals, toys…)
Roll over
ESC gyroscope
GPS navigation
Stabilization systems
GPS aiding - Mobile mapping
ROVs / AUVs navigation for offshore
First responder systems
Drilling
Fall detection
Other commercial applications
Wearables
AHRS for general aviation / backup instrument
Flight control for civil helicopters and aircrafts /
navigation for civil & paramilitary UAVs / Others
Space satellites, spacecraft & skyrockets
Platform stabilization
Missile guidance, Guided munitions /
bombs
Defense UAV & UGV navigation /
control , Others
Magnetometers
Single Magnetometers
for consumer
Magnetometers
for automotive
Cell phones
Tablets
Other consumer
applications (wearables)
Auto
Inertial combos
Consumer accel
gyro combos
Consumer accel
magneto
combos
Consumer 9 DOF
combos
Auto combos
accel gyro
Mobile phone
Tablets
Others
Mobile phone
Tablets
Others
Mobile phone
Tablets
Medical
Others (Wearables, Home
Automation, PMP, Laptop…)
ESC combo,
Rollover
Robotic cars
Optical MEMS
Optical MEMS
for telecom
Optical MEMS for
medical
Optical
MEMS for
industrial
Optical
MEMS for
automotive
Optical
MEMS for
aeronautics
Optical MEMS for
consumer
Optical MEMS
for defense
Switches
VOAs
Others (tunable
filters, optical
benches,
transceivers)
Microspectrometers
HMDs
Adaptive
optics
Digital Cinema
HUDs
LiDAR
HUDs
Home cinema projector
(including laser TV)
Pico projector (stand
alone and embedded)
Office projector
Autofocus
AR
HMDs

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Microfluidics
Microdispensers & drug
delivery
Si biochips
Inhalers
MEMS Micropumps &
Microvalves
Microneedles
PoC testing
Next gen sequencing
& sample preparation
RF MEMS
RF switches for telecom
RF switches for
industrial
Switch for Space RF switches for defense RF MEMS for cellphones
RF switches for base stations
RF switches for small cells
RF switches for ATE & RF
Instrumentation
Redundant matrix
Commutation matrix
Radar & communications
RF switches for
communications
RF switches for radars
BAW filters & duplexers
RF switches (antenna)
Antenna tuners
Oscillators and resonators
Consumer Industrial Automotive
Infrastructure &
telecom
TV, DSLR
Mobile, wearable, IoT
IIoT Automotive
Base stations, servers,
routers,…
Microtips
Microtips & probes
Microtips for AFM
Probes for ATE
Flowmeter
Flow meter
Flow meter for medical and Diagnostics
flow meter for industrial
Environmental MEMS
Humidity Gas
Combos (multi-gas, humidity,
temperature, pressure)
Humidity for automotive
Humidity for consumer
Humidity for industrial
Chemical MEMS / Gas
sensor
Environmental hub
Others
Microstructures, microvalves
Ultra sonic fingerprint
Microspeaker
Thermal sensing/imaging MEMS
Thermopiles 1-4 pixels
Thermopile arrays - 1x8 to
64x80 pixels
Microbolometers for
automotive
Microbolometers for industrial Microbolometers for defense
Microbolometers for
consumer
Wearable (spot
thermometer)
Medical
Industrial T measure, gas & fire
detection, HVAC, smart buildings
Night vision
Firefighting, maritime, surveillance,
thermography, PVS, Predictive
maintenance, building, process
control
Soldier night vision, weapon sights,
enhanced driver vision, missile seekers
Mobiles, tablets & other
commercial (UAV, EVS, etc..)

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Glossaries 2
Definitions 3
Applications tracked byYole Développement
for each MEMS device 4
Table of contents 7
Scope of this report 12
Methodologies & definitions 13
About the authors 16
Companies cited in this report 18
What we got right, what we got wrong 19
Yole Group of companies related analyses 20
How to use our data? 24
3-Page summary 25
Executive summary 29
Context 72
• Semiconductors in the time of COVID-19 73
• The two last years in perspective
• Supply chain
• Some Mems sensors at the heart of the covid-19 pandemic
• Acceleration of pre-existing trends
• End-markets 81
• The Human senses – Sensors to the rescue
• Next consumer electronics revolution?
• Automotive & mobility
• Where are MEMS sensors needed in the car?
• Robotic transportation - Key drivers
• Market dynamics : global medical technology market
• MEMS in the medical field
• Healthcare megatrend: the changes are beneficial to the MEMS
industry
• Chronic diseases, addictions…and many more
• Medical applications
• Industrial applications
• Main trends in telecom & infrastructure
• 2020 estimated military budget by country (TOP 10)
• Semiconductors for the soldier of the future
• Defense and aerospace end-system trends
• Electronic megatrends accelerating MEMS adoption
TABLE OF CONTENTS
Part 1/5

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Market forecasts 103
• Forecasts by end-market 104
• Global MEMS forecasts by end market (by volume & value)
• Consumer (by volume & value)
• Automotive (by volume & value)
• Industrial (by volume & value)
• Medical (by volume & value)
• Telecom (by volume & value)
• Defense & aerospace (by volume & value)
• MEMS market dynamics by end-market
• Market share (by value) of the 6 main MEMS markets
• The best growth opportunities in each market (by device type)
• Forecasts by device 119
• MEMS market forecasts by device (by volume & value)
• Inkjet heads (by volume & value)
• Pressure (by volume & value)
• Microphone (by volume & value)
• Accelerometer (by volume & value)
• Gyroscope (by volume & value)
• Magnetometer (by volume & value)
• Inertial combos (by volume & value)
• Optical (by volume & value)
• Thermal imaging/sensing (by volume & value)
• Si-microfluidic (by volume & value)
• RF (by volume & value)
• Oscillators (by volume & value)
• Environmental (by volume & value)
• Future (by volume & value)
• MEMS market dynamics by device
• Wafer starts
• Wafer starts – volume detail
• Analysis
Market trends 148
• New products
• MEMS inkjet printheads
• Pressure MEMS - Consumer trends
• Outlook for powertrain MEMS pressure sensors
TABLE OF CONTENTS
Part 2/5

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• Scenarios for powertrain MEMS pressure sensors in the long term
• Automotive market
• Microphones market trends
• Microphone and inertial MEMS market trends
• Inertial MEMS market trends
• Inertial MEMS have gone to Mars
• Two battlefronts for thermal detectors & imagers
• Microbolometer trends (thermography)
• Microbolometer trends - Automotive
• Optical MEMS market trends
• Optical mems: stand-alone mirrors
• Microfluidic Device – Market trends
• BAW Filters – Market trends
• MEMS switching – Market trends
• MEMS Timing – Market trends
• Ultrasound market trends
• MEMS microspeaker market trends
• Environmental Impact of MEMS
• Evolution of sensing?
• Achieving emotion sensing
Market shares & supply chain 181
• Player’s ranking 182
• 2020 mems players rankings
• Top mems player’s technology breakdown
• Business model diversity
• Comments on MEMS players rankings
• Similarity between semicon parent and child
• MEMS foundries ranking
• Foundries map
• MEMS foundries device capabilities
• Comments on foundry players
• Market shares 194
• Mems inkjet heads market shares
• Pressure mems market shares
• Mems microphones market shares
• Mems accelerometers market shares
• Mems gyroscopes market shares
• Mems magnetometers market shares
• Inertial combos market shares
• Optical mems market shares
TABLE OF CONTENTS
Part 3/5

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• Thermopiles market shares
• Microbolometers market shares
• Si microfluidics market shares
• Rf mems market shares
• Mems oscillators market shares
• Ecosystem dynamics 208
• Investments, fundraisings & Ipos of the year
• M&A and partnerships of the year
• MEMS startup recent history
• MUT technology supply chain
• Promising mems players to follow
• Conclusions
Technology trends 216
• General MEMS trends 217
• Manufacturing trends 218
• Thinning roadmap for MEMS devices
• Identified photolithography step COUNT IN MEMS die
manufacturing
• Lithography process
• Lithography process key parameters
• MEMS lithography requirements and trends
• General bonding requirement for MEMS & sensors
• Permanent bonding adoption in MEMS
• Specific bonding requirements/challenges by mems & sensors type
• W2W permanent bonding adoption for MtM devices and capping
• Focus on MEMS 3D integration
• Synthesis
• Device technology trends 230
• PiezoMEMS technologies
• Inkjet Heads - Technology trends
• Pressure MEMS technology trends
• Intelligent TPMS from Melexis
• Intelligent tires
• Inertial sensors technology trends
• Inertial and optical technology trends: MOEMS-based sensor
• Optical mems: micromirrors array
• Optical mems: Stand-alone mirrors
• Optical MEMS: STMicroelectronic’s micromirrors
• Microbolometer technology trends in Automotive
• Microfluidic Device – Technology trends
TABLE OF CONTENTS
Part 4/5

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• RF MEMS – Technology trends
• MEMS Filters - Acoustic filter technology at a turnaround
• MEMS oscillators technology trends
• Mems for optical image stabilization
• MEMS sensor-shift OIS: a future opportunity?
• Mems probe cards
• Environmental MEMS – Gas sensors
• Environmental sensors – Key detection principles
• MUT technology
• Competition and penetration of CMUT & PMUT
• Mems microspeakers: different structures
• New types of MEMS devices? 270
• MEMS based force/touch sensors & haptics
• Energy harvesting
• Xray MEMS
• From sensor to system 275
• Heterogeneous integration: Moving up the signal chain
• Keeping a perfect balance
• More data fed to telematics
• The next phase of growth could come from data insights
• the value chain follows the data flow
• Cloud and edge computing
• Ai is coming down from the cloud and towards the edge
• Type of AI targeted
• EDGE AI Startups related to MEMS
• Conclusions
Outlook 286
• MEMS market dynamics forecast by end-market
• MEMS market dynamics by device
• Evolution of MEMS sensors
• How to revitalize the MEMS Market
• From senses to emotions
• General conclusions
• Outlook
Appendix 294
• Manufacturing process flows
• Reverse Costing ® Structure, Process and Cost Analyses
TABLE OF CONTENTS
Part 5/5

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SCOPE OFTHIS REPORT
Markets MEMS devices Forecasts Players Trends
Forecasts
Units
$US Dollar
Players and ranking Market Trends
Defense & Aerospace
Industrial
Telecommunications
Medical
Consumer
Automotive
Technology Trends
Market shares
Inkjet heads
Pressure
Microphones
Accelerometers
Gyroscopes
Magnetometers
Inertial combos
Optical
Microbolometer
Thermopiles
Si-microfluidics
RF
Oscillators
Microtips
Flowmeters
Environmental (humidity, gas
sensors, env. hubs)
Future (microspeaker,
cMUT/pMUT for medical, pMUT
for ultrasonic fingerprint)
Are your needs
outside the scope
of this report?
Contact us for a customized report:
The objectives of this report are to provide:
o A global view about the future of MEMS
o An understanding of the MEMS markets and
applications (consumer, automotive, industrial,
medical, telecom, and defense & aeronautics)
o MEMS players’ rankings, dynamics and market
shares
o MEMS market data in $M, units, and wafers for
2020 – 2026 and 2019-2026
o A presentation of MEMS market and technology
trends
8’’
Wafers

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METHODOLOGIES & DEFINITIONS
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information

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Dimitrios Damianos, PhD
Dimitrios Damianos is a Senior Technology & Market Analyst, part of the Photonics & Sensing division at Yole Développement (Yole). Based on solid technical expertise in imaging,
sensing, display, lighting, and photonics, Dimitrios oversees the day-to-day production of valuable technology & market reports and custom consulting projects. Dimitrios also serves as a
member of the Custom Project Business Development division (CPBD), supporting the development of strategic projects and following Yole’s leading customers within the
semiconductor industry. Dimitrios regularly presents and delivers keynotes at international conferences and exhibitions. He has also authored and co-authored several technical & market
reports as well as scientific papers in international peer-reviewed journals.Dimitrios holds a BSc in Physics and an MSc in Photonics, both from the University of Patras (GR), and a Ph.D.
in Optics & Microelectronics from the University of Grenoble-Alpes (FR).
Contact: dimitrios.damianos@yole.fr
Biographies & contacts
ABOUT THE AUTHORS
Jérôme Mouly
Jérôme Mouly is Team Lead Analyst in the Sensing & Actuating team within the Photonic & Sensing Division at Yole Développement (Yole). Jérôme manages the expansion of the
technical expertise and market know-how of the team. He actively supports and assists in the development of a dedicated collection of market & technology reports as well as custom
consulting projects. He has conducted more than 100 marketing and technological analyses for industrial groups, start-ups, and institutes in the field of MEMS and sensing technologies.
Jérôme has been also deeply engaged in Yole's finance activities with a dedicated focus on the commercial exploitation of smart system technologies and access to funding opportunities.
Jérôme is regularly involved in international conferences, with presentations and keynotes. Jérôme Mouly earned a Master of Physics degree from the University of Lyon (FR).
Contact: jerome.mouly@yole.fr
Pierre Delbos
Pierre DELBOS is a Technology & Market Analyst in the Photonics & Sensing division at Yole Développement. Pierre is involved in the development of technology and market reports
covering MEMS & sensing technologies, including inertial sensors, microphones, gas sensors and electronic noses. He also collaborates with his team on custom studies for key players in
the MEMS Industry. Pierre is preparing his Microelectronics and Photonics Engineering degree at the Grenoble Institute of Technology PHELMA (Grenoble, France).
Contact: pierre.delbos@yole.fr

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COMPANIES CITED IN THIS REPORT
AAC,AKM,Alps Electric,Amphenol,Ams,Analog Devices,Apple,Arioso,Asia Pacific Microsystems,Aspinity,
Atomica (ex IMT),Audiopixels, Boehringer Ingelheim Microparts, Bosch, Broadcom, Butterfly Network, Canon,
Cartesiam, Colibrys, Collins Aerospace (EX UTC), Cirrus Logic, CSEM, Denso, DRS, Epcos, Epson, First Sensor
Technology, FLIR Systems, Formfactor, Fraunhofer IPMS, Fujifilm Dimatix, Gettop, Goermicro (Goertek), Google,
Hanking Electronics, Hewlett Packard, Honeywell, Imec, InfineonTechnologies, Knowles Electronics, Lynred,
Maxim, Melexis, Memscap, Memsensing, Memsic, Micralyne, Murata, Nxp, Omron, On Semi, Panasonic, Qorvo,
Qualcomm, Raytheon, RF360, Rohm, Samsung, Sensata, Sensirion, Si Time, Silex Microsystems, Silicon Sensing
Systems, Sintef, SMI, Sony, STmicroelectronics, Syntiant, TaiyoYuden,TDK,TE Connectivity,Teledyne Dalsa,Texas
Instruments,TowerSemi,VIS (Vanguard International Semiconductor),VTT,TSMC, UMC, Usound, X-Fab, Xmems,
and more.

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• Strong momentum for pressure MEMS,
thermopiles, microbolometers as well as
cMUT due to the pandemic
• Effects on automotive MEMS were negative,
altough less than what initially expected
• The move toward more intelligence (software,
processing, algorithms and the advent of AI)
on the edge, proven by recent developments
(new products, collaborations, funding,
acquisitions)
WHATWE GOT RIGHT,WHAT WE GOT WRONG
• The effect of covid-19 on 2020 MEMS
shipments and revenues was not negative, as
initially thought.
• Some players’ revenues for 2019 had been
overestimated (Broadcom) and
underestimated (Bosch) which we have now
corrected (associated comments in the
report).We also adjusted NXP’s revenue to
reflect the pure MEMS sensor business (we
consider only 3-axis and 6-axis
magnetometers for eCompass as MEMS)

17
SUPPLY CHAIN
Chip shortage – The reasons
Multiple
reasons to
explain the
chip shortage.
The pandemic prompted chip
factories to start shutting down early
last year. COVID-19 also started a
new way of working: home office for
adults and for children, learning from
home.
When people began working from
home and children were attending
school remotely, it caused a massive
spike in PCs, tablets and consumer
electronics. Stay-at-home orders
drove a surge in consumer
electronics sales.
Severe winter weather in Texas has
forced chip makers to shut down their
factories. A fire at a Japanese chip-
making factory owned by Renesas also
worsened the situation. Taiwan’s worst
drought in decades added pressure to
the global chip shortage.
During the past year, the US-China trade
tensions strengthened the supply chain.
Fears of sanctions prompted tech
companies in China to stockpile chips
and prepare for the worst to protect
against U.S. export restrictions .
Where are my chips?

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ACCELERATION OF PRE-EXISTING TRENDS
Cloud technologies
Industry 4.0
Edge computing
5G technologies
AR/VR
Biometrics
Robotics & Automation
Mobility (electrification,
ADAS,AV, transportation, etc)

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MEMS MARKET DYNAMICS FORECAST BY END-MARKET
Automotive
Industrial
Medical
Telecom
CAGR2020-2026
7.2%
2020
$12.1B
2026
$18.2B
Consumer
Defense & Aerospace
$2.03B
$0.8B
$11.27B
CAGR 7.9%
$2.86B
CAGR 5.8%
$2.1B
CAGR 6%
$0.06B
$0.55B
$7.13B
$1.47B
$1.18B
CAGR 6.7%
$0.72B
CAGR 4.5%
$0.14B
CAGR
16.9%

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MEMS MARKET DYNAMICS BY DEVICE
Pressure
Microphones
Accelerometers
Gyroscopes
Inertial combos
Thermopiles
Microbolometers
Optical
Microfluidics
RF
Oscillators
CAGR2020-2026
7.2%
Revenues 2020: $12.1B
Forecast 2026: $18.2B
Revenues
$M
CAGR19-25
Environmental
Future
Inkjet heads
Magnetometers
$1,134M
$1,381M
$1,503M
$2,050M $584M
$1,768M
$842M
$176M
$530M
$546M
$601M
$199M
$199M
$142M
$72M
$1,871M
5.2%
$2,127M
6%
$4,049M
12%
$481M
-3.2%
$2,362M
4.9%
$967M
2.4%%
$182M
0.6%
$916M
9.5%
$1,363M
16.5%
$753M
3.8%
$395M
12.1%
$338M
9.2%
$385M
18.1%
$204M
19.1%
$1,394M
3.5%

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TOP-30 PLAYERS GROWTH RANKING
RF MEMS
companies
had the
biggest MEMS
business
growths
followed by
thermal
MEMS and
microphones.
Player 2019 2020 YoY
GUIDE IR $ 20 $ 84 331%
SI TIME $ 84 $ 116 38%
QORVO $ 490 $ 672 37%
AAC $ 131 $ 165 26%
FLIR SYSTEMS $ 110 $ 137 24%
MELEXIS $ 61 $ 74 21%
BROADCOM $ 991 $ 1,189 20%
CANON $ 222 $ 264 19%
GOERMICRO $ 400 $ 470 18%
LYNRED (ex-ULIS) $ 101 $ 116 15%
AMPHENOL $ 108 $ 120 11%
INFINEON TECHNOLOGIES $ 305 $ 333 9%
ROBERT BOSCH $ 1,599 $ 1,716 7%
STMICROELECTRONICS $ 604 $ 611 1%
TDK $ 393 $ 397 1%
AKM $ 224 $ 220 -2%
ALPS ALPINE $ 118 $ 114 -3%
EPSON $ 86 $ 82 -4%
RF 360 (Qualcomm+EPCOS) $ 82 $ 77 -6%
ANALOG DEVICES $ 255 $ 238 -7%
KNOWLES ELECTRONICS $ 465 $ 432 -7%
HONEYWELL $ 290 $ 261 -10%
MURATA $ 240 $ 216 -10%
HEWLETT PACKARD $ 493 $ 442 -10%
SENSATA $ 149 $ 132 -12%
TE CONNECTIVITY $ 300 $ 260 -13%
NXP $ 301 $ 260 -14%
COLLINS AEROSPACE $ 120 $ 102 -15%
PANASONIC $ 285 $ 241 -15%
TEXAS INSTRUMENTS $ 595 $ 494 -17% -17%
-15%
-15%
-14%
-13%
-12%
-10%
-10%
-10%
-7%
-7%
-6%
-4%
-3%
-2%
1%
1%
7%
9%
11%
15%
18%
19%
20%
21%
24%
26%
37%
38%
331%
-20% -10% 0% 10% 20% 30% 40%

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MEMS FOUNDRIES RANKING
15%
20%
10%
0%
-14%
-6%
18%
8%
2%
10%
10%
4%
25%
17%
7%
-6%
-3%
10%
-20% -10% 0% 10% 20% 30%
YoY%

23
23
MEMS MICROSPEAKERS: DIFFERENT STRUCTURES
AudioPixels
• Tech: Digital Sound
Reconstruction (DSR) – arrays
of pressure generating drivers
Arioso Systems
• Size: 10mm²
• Up to 120 dB SPC
• Tech:All-Silicon Nanoscopic
Electrostatic Drive (NED)
Sonic Edge
N/A
Principle: modulation of an
ultrasound signal to generate
a high quality sound
xMEMS
• Full bandwidth (20Hz-20kHz)
with flat frequency response at
115dB SPL (sealed)
• Size: 50mm3
• Thickness: <1mm thickness
• Better SPL/mm3
• Tech: Monolithically integrated
piezo-MEMS
Usound
• Size: 4.7mm x 6.7mm
• Width: 1.6 mm
• Up to 74 dB SPC
• Tech: MEMS PZT actuators
with classic membrane on top

24
OPTICAL MEMS STAND-ALONE MIRRORS
Bubble MEMS for LiDAR and AR/VR applications
Bubble MEMS
could be the
next
generation of
packaging for
stand-alone
mirrors.
With a simple planar packaging, it is impossible to have a 180° scanning → limited performances at large scanning angles
OQmented has developed “Bubble MEMS”: a wafer-level packaging
technique, using a spherical vacuum encapsulation. Done in 8” platform.
• Spherical → 180° scanning
• Wafer-level packaging → high volumes
• Vacuum encapsulation
→ no moisture and dust
→ better reliability and lifetime
• Unique Lissajous scanning:
Courtesy of OQmented
Faster
screen
refresh
rate than
normal
scanning
Courtesy of OQmented

25
25
MEMS FOR OPTICAL IMAGE STABILIZATION
The MEMS
OIS
technology
consumes less
power and is
more accurate
than theVCM
OIS
technology.
New option for optical image stabilization: MEMS technology.Two major players → MEMSDrive (China) and Sheba
Microsystems (Canada)
• Five axis:
o Pitch
o Yaw
o Roll
o x/y translation
• Sub-micron accuracy
• In-compensation within10ms
• 100 times less energy consumption
thanVCM OIS (~10 mW)
• 70% smaller thanVCM
• Compatible with SMT, Die-attach
• Three axis:
• Pitch
• Yaw
• Roll
• Submicron accuracy
• 200-500Hz depending on the load
• Low power < 2 mW
Courtesy of MEMSDrive Courtesy of Sheba Microsystems
VCM MEMSDrive
Comparison betweenVCM and
MEMS technology:

26
26
• PiezoMEMS family of products includes, among others sensors and actuators such as inkjet
printheads, BAW, microphones, microspeakers, optical MEMS, MEMS autofocus…
• Experience in piezoMEMS manufacturing is increasing, and we observe some changes in the
industry with PVD, and particularly sputtering techniques becoming the deposition technology of
choice.
TECHNOLOGY TRENDS
PiezoMEMS technologies: trends in the deposition techniques
PVD – Sputtering techniques
Sol-Gel techniques
* Keeping both sol-gel and sputtering techniques in-house
*

27
27
HETEROGENEOUS INTEGRATION: MOVING UP THE SIGNAL CHAIN
Sense &
Digitize
Process Connect Analyze
Predict &
React
S/W,
algorithms
Communications
Challenges for heterogeneous integration (source IRDS 2020):
• Increase sensor performance, signal integrity and system-level
performance while reducing cost
• Integration of different components (MEMS,ASIC, antennas, power
sources, etc) that use different materials and processes under the
same advanced package → SiP type, like its already used?
SIGNAL CHAIN
From Data to Information to Knowledge to Actionable Insights
WB SiP (Stacked Die)
FC SiP
Emergence of new SiP-like packaging technologies will be
required to address the needs for heterogeneous integration
for functional performance and faster time-to-market.
Heterogeneous integration is key Wire Bond
Flip Chip/SMT
Raw, analog
data
From To
Done typically in the cloud

28
28
EVOLUTION OF MEMS SENSORS
MEMS have a
long history
and are
continuously
evolving.
Exciting times
lie ahead with
acceleration of
development,
as sensors
become more
intelligent.
1990 2010 2020
MEMS 1.2
Combos
MEMS 1.0
Stand-alone
2025
20 years 10 years 5 years
MEMS 1.5
Combos in a single
package
MEMS 2.0
Sensor Networks
2030?
Acceleration of development
Technology x market
development
Voice HMI
Automotive
Safety applications
Smartphone boom
MEMS 3.0
Sensing & Actuating
MEMS 2.5
Smart sensors (edge AI)
Robotic
servants
IoT nodes
Wearables boom
Hearables/VPA boom
Autonomous
vehicles
5 years?
Smart
homes
AR/VR
Environmental hubs

29
29
EVOLUTION OF SENSING?
From the first
image sensors
decades ago, to
current gas
sensors, the
capabilities of
sensors are ever
evolving.
We still have yet
to see taste
sensors, but
emotion sensing
has already
appeared.
1990 2010 2020
See
Hear
2025
20 years 10 years 5 years
Touch
2030?
Acceleration of development
Technology x market
development
5 years?
6th Sense:
Emotion??
-CMOS image
sensor
-Microphones
-Microspeakers
-Touchscreen
-Inertial
The next dimension for consumer/mobile/
IoT devices → add more senses
Smell
Taste?
-Environmental
-Gas
-E-nose

30
Contact our
SalesTeam
for more
information
30
Contact our
SalesTeam
for more
information
LiDAR for Automotive and
Industrial Applications 2020
Gas and Particle Sensors –
Technology and MarketTrends
2021
MEMS Pressure Sensors -
Technology and MarketTrends
2021
5G's Impact on RF Front-End and
Connectivity for Cellphones 2020
Wearables for Consumer and
Medical markets 2020
YOLE GROUP OF COMPANIES RELATED ANALYSES
Yole Développement

31
Contact our
SalesTeam
for more
information
31
Contact our
SalesTeam
for more
information
Analog Devices High-End
Accelerometers and Gyroscopes
Comparison
YOLE GROUP OF COMPANIES RELATED ANALYSES
System Plus Consulting
Consumer MEMS Microphones
Comparison 2020

32
Yole Group of Companies, including Yole Développement,
System Plus Consulting and PISEO, are pleased to provide
you a glimpse of our accumulated knowledge.
We invite you to share our data with your own network,
within your presentations, press releases, dedicated
articles and more, but you first need approval from Yole
Public Relations department.
If you are interested, feel free to contact us right now!
We will also be more than happy to give you updated data
and appropriate formats.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: leroy@yole.fr
HOWTO USE OUR DATA?

33
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