5. Filtek™ Z250 Universal Restorative
Indications
Direct anterior and posterior
restorations
Sandwich technique with glass
ionomer resin material
Cusp buildup
Core buildup
Splinting
Indirect anterior and posterior
restorations including inlays, onlays
and veneers
A visible-light activated, radiopaque,
composite designed for use in both
anterior and posterior restorations.
6.
7. Filtek™ Z250 Universal Restorative
Features (continued)
Available in syringes or capsules Refill Shades
A1 C2
A2 C3
A3 C4
A3.5 D3
A4 Incisal
B.05 Universal Dentin
B1
B2
B3
8. Filtek™ Z250 Universal Restorative
Features
Lowest polymerization shrinkage
of leading competitors
– Puts less stress on the tooth
– Potentially helps reduce
sensitivity
Volumetric Shrinkage
9. Filtek™ Z250 Universal Restorative
Features (continued)
Ideal customer-defined
handling
Resistance to slumping,
allowing for easy occlusal
contouring prior to curing
Ideal flow and viscosity make
it suitable for posterior
restorations
Non-sticky consistency
20. 3 out of over 1,400 restorations
were reported to exhibit
post-operative sensitivity
This confirms that using self-etch Adper Prompt adhesive
results in very low incidence of patient sensitivity.
21. Adper™ Prompt™ Self-Etch Adhesive
Post-op Sensitivity
Self-etching for very low incidence of post-operative sensitivity
Global clinical evaluation: Only three out of over 1,400
restorations were reported to exhibit post-operative
sensitivity
Self-etching eliminates need to use a “moist” bonding
technique, reducing technique sensitivity associated with
many one-bottle adhesives
24. Adper Prompt Self-Etch Adhesives: Strengths
• Self-etch for low post-operative sensitivity
– 3/1400 restorations sensitive in application test
• Pedodontics- with compomers or composites.
– Especially primary teeth
• Ease of application versus total etch (technique
sensitive)
versus other self-etch
25. Adper Prompt
• Less technique sensitive than other adhesives
– Moist or dry environment
• Improved chemistry
– Adhesive company - 3M ESPE synergy
– More aggressive enamel etch than Clearfil SE
– Higher microtensile bond strengths to cut enamel than
Clearfil SE
– Improved dentin bond strengths to current Prompt