1. The document summarizes several automation projects including semiconductor lifecycle evaluation, sapphire crystal growth automation, and SAW data evaluation. 2. For the sapphire crystal growth project, it describes the control algorithm used to automate pulling speed and position based on load cell weight measurements of the crystal. 3. It also summarizes the development of a lifecycle evaluation system that reduced measurement time through an improved evaluation algorithm based on Weibull distribution modeling.

1. 【【 Resume Slide on Automation ProjectResume Slide on Automation Project 】】
SCADA Basis Automation SystemSCADA Basis Automation System
Jul. 9Jul. 9thth
, 2015, 2015
Tomoya ItoTomoya Ito

2. A. Examples of Automation Projects lead.
- 1. Semiconductor Life Cycle
- 2. Sapphire Crystalize Automation, Trial experiment
- 3. SAW Evaluation, Tool for Data Mining
(B. Reference) will be added.

3. Wire Conne c tion, Sys te m Configuration '2005/ 3/ 16 Planne d
ⒸLX4411B
Ⓑ型式不
ⒶLX4411B
ⓂLX4411B
Ⓖセ
ⒹLX4411B
ⒺLX4411B
ⒻLX4411A
ⒼLX4411A
スイッチ
基盤
P C
OUT BOX
ⓁLX4411B
ⒿLX4411B
ⓀLX4411B
ⒽLX4411B
ⒾLX4411B
INPUT BOX
ⒻセⒺセⒹセ
ⒸセⒶセ Ⓑセ
ⒽセⒾセ ⓀセⒿセ
Ⓜセ
1-1. System Configuration1-1. System Configuration1-1. System Configuration1-1. System Configuration

4. 1340.50
7:12
①Switch ON by
manual
②Record the
measurements by
manual.
③Put the data to
Excel files.
1. Took time to press the manufacturing cost.
2. Couldn’t set additional points to measure.
3. Evaluation Accuracy couldn’t be increased any more due to the restriction
of measurement points.
Life Cycle
Evaluation System
1-2. Issue Analysis1-2. Issue Analysis1-2. Issue Analysis1-2. Issue Analysis

5. 設備別 負荷率一覧
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設備負荷率 （％）
10月度 実績 11月度 実績 12月度 計画 1月度 計画 2月度 計画 3月度 計画
OverviewOverview
1. Lot Management possibly reduced the yield of whole process
2. Manual/Labor works took time than the proper level on labor cost.
3. Prober Equipment Capacity was close to 100%.
Most Heavily Loaded in
Process
1-2A. Issue Analysis before carried out Development1-2A. Issue Analysis before carried out Development1-2A. Issue Analysis before carried out Development1-2A. Issue Analysis before carried out Development

6. (49086 s ample 1)信頼性
0%
1%
10%
100%
0.1 1 10 100 1000
[min]経過時間
発光強度変化率
実測値
予測値
《 Objective 》
Life Cycle measurement was designed with the
for 1000 minutes(16.7 hours) measurement.
《 Target 》 1) Measurement points’ reduction.
2) Shorten Measurement Time1000min 240min→1000min 240min→
★Method
Evaluation Algorithm designed by Weibulll Distribution
Weibull Distribution: (t)=1-exp(-t m/b)λ ^
Iteration through the equation D=|y(t)- (t)|λ 2
< (=1e-6ε
2 点測定により関数内挿
●Graph
Before
Development
Improved
1-3. Evaluation Algorithm1-3. Evaluation Algorithm1-3. Evaluation Algorithm1-3. Evaluation Algorithm
★Overview

7. 1-4. System Figuration on the monitor1-4. System Figuration on the monitor1-4. System Figuration on the monitor1-4. System Figuration on the monitor
While measurement,
Update expected target.

8. 制御プログラム実装
載せるアプリケーション： VB6 、 LabVIE
Controller I/O: 2 Analogue Inputs
2 Analogue
Load Cell
0-10V/0-80Hz0-38mm/min
Frequency 1 ～ 10Hz
Input: Crystal weight via Road Cell 《 CCD Camera Vision 》
Output: Inverter 0-10V/0-80Hz
Pull up speed, motor driver, 0-xxV/0-38mm/min
Control SpecificationControl Specification
サファイア基板
Ｓｅｅｄ（種）
るつぼ
引上げ速度
引上げ位置
荷重変化
温度
金型
製品引上げ中
2-1. Sapphire Crystal Process Automation2-1. Sapphire Crystal Process Automation2-1. Sapphire Crystal Process Automation2-1. Sapphire Crystal Process Automation

9. production Technologyproduction Technology
centercenter
2-2. Control Algorithm2-2. Control Algorithm2-2. Control Algorithm2-2. Control Algorithm
X [mm]X [mm]
Lim [mm]Lim [mm]
0.800
0.500
0.550
0.600
0.650
0.700
0.750
60- 10 0 10 20 30 40 50
X- RC
Fit Curve
Pw_IN
FitCurve Diff
X- RC相関
0カーソル 5.307261.05926
Weight value RC can be obtained by the following
Equation,
RC(X) ＝ A ･ X2
＋ B ･ X ＋ C ････ (1)
Thus, Derivation of the former Equation can be
Expressed as following,
Lim(X) ＝ K*D{RC(X)}/Dx ＝ K(2A ･ X ＋ B) ････ (2)
2.000
- 0.123
0.250
0.500
0.750
1.000
1.250
1.500
1.750
800 10 20 30 40 50 60 70
X- RC
Line ar Fit Curve
Spe e d
Fixe d Curve
Lim - INV_Pw
0カーソル 5.307261.05926
Velocity
Control Zone
Heat Control
Zone

10. ロット別TEOS膜厚誤差推移（１号機）
-30.0%
-20.0%
-10.0%
0.0%
10.0%
20.0%
30.0%
06-072
06-073
S060220F
EX060224
S060220A
S060221D
S060218F
S060221E
S060220E
S060220D
S060222B
S060221B
S060220B
S060
S060222D
S060222C
S060222E
S060227A
S060227E
S060227F
S060227G
S060227C
S060227B
S060227H
S060227D
S060228I
S060228G
06-078
S060124C
EX060228
S060222F
投入ロット（投入順・過去10日間）
膜厚誤差
0K
10K
20K
30K
40K
50K
60K
平均膜厚誤差 R Total膜厚の先頭
SAW Data Analyze System
Mapping on the surface
- Early detection of failure on tip
Histogram
Surface Data Analyzing
Average on zone and sigma
-Detection of the process
Fluctuation
SAW Evaluation DB
Zone/Tip oriented Analysis
data
Feedback to the equipment
Timesheet management
Data storage
3-1. System Line up3-1. System Line up3-1. System Line up3-1. System Line up
SAW Process Management
Average Value Control
Chart Management
- Failure Detection In Excel
In Access
In LABVIEW