8 reasons to use Bare Die. IC products in die form gives customers a convenient option for small-footprint designs, enabling them to optimize their product designs for limited space and to implement innovative, proprietary packaging solutions.

1. 8Reasons to
use Bare Die
ES Components
108 Pratts Junction Road
Sterling, MA 01564
www.escomponents.com
978-422-7641

2. Undoubtedly,
if you're looking at this
you are thinking about
using Bare Die.

3. But, you are wondering...

4. Why?

5. You want to do it.

6. You want to do it.
You probably need to do it.

7. You want to do it.
You probably need to do it.
But you're not sure why.

8. We're going to share with you
eight reasons to use
Bare Die and explain to you why.

9. ready?

10. okay, here we go.

11. Smaller Size & Weight
Using bare die can allow for reduced board space.
1.

12. Operating Temperature Size
Package thermal characteristics no longer inhibit the performance
of the die or the environments when they can operate.
2.

13. Ruggedness
Direct die attach and wirebond provides protections against high levels of shock and vibrations.
3.

14. Lighter Weight
Smaller designs and higher densities reduce weight and size of your application.
4.

15. More Efficient Performance
Removing extra package interconnect can reduce capacitance and inductance.
5.

16. Reliability
The reduced number of interconnects with die use leads to improved reliability. The typical packaged part
has three connection points per I/O . Compare this with only two for wire bonds.
6.

17. Electrical Performance
The lower inductance and capacitance of bare die is important in analog, RF, and power applications.
faster signal flight time (lower propagation delay) and improved power ground distributions.
7.

18. Hermetically Sealing
Air tight sealed packages can be selected that can be injected with inert gasses.
8.

19. Okay, now take a
deep breath.

20. Let's Recap

21. 8Reasons to
use Bare Die
1. Smaller Size & Weight
2. Operating Temperature Size
3. Ruggedness
4. Lighter Weight
5. More Efficient Performance
6. Reliability
7. Electrical Performance
8. Hermetically Sealing

22. That's a lot to think about.

23. That's a lot to think about.
But here's the good news...

24. Knowing these 8 reasons to use Bare Die
will put you on a path to success.

25. Time to look at your competitors.

26. IC Products In Bare Die Form:
Small-footprint design
Optimize design for limited space
Implement innovative, proprietary packaging solutions

27. Need more help
with Bare Die?

28. All
Support
It's
About
978-422-7641
Call
ES Components
ES Components
108 Pratts Junction Road
Sterling, MA 01564
www.escomponents.com
Click for more information