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Microchannel liquid cooling is a promising techniqu e to handling the high temperature problem of three-dimensional (3D) processors. There have been a few works which made initial attempts to optimize liquid cooling by utilizing non-uniformly distribut ed channels, variable flow rate, wider channels, an d Dynamic Voltage and Frequency Scaling (DVFS) combin ed with thread migration mechanisms. Although these optimizations could be better than a straight forward microchannel liquid cooling design, the coo ling of 3D processors is limited due to design-time and run-time challenges. Moreover, in new technologies, the processor power density is continually increasing a nd this will bring more serious challenges to liqui d cooling.
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Test2
1.
スライドテスト その1
2.
これはタイトル あいうえおかきくけこあいうえおかきくけこあいうえおかき くけこあいうえおかきくけこあいうえおかきくけこ
3.
そしてタイトル2 編集してみた編集してみた編集してみた編集 してみた編集してみた編集してみた編集して みた編集してみた編集してみた編集してみた 編集してみた編集してみた
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